Physics > Applied Physics
[Submitted on 3 Oct 2018]
Title:Fiber to Chip Fusion Splicing for Robust, Low Loss Photonic Packaging
View PDFAbstract:Silicon photonic devices are poised to enter high volume markets such as data-communications, telecommunications, biological sensing, and optical phased arrays; however, permanently attaching a fiber to the photonic chip with high optical efficiency remains a challenge. We present a robust and low-loss packaging technique of permanent optical edge coupling between a fiber and a chip using fusion splicing which is low-cost and scalable to high volume manufacturing. We fuse a SMF-28 cleaved fiber to the chip via CO$_2$ laser and reinforce it with optical adhesive. We demonstrate minimum loss of 1.0dB per-facet with 0.6dB penalty over 160nm bandwidth from 1480nm-1640nm.
Current browse context:
physics.app-ph
Change to browse by:
References & Citations
Bibliographic and Citation Tools
Bibliographic Explorer (What is the Explorer?)
Litmaps (What is Litmaps?)
scite Smart Citations (What are Smart Citations?)
Code, Data and Media Associated with this Article
CatalyzeX Code Finder for Papers (What is CatalyzeX?)
DagsHub (What is DagsHub?)
Gotit.pub (What is GotitPub?)
Papers with Code (What is Papers with Code?)
ScienceCast (What is ScienceCast?)
Demos
Recommenders and Search Tools
Influence Flower (What are Influence Flowers?)
Connected Papers (What is Connected Papers?)
CORE Recommender (What is CORE?)
arXivLabs: experimental projects with community collaborators
arXivLabs is a framework that allows collaborators to develop and share new arXiv features directly on our website.
Both individuals and organizations that work with arXivLabs have embraced and accepted our values of openness, community, excellence, and user data privacy. arXiv is committed to these values and only works with partners that adhere to them.
Have an idea for a project that will add value for arXiv's community? Learn more about arXivLabs.