Showing 1–7 of 7 results for author: Wong, H - P

Improved Gradual Resistive Switching Range and 1000x On/Off Ratio in HfOx RRAM Achieved with a $Ge_2Sb_2Te_5$ Thermal Barrier

Authors: Raisul Islam, Shengjun Qin, Sanchit Deshmukh, Zhouchangwan Yu, Cagil Koroglu, Asir Intisar Khan, Kirstin Schauble, Krishna C. Saraswat, Eric Pop, H. -S. Philip Wong

Abstract: Gradual switching between multiple resistance levels is desirable for analog in-memory computing using resistive random-access memory (RRAM). However, the filamentary switching of $HfO_x$-based conventional RRAM often yields only two stable memory states instead of gradual switching between multiple resistance states. Here, we demonstrate that a thermal barrier of $Ge_2Sb_2Te_5$ (GST) between… ▽ More Gradual switching between multiple resistance levels is desirable for analog in-memory computing using resistive random-access memory (RRAM). However, the filamentary switching of $HfO_x$-based conventional RRAM often yields only two stable memory states instead of gradual switching between multiple resistance states. Here, we demonstrate that a thermal barrier of $Ge_2Sb_2Te_5$ (GST) between $HfO_x$ and the bottom electrode (TiN) enables wider and weaker filaments, by promoting heat spreading laterally inside the $HfO_x$. Scanning thermal microscopy suggests that $HfO_x+GST$ devices have a wider heating region than control devices with only $HfO_x$, indicating the formation of a wider filament. Such wider filaments can have multiple stable conduction paths, resulting in a memory device with more gradual and linear switching. The thermally-enhanced $HfO_x+GST$ devices also have higher on/off ratio ($>10^3$) than control devices ($<10^2$), and a median set voltage lower by approximately 1 V (~35%), with a corresponding reduction of the switching power. Our $HfO_x+GST$ RRAM shows 2x gradual switching range using fast (~ns) identical pulse trains with amplitude less than 2 V. △ Less

Submitted 23 March, 2022; originally announced March 2022.

Toward Low-Temperature Solid-Source Synthesis of Monolayer MoS2

Authors: Alvin Tang, Aravindh Kumar, Marc Jaikissoon, Krishna Saraswat, H. -S. Philip Wong, Eric Pop

Abstract: Two-dimensional (2D) semiconductors have been proposed for heterogeneous integration with existing silicon technology; however, their chemical vapor deposition (CVD) growth temperatures are often too high. Here, we demonstrate direct CVD solid-source precursor synthesis of continuous monolayer (1L) MoS$_2$ films at 560 C in 50 min, within the 450-to-600 C, 2 h thermal budget window required for ba… ▽ More Two-dimensional (2D) semiconductors have been proposed for heterogeneous integration with existing silicon technology; however, their chemical vapor deposition (CVD) growth temperatures are often too high. Here, we demonstrate direct CVD solid-source precursor synthesis of continuous monolayer (1L) MoS$_2$ films at 560 C in 50 min, within the 450-to-600 C, 2 h thermal budget window required for back-end-of-the-line compatibility with modern silicon technology. Transistor measurements reveal on-state current up to ~140 $\mathrm{μA/μm}$ at 1 V drain-to-source voltage for 100 nm channel lengths, the highest reported to date for 1L MoS$_2$ grown below 600 C using solid-source precursors. The effective mobility from transfer length method test structures is $\mathrm{29 \pm 5\ cm^2V^{-1}s^{-1}}$ at $\mathrm{6.1 \times 10^{12}\ cm^{-2}}$ electron density, which is comparable to mobilities reported from films grown at higher temperatures. The results of this work provide a path toward the realization of high-quality, thermal-budget-compatible 2D semiconductors for heterogeneous integration with silicon manufacturing. △ Less

Submitted 4 September, 2021; originally announced September 2021.

Journal ref: ACS Appl. Mater. Interfaces 13, 41866 (2021)

Statistical Analysis of Contacts to Synthetic Monolayer MoS2

Authors: Aravindh Kumar, Alvin Tang, H. -S. Philip Wong, Krishna Saraswat

Abstract: Two-dimensional (2D) semiconductors are promising candidates for scaled transistors because they are immune to mobility degradation at the monolayer limit. However, sub-10 nm scaling of 2D semiconductors, such as MoS2, is limited by the contact resistance. In this work, we show for the first time a statistical study of Au contacts to chemical vapor deposited monolayer MoS2 using transmission line… ▽ More Two-dimensional (2D) semiconductors are promising candidates for scaled transistors because they are immune to mobility degradation at the monolayer limit. However, sub-10 nm scaling of 2D semiconductors, such as MoS2, is limited by the contact resistance. In this work, we show for the first time a statistical study of Au contacts to chemical vapor deposited monolayer MoS2 using transmission line model (TLM) structures, before and after dielectric encapsulation. We report contact resistance values as low as 330 ohm-um, which is the lowest value reported to date. We further study the effect of Al2O3 encapsulation on variability in contact resistance and other device metrics. Finally, we note some deviations in the TLM model for short-channel devices in the back-gated configuration and discuss possible modifications to improve the model accuracy. △ Less

Submitted 20 February, 2022; v1 submitted 16 June, 2021; originally announced June 2021.

Comments: 4 pages, 5 figures, to be published in IEEE IITC 2021 conference proceedings; fixed labels in Fig 4(b) and removed blank page at the end

Scaling Theory of Two-Dimensional Field Effect Transistors

Authors: Saurabh V. Suryavanshi, Chris D. English, H. -S. P. Wong, Eric Pop

Abstract: We present a scaling theory of two-dimensional (2D) field effect transistors (FETs). For devices with channel thickness less than 4 nm, the device electrostatics is dominated by the physical gate oxide thickness and not the effective oxide thickness. Specifically, for symmetric double gate (DG) FETs the scale length (Λ) varies linearly with the gate oxide thickness(t_{ox}) as Λ ~ 3/4t_{ox}. The ga… ▽ More We present a scaling theory of two-dimensional (2D) field effect transistors (FETs). For devices with channel thickness less than 4 nm, the device electrostatics is dominated by the physical gate oxide thickness and not the effective oxide thickness. Specifically, for symmetric double gate (DG) FETs the scale length (Λ) varies linearly with the gate oxide thickness(t_{ox}) as Λ ~ 3/4t_{ox}. The gate oxide dielectric permittivity and the semiconductor channel thickness do not affect the device electrostatics for such device geometries. For an asymmetric device such as single gate (SG) FETs, the fringing fields have a second order effect on the scale length. However, like symmetric DG FETs, the scale length in asymmetric FETs is also ultimately limited by the physical gate oxide thickness. We compare our theoretical predictions for scaled monolayer MoS2 DG FETs. △ Less

Submitted 22 May, 2021; originally announced May 2021.

Electrical Tuning of Phase Change Antennas and Metasurfaces

Authors: Yifei Wang, Patrick Landreman, David Schoen, Kye Okabe, Ann Marshall, Umberto Celano, H. -S. Philip Wong, Junghyun Park, Mark L. Brongersma

Abstract: The success of semiconductor electronics is built on the creation of compact, low-power switching elements that offer routing, logic, and memory functions. The availability of nanoscale optical switches could have a similarly transformative impact on the development of dynamic and programmable metasurfaces, optical neural networks, and quantum information processing. Phase change materials are uni… ▽ More The success of semiconductor electronics is built on the creation of compact, low-power switching elements that offer routing, logic, and memory functions. The availability of nanoscale optical switches could have a similarly transformative impact on the development of dynamic and programmable metasurfaces, optical neural networks, and quantum information processing. Phase change materials are uniquely suited to enable their creation as they offer high-speed electrical switching between amorphous and crystalline states with notably different optical properties. Their high refractive index has also been harnessed to fashion them into compact optical antennas. Here, we take the next important step by realizing electrically-switchable phase change antennas and metasurfaces that offer strong, reversible, non-volatile, multi-phase switching and spectral tuning of light scattering in the visible and near-infrared spectral ranges. Their successful implementation relies on a careful joint thermal and optical optimization of the antenna elements that comprise an Ag strip that simultaneously serves as a plasmonic resonator and a miniature heating stage. △ Less

Submitted 28 August, 2020; originally announced August 2020.

Comments: 14 pages, 4 figures

Report number: Nature Nanotechnology 16.6 (2021): 667-672

Engineering Thermal and Electrical Interface Properties of Phase Change Memory with Monolayer MoS2

Authors: Christopher M. Neumann, Kye L. Okabe, Eilam Yalon, Ryan W. Grady, H. -S. Philip Wong, Eric Pop

Abstract: Phase change memory (PCM) is an emerging data storage technology, however its programming is thermal in nature and typically not energy-efficient. Here we reduce the switching power of PCM through the combined approaches of filamentary contacts and thermal confinement. The filamentary contact is formed through an oxidized TiN layer on the bottom electrode, and thermal confinement is achieved using… ▽ More Phase change memory (PCM) is an emerging data storage technology, however its programming is thermal in nature and typically not energy-efficient. Here we reduce the switching power of PCM through the combined approaches of filamentary contacts and thermal confinement. The filamentary contact is formed through an oxidized TiN layer on the bottom electrode, and thermal confinement is achieved using a monolayer semiconductor interface, three-atom thick MoS2. The former reduces the switching volume of the phase change material and yields a 70% reduction in reset current versus typical 150 nm diameter mushroom cells. The enhanced thermal confinement achieved with the ultra-thin (~6 Å) MoS2 yields an additional 30% reduction in switching current and power. We also use detailed simulations to show that further tailoring the electrical and thermal interfaces of such PCM cells toward their fundamental limits could lead up to a six-fold benefit in power efficiency. △ Less

Submitted 1 March, 2019; originally announced March 2019.

An integrated capacitance bridge for high-resolution, wide temperature range quantum capacitance measurements

Authors: Joseph A. Sulpizio, Arash Hazeghi, Georgi Diankov, David Goldhaber-Gordon, H. -S. Philip Wong

Abstract: We have developed a highly-sensitive integrated capacitance bridge for quantum capacitance measurements. Our bridge, based on a GaAs HEMT amplifier, delivers attofarad (aF) resolution using a small AC excitation at or below kT over a broad temperature range (4K-300K). We have achieved a resolution at room temperature of 10aF per root Hz for a 10mV AC excitation at 17.5 kHz, with improved resolutio… ▽ More We have developed a highly-sensitive integrated capacitance bridge for quantum capacitance measurements. Our bridge, based on a GaAs HEMT amplifier, delivers attofarad (aF) resolution using a small AC excitation at or below kT over a broad temperature range (4K-300K). We have achieved a resolution at room temperature of 10aF per root Hz for a 10mV AC excitation at 17.5 kHz, with improved resolution at cryogenic temperatures, for the same excitation amplitude. We demonstrate the performance of our capacitance bridge by measuring the quantum capacitance of top-gated graphene devices and comparing against results obtained with the highest resolution commercially-available capacitance measurement bridge. Under identical test conditions, our bridge exceeds the resolution of the commercial tool by up to several orders of magnitude. △ Less

Submitted 27 September, 2010; originally announced September 2010.

Comments: (1)AH and JAS contributed equally to this work. 6 pages, 5 figures