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Manufacturing low dissipation superconducting quantum processors
Authors:
Ani Nersisyan,
Stefano Poletto,
Nasser Alidoust,
Riccardo Manenti,
Russ Renzas,
Cat-Vu Bui,
Kim Vu,
Tyler Whyland,
Yuvraj Mohan,
Eyob A. Sete,
Sam Stanwyck,
Andrew Bestwick,
Matthew Reagor
Abstract:
Enabling applications for solid state quantum technology will require systematically reducing noise, particularly dissipation, in these systems. Yet, when multiple decay channels are present in a system with similar weight, resolution to distinguish relatively small changes is necessary to infer improvements to noise levels. For superconducting qubits, uncontrolled variation of nominal performance…
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Enabling applications for solid state quantum technology will require systematically reducing noise, particularly dissipation, in these systems. Yet, when multiple decay channels are present in a system with similar weight, resolution to distinguish relatively small changes is necessary to infer improvements to noise levels. For superconducting qubits, uncontrolled variation of nominal performance makes obtaining such resolution challenging. Here, we approach this problem by investigating specific combinations of previously reported fabrication techniques on the quality of 242 thin film superconducting resonators and qubits. Our results quantify the influence of elementary processes on dissipation at key interfaces. We report that an end-to-end optimization of the manufacturing process that integrates multiple small improvements together can produce an average ${\overline{T}_{1}=76\pm13~μ}$s across 24 qubits with the best qubits having ${T_1\geq110~μ}$s. Moreover, our analysis places bounds on energy decay rates for three fabrication-related loss channels present in state-of-the-art superconducting qubits. Understanding dissipation through such systematic analysis may pave the way for lower noise solid state quantum computers.
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Submitted 23 January, 2019;
originally announced January 2019.
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Superconducting Through-Silicon Vias for Quantum Integrated Circuits
Authors:
Mehrnoosh Vahidpour,
William O'Brien,
Jon Tyler Whyland,
Joel Angeles,
Jayss Marshall,
Diego Scarabelli,
Genya Crossman,
Kamal Yadav,
Yuvraj Mohan,
Catvu Bui,
Vijay Rawat,
Russ Renzas,
Nagesh Vodrahalli,
Andrew Bestwick,
Chad Rigetti
Abstract:
We describe a microfabrication process for superconducting through-silicon vias appropriate for use in superconducting qubit quantum processors. With a sloped-wall via geometry, we can use non-conformal metal deposition methods such as electron-beam evaporation and sputtering, which reliably deposit high quality superconducting films. Via superconductivity is validated by demonstrating zero via-to…
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We describe a microfabrication process for superconducting through-silicon vias appropriate for use in superconducting qubit quantum processors. With a sloped-wall via geometry, we can use non-conformal metal deposition methods such as electron-beam evaporation and sputtering, which reliably deposit high quality superconducting films. Via superconductivity is validated by demonstrating zero via-to-via resistance below the critical temperature of aluminum.
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Submitted 7 August, 2017;
originally announced August 2017.
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Superconducting Caps for Quantum Integrated Circuits
Authors:
William O'Brien,
Mehrnoosh Vahidpour,
Jon Tyler Whyland,
Joel Angeles,
Jayss Marshall,
Diego Scarabelli,
Genya Crossman,
Kamal Yadav,
Yuvraj Mohan,
Catvu Bui,
Vijay Rawat,
Russ Renzas,
Nagesh Vodrahalli,
Andrew Bestwick,
Chad Rigetti
Abstract:
We report on the fabrication and metrology of superconducting caps for qubit circuits. As part of a 3D quantum integrated circuit architecture, a cap chip forms the upper half of an enclosure that provides isolation, increases vacuum participation ratio, and improves performance of individual resonant elements. Here, we demonstrate that such caps can be reliably fabricated, placed on a circuit chi…
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We report on the fabrication and metrology of superconducting caps for qubit circuits. As part of a 3D quantum integrated circuit architecture, a cap chip forms the upper half of an enclosure that provides isolation, increases vacuum participation ratio, and improves performance of individual resonant elements. Here, we demonstrate that such caps can be reliably fabricated, placed on a circuit chip, and form superconducting connections to the circuit.
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Submitted 7 August, 2017;
originally announced August 2017.
