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Patterning Sn-based EUV resists with low-energy electrons
Authors:
Ivan Bespalov,
Yu Zhang,
Jarich Haitjema,
Rudolf M. Tromp,
Sense Jan van der Molen,
Albert M. Brouwer,
Johannes Jobst,
Sonia Castellanos
Abstract:
Extreme Ultraviolet (EUV) lithography is the newest technology that will be used in the semiconductor industry for printing circuitry in the sub-20 nm scale. Low-energy electrons (LEEs) produced upon illumination of resist materials with EUV photons (92 eV) play a central role in the formation of the nanopatterns. However, up to now the details of this process are not well understood. In this work…
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Extreme Ultraviolet (EUV) lithography is the newest technology that will be used in the semiconductor industry for printing circuitry in the sub-20 nm scale. Low-energy electrons (LEEs) produced upon illumination of resist materials with EUV photons (92 eV) play a central role in the formation of the nanopatterns. However, up to now the details of this process are not well understood. In this work, a novel experimental approach that combines Low-Energy Electron Microscopy (LEEM), Electron Energy Loss Spectroscopy (EELS), and Atomic Force Microscopy (AFM) is used to study changes induced by electrons in the 0-40 eV range in thin films of molecular organometallic EUV resists known as tin-oxo cages. LEEM-EELS spectroscopic experiments were used to detect surface charging upon electron exposure and to estimate the electron landing energy. AFM post-exposure analyses revealed that irradiation of the resist with LEEs leads to the densification of the resist layer associated to carbon loss. The same chemical processes that yield densification render the solubility change responsible for the pattern formation in the lithographic application. Remarkably, electrons as low as 1.2 eV are able to induce chemical reactions in the Sn-based resist. Based on the thickness profiles resulting from LEE exposures in the 3-48 mC/cm 2 dose range, a simplified reaction model is proposed where the resist undergoes sequential chemical reactions, yielding first a sparsely cross-linked network, followed by the formation of a denser cross-linked network. This model allows us to estimate a maximum reaction volume on the initial material of 0.15 nm 3 per incident electron in the energy range studied, which means that less than 10 LEEs per molecule on average are needed to turn the material insoluble and thus render a pattern.
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Submitted 6 October, 2019;
originally announced October 2019.
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Quantitative analysis of spectroscopic Low Energy Electron Microscopy data: High-dynamic range imaging, drift correction and cluster analysis
Authors:
Tobias A. de Jong,
David N. L. Kok,
Alexander J. H. van der Torren,
Henrik Schopmans,
Rudolf M. Tromp,
Sense Jan van der Molen,
Johannes Jobst
Abstract:
For many complex materials systems, low-energy electron microscopy (LEEM) offers detailed insights into morphology and crystallography by naturally combining real-space and reciprocal-space information. Its unique strength, however, is that all measurements can easily be performed energy-dependently. Consequently, one should treat LEEM measurements as multi-dimensional, spectroscopic datasets rath…
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For many complex materials systems, low-energy electron microscopy (LEEM) offers detailed insights into morphology and crystallography by naturally combining real-space and reciprocal-space information. Its unique strength, however, is that all measurements can easily be performed energy-dependently. Consequently, one should treat LEEM measurements as multi-dimensional, spectroscopic datasets rather than as images to fully harvest this potential. Here we describe a measurement and data analysis approach to obtain such quantitative spectroscopic LEEM datasets with high lateral resolution. The employed detector correction and adjustment techniques enable measurement of true reflectivity values over four orders of magnitudes of intensity. Moreover, we show a drift correction algorithm, tailored for LEEM datasets with inverting contrast, that yields sub-pixel accuracy without special computational demands. Finally, we apply dimension reduction techniques to summarize the key spectroscopic features of datasets with hundreds of images into two single images that can easily be presented and interpreted intuitively. We use cluster analysis to automatically identify different materials within the field of view and to calculate average spectra per material. We demonstrate these methods by analyzing bright-field and dark-field datasets of few-layer graphene grown on silicon carbide and provide a high-performance Python implementation.
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Submitted 31 July, 2019;
originally announced July 2019.
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Intrinsic Instability of Aberration-Corrected Electron Microscopes
Authors:
S. M. Schramm,
S. J. van der Molen,
R. M. Tromp
Abstract:
Aberration-corrected microscopes with sub-atomic resolution will impact broad areas of science and technology. However, the experimentally observed lifetime of the corrected state is just a few minutes. Here we show that the corrected state is intrinsically unstable; the higher its quality, the more unstable it is. Analyzing the Contrast Transfer Function near optimum correction, we define an 'ins…
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Aberration-corrected microscopes with sub-atomic resolution will impact broad areas of science and technology. However, the experimentally observed lifetime of the corrected state is just a few minutes. Here we show that the corrected state is intrinsically unstable; the higher its quality, the more unstable it is. Analyzing the Contrast Transfer Function near optimum correction, we define an 'instability budget' which allows a rational trade-off between resolution and stability. Unless control systems are developed to overcome these challenges, intrinsic instability poses a fundamental limit to the resolution practically achievable in the electron microscope.
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Submitted 21 September, 2012;
originally announced September 2012.
