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Measurements of time resolution of the RD50-MPW2 DMAPS prototype using TCT and $^{90}\mathrm{Sr}$
Authors:
J. Debevc,
M. Franks,
B. Hiti,
U. Kraemer,
G. Kramberger,
I. Mandić,
R. Marco-Hernández,
D. J. L. Nobels,
S. Powell,
J. Sonneveld,
H. Steininger,
C. Tsolanta,
E. Vilella,
C. Zhang
Abstract:
Results in this paper present an in-depth study of time resolution for active pixels of the RD50-MPW2 prototype CMOS particle detector. Measurement techniques employed include Backside- and Edge-TCT configurations, in addition to electrons from a $^{90}\mathrm{Sr}$ source. A sample irradiated to $5\cdot 10^{14}\,\mathrm{n}_\mathrm{eq}/\mathrm{cm}^2$ was used to study the effect of radiation damage…
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Results in this paper present an in-depth study of time resolution for active pixels of the RD50-MPW2 prototype CMOS particle detector. Measurement techniques employed include Backside- and Edge-TCT configurations, in addition to electrons from a $^{90}\mathrm{Sr}$ source. A sample irradiated to $5\cdot 10^{14}\,\mathrm{n}_\mathrm{eq}/\mathrm{cm}^2$ was used to study the effect of radiation damage. Timing performance was evaluated for the entire pixel matrix and with positional sensitivity within individual pixels as a function of the deposited charge. Time resolution obtained with TCT is seen to be uniform throughout the pixel's central region with approx. $220\,\mathrm{ps}$ at $12\,\mathrm{ke}^-$ of deposited charge, degrading at the edges and lower values of deposited charge. $^{90}\mathrm{Sr}$ measurements show a slightly worse time resolution as a result of delayed events coming from the peripheral areas of the pixel.
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Submitted 25 January, 2024; v1 submitted 4 December, 2023;
originally announced December 2023.
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Readout system and testbeam results of the RD50-MPW2 HV-CMOS pixel chip
Authors:
Patrick Sieberer,
Thomas Bergauer,
Klemens Floeckner,
Christian Irmler,
Helmut Steininger
Abstract:
The RD50-CMOS group aims to design and study High Voltage CMOS (HVCMOS) chips for use in a high radiation environment. Currently, measurements are performed on RD50-MPW2 chip, the second prototype developed by this group. The active matrix of the prototype consists of 8x8 pixels with analog front end. Details of the analog front end and simulations have been already published earlier. This contrib…
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The RD50-CMOS group aims to design and study High Voltage CMOS (HVCMOS) chips for use in a high radiation environment. Currently, measurements are performed on RD50-MPW2 chip, the second prototype developed by this group. The active matrix of the prototype consists of 8x8 pixels with analog front end. Details of the analog front end and simulations have been already published earlier. This contribution focuses on the Caribou based readout system of the active matrix. Each pixel of the active matrix can be readout one after the other. Relevant aspects of hardware, firmware and software are introduced. As a first stage, firmware for a standalone setup is introduced and details on data flow are given. Afterwards, a second stage of the firmware capable of synchronizing with other detectors and accepting triggers is presented, focusing on operation of the chip in combination with a tracking telescope to measure efficiency and residuals.
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Submitted 9 December, 2022; v1 submitted 21 January, 2022;
originally announced January 2022.
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Study of neutron irradiation effects in Depleted CMOS detector structures
Authors:
I. Mandić,
V. Cindro,
J. Debevc,
A. Gorišek,
B. Hiti,
G. Kramberger,
P. Skomina,
M. Zavrtanik,
M. Mikuž,
E. Vilella,
C. Zhang,
S. Powell,
M. Franks,
R. Marco-Hernandez,
H. Steininger
Abstract:
In this paper results of Edge-TCT and I-V measurements with passive test structures made in LFoundry 150 nm HV-CMOS process on p-type substrates with different initial resistivities ranging from 0.5 to 3 k$Ω$cm are presented. Samples were irradiated with reactor neutrons up to a fluence of 2$\cdot$10$^{15}$ n$_{\mathrm{eq}}$/cm$^2$. Depletion depth was measured with Edge-TCT. Effective space charg…
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In this paper results of Edge-TCT and I-V measurements with passive test structures made in LFoundry 150 nm HV-CMOS process on p-type substrates with different initial resistivities ranging from 0.5 to 3 k$Ω$cm are presented. Samples were irradiated with reactor neutrons up to a fluence of 2$\cdot$10$^{15}$ n$_{\mathrm{eq}}$/cm$^2$. Depletion depth was measured with Edge-TCT. Effective space charge concentration $N_{\mathrm{eff}}$ was estimated from the dependence of depletion depth on bias voltage and studied as a function of neutron fluence. Dependence of $N_{\mathrm{eff}}$ on fluence changes with initial acceptor concentration in agreement with other measurements with p-type silicon. Long term accelerated annealing study of $N_{\mathrm{eff}}$ and detector current up to 1280 minutes at 60$^\circ$C was made. It was found that $N_{\mathrm{eff}}$ and current in reverse biased detector behaves as expected for irradiated silicon.
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Submitted 15 February, 2022; v1 submitted 20 December, 2021;
originally announced December 2021.
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Characterisation of analogue front end and time walk in CMOS active pixel sensor
Authors:
B. Hiti,
V. Cindro,
A. Gorišek,
M. Franks,
R. Marco-Hernández,
G. Kramberger,
I. Mandić,
M. Mikuž,
S. Powell,
H. Steininger,
E. Vilella,
M. Zavrtanik,
C. Zhang
Abstract:
In this work we investigated a method to determine time walk in an active silicon pixel sensor prototype using Edge-TCT with infrared laser charge injection. Samples were investigated before and after neutron irradiation to 5e14 neq/cm2. Threshold, noise and calibration of the analogue front end were determined with external charge injection. A spatially sensitive measurement of collected charge a…
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In this work we investigated a method to determine time walk in an active silicon pixel sensor prototype using Edge-TCT with infrared laser charge injection. Samples were investigated before and after neutron irradiation to 5e14 neq/cm2. Threshold, noise and calibration of the analogue front end were determined with external charge injection. A spatially sensitive measurement of collected charge and time walk was carried out with Edge-TCT, showing a uniform charge collection and output delay in pixel centre. On pixel edges charge sharing was observed due to finite beam width resulting in smaller signals and larger output delay. Time walk below 25 ns was observed for charge above 2000 electrons at a threshold above the noise level. Time walk measurement with external charge injection yielded identical results.
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Submitted 23 November, 2021; v1 submitted 11 October, 2021;
originally announced October 2021.
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Test Beam Performance Measurements for the Phase I Upgrade of the CMS Pixel Detector
Authors:
M. Dragicevic,
M. Friedl,
J. Hrubec,
H. Steininger,
A. Gädda,
J. Härkönen,
T. Lampén,
P. Luukka,
T. Peltola,
E. Tuominen,
E. Tuovinen,
A. Winkler,
P. Eerola,
T. Tuuva,
G. Baulieu,
G. Boudoul,
L. Caponetto,
C. Combaret,
D. Contardo,
T. Dupasquier,
G. Gallbit,
N. Lumb,
L. Mirabito,
S. Perries,
M. Vander Donckt
, et al. (462 additional authors not shown)
Abstract:
A new pixel detector for the CMS experiment was built in order to cope with the instantaneous luminosities anticipated for the Phase~I Upgrade of the LHC. The new CMS pixel detector provides four-hit tracking with a reduced material budget as well as new cooling and powering schemes. A new front-end readout chip mitigates buffering and bandwidth limitations, and allows operation at low comparator…
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A new pixel detector for the CMS experiment was built in order to cope with the instantaneous luminosities anticipated for the Phase~I Upgrade of the LHC. The new CMS pixel detector provides four-hit tracking with a reduced material budget as well as new cooling and powering schemes. A new front-end readout chip mitigates buffering and bandwidth limitations, and allows operation at low comparator thresholds. In this paper, comprehensive test beam studies are presented, which have been conducted to verify the design and to quantify the performance of the new detector assemblies in terms of tracking efficiency and spatial resolution. Under optimal conditions, the tracking efficiency is $99.95\pm0.05\,\%$, while the intrinsic spatial resolutions are $4.80\pm0.25\,μ\mathrm{m}$ and $7.99\pm0.21\,μ\mathrm{m}$ along the $100\,μ\mathrm{m}$ and $150\,μ\mathrm{m}$ pixel pitch, respectively. The findings are compared to a detailed Monte Carlo simulation of the pixel detector and good agreement is found.
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Submitted 1 June, 2017;
originally announced June 2017.
