Hydrogen plasma inhibits ion beam restructuring of materials
Authors:
John A. Scott,
James Bishop,
Garrett Budnik,
Milos Toth
Abstract:
Focused ion beam (FIB) techniques are employed widely for nanofabrication, and processing of materials and devices. However, ion irradiation often gives rise to severe damage due to atomic displacements that cause defect formation, migration and clustering within the ion-solid interaction volume. The resulting restructuring degrades the functionality of materials, and limits the utility FIB ablati…
▽ More
Focused ion beam (FIB) techniques are employed widely for nanofabrication, and processing of materials and devices. However, ion irradiation often gives rise to severe damage due to atomic displacements that cause defect formation, migration and clustering within the ion-solid interaction volume. The resulting restructuring degrades the functionality of materials, and limits the utility FIB ablation and nanofabrication techniques. Here we show that such restructuring can be inhibited by performing FIB irradiation in a hydrogen plasma environment via chemical pathways that modify defect binding energies and transport kinetics, as well as material ablation rates. The method is minimally-invasive and has the potential to greatly expand the utility of FIB nanofabrication techniques in processing of functional materials and devices.
△ Less
Submitted 17 April, 2024;
originally announced April 2024.
Suppression of surface roughening during ion bombardment of semiconductors
Authors:
John A. Scott,
James Bishop,
Milos Toth
Abstract:
Ion beams are used routinely for processing of semiconductors, particularly sputtering, ion implantation and direct-write fabrication of nanostructures. However, the utility of ion beam techniques is limited by crystal damage and surface roughening. Damage can be reduced or eliminated by performing irradiation at elevated temperatures. However, at these conditions, surface roughening is highly pro…
▽ More
Ion beams are used routinely for processing of semiconductors, particularly sputtering, ion implantation and direct-write fabrication of nanostructures. However, the utility of ion beam techniques is limited by crystal damage and surface roughening. Damage can be reduced or eliminated by performing irradiation at elevated temperatures. However, at these conditions, surface roughening is highly problematic due to thermal mobility of adatoms and surface vacancies. Here we solve this problem using hydrogen gas, which we use to stabilize surface mass flow and suppress roughening during ion bombardment of elemental and compound semiconductors. We achieve smooth surfaces during ion-beam processing, and show that the method can be enhanced by radicalizing H2 gas using a remote plasma source. Our approach is broadly applicable, and expands the utility of ion beam techniques for the processing and fabrication of functional materials and nanostructures.
△ Less
Submitted 19 September, 2022; v1 submitted 29 May, 2022;
originally announced May 2022.
