Nanodevice-Enabled Near-Field Thermal Radiation between Sub-Wavelength Surfaces
Authors:
Xiao Luo,
Hakan Salihoglu,
Zexiao Wang,
Zhuo Li,
Hyeonggyun Kim,
Jiayu Li,
Bowen Yu,
Shen Du,
Sheng Shen
Abstract:
With the continuous advancement of nanotechnology, nanodevices have become crucial components in computing, sensing and energy conversion applications. However, the structures of nanodevices typically possess sub-wavelength dimensions and separations, which pose significant challenges for understanding energy transport phenomena in nanodevices. Here, based on a judiciously designed thermal nanodev…
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With the continuous advancement of nanotechnology, nanodevices have become crucial components in computing, sensing and energy conversion applications. However, the structures of nanodevices typically possess sub-wavelength dimensions and separations, which pose significant challenges for understanding energy transport phenomena in nanodevices. Here, based on a judiciously designed thermal nanodevice, we report the first measurement of near-field energy transport between two coplanar sub-wavelength structures over temperature bias up to ~190 K. Our experimental results demonstrate a remarkable 20-fold enhancement in heat transfer beyond blackbody radiation. In contrast with the well-established near-field interactions between two semi-infinite bodies, the sub-wavelength confinements in nanodevices lead to the increased polariton scattering and the reduction of supporting modes and therefore a lower heat flow at a given separation. Our work unveils exciting opportunities for the rational design of nanodevices, particularly for on-chip near-field energy transport, with important implications for the development of efficient nanodevices for energy harvesting and thermal management.
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Submitted 25 August, 2023;
originally announced August 2023.
Accurate Direct Measurements of Far-Field Thermal Infrared Emission and its Dynamics
Authors:
Xiu Liu,
Hakan Salihoglu,
Xiao Luo,
Hyeong Seok Yun,
Lin **g,
Bowen Yu,
Sheng Shen
Abstract:
Accurate direct measurements of far-field thermal infrared emission become increasingly important because conventional methods, relying on indirect assessments, such as reflectance/transmittance, are inaccurate or even unfeasible to characterize state-of-art devices with novel spectra, directionalities, and polarizations. The direct collection of the far-field emission from these tiny devices is a…
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Accurate direct measurements of far-field thermal infrared emission become increasingly important because conventional methods, relying on indirect assessments, such as reflectance/transmittance, are inaccurate or even unfeasible to characterize state-of-art devices with novel spectra, directionalities, and polarizations. The direct collection of the far-field emission from these tiny devices is also challenging because of their shrinking footprints and uncontrollable radiation noises from their surroundings. Here, we demonstrate a microscopic lock-in FTIR system that realizes significant improvement in signal-to-noise ratio (SNR) by combining a microscope and a lock-in amplifier with an FTIR. The lock-in FTIR is ultrasensitive, with a specific detectivity 10^6 times higher than commercial ones, to overcome the optical loss and background noise during the emission light collection. Based on an analytical model of the signal detection process, we also explore the combination of modulated Joule heating and global heating to fulfill the potential of our system for noise reduction. Our findings show that, compared to previous studies, more than 3 times lower temperatures are sufficient to generate a measurable signal. Under a heating temperature of around 125 °C, we can achieve an SNR of about 23.7, which is far above the true-signal-threshold (SNR of about 3.0). Furthermore, the system can respond fast enough (up to 175kHz) to record spectral-resolved dynamics of microdevices in the frequency domain. The measurable frequency range can be extended up to MHz or even GHz level by a high-speed circuit model. We believe the system together with the analytical signal processing can be beneficial for next-generation thermal infrared material and device exploration, boosting the applications in lighting, sensing, imaging, and energy harvesting on a small scale.
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Submitted 22 September, 2022; v1 submitted 25 August, 2022;
originally announced September 2022.
