Showing 1–7 of 7 results for author: Ranno, L

Scalable single-microring hybrid III-V/Si lasers for emerging narrow-linewidth applications

Authors: Jiawei Wang, Xiang Li, Xin Guo, Ter-Hoe Loh, Luigi Ranno, Chongyang Liu, Rusli, Hong Wang, Jia Xu Brian Sia

Abstract: Silicon photonics, compatible with large-scale silicon manufacturing, is a disruptive photonic platform that has indicated significant implications in industry and research areas (e.g., quantum, neuromorphic computing, LiDAR). Cutting-edge applications such as high-capacity coherent optical communication and heterodyne LiDAR have escalated the demand for integrated narrow-linewidth laser sources.… ▽ More Silicon photonics, compatible with large-scale silicon manufacturing, is a disruptive photonic platform that has indicated significant implications in industry and research areas (e.g., quantum, neuromorphic computing, LiDAR). Cutting-edge applications such as high-capacity coherent optical communication and heterodyne LiDAR have escalated the demand for integrated narrow-linewidth laser sources. To that effect, this work seeks to address this requirement through the development of a high-performance hybrid III-V/silicon laser. The developed integrated laser, utilizes a single microring resonator (MRR), demonstrating single-mode operation with a side mode suppression ratio (SMSR) exceeding 40 dB, with laser output power as high as 16.4 mW. Moving away from current hybrid/heterogeneous laser architectures that necessitate multiple complex control, the developed laser architecture requires only two control parameters. Importantly, this serves to streamline industrial adoption by reducing the complexity involved in characterizing these lasers, at-scale. Through the succinct structure and control framework, a narrow laser linewidth of 2.79 kHz and low relative intensity noise (RIN) of -135 dB/Hz are achieved. Furthermore, optical data transmission at 12.5 Gb/s is demonstrated where a signal-to-noise ratio (SNR) of 10 dB is measured. △ Less

Submitted 14 May, 2024; originally announced May 2024.

Comments: 11 pages, 8 figures

Highly-efficient fiber to Si-waveguide free-form coupler for foundry-scale silicon photonics

Authors: Luigi Ranno, Jia Xu Brian Sia, Cosmin Popescu, Drew Weninger, Samuel Serna, Shaoliang Yu, Lionel C. Kimerling, Anuradha Agarwal, Tian Gu, Juejun Hu

Abstract: As silicon photonics transitions from research to commercial deployment, packaging solutions that efficiently couple light into highly-compact and functional sub-micron silicon waveguides are imperative but remain challenging. The 220 nm silicon-on-insulator (SOI) platform, poised to enable large-scale integration, is the most widely adopted by foundries, resulting in established fabrication proce… ▽ More As silicon photonics transitions from research to commercial deployment, packaging solutions that efficiently couple light into highly-compact and functional sub-micron silicon waveguides are imperative but remain challenging. The 220 nm silicon-on-insulator (SOI) platform, poised to enable large-scale integration, is the most widely adopted by foundries, resulting in established fabrication processes and extensive photonic component libraries. The development of a highly-efficient, scalable and broadband coupling scheme for this platform is therefore of paramount importance. Leveraging two-photon polymerization (TPP) and a deterministic free-form micro-optics design methodology based on the Fermat's principle, this work demonstrates an ultra-efficient and broadband 3-D coupler interface between standard SMF-28 single-mode fibers and silicon waveguides on the 220 nm SOI platform. The coupler achieves a low coupling loss of 0.8 dB for fundamental TE mode, along with 1-dB bandwidth exceeding 180 nm. The broadband operation enables diverse bandwidth-driven applications ranging from communications to spectroscopy. Furthermore, the 3-D free-form coupler also enables large tolerance to fiber misalignments and manufacturing variability, thereby relaxing packaging requirements towards cost reduction capitalizing on standard electronic packaging process flows. △ Less

Submitted 20 December, 2023; originally announced December 2023.

Crown ether decorated silicon photonics for safeguarding against lead poisoning

Authors: Luigi Ranno, Yong Zen Tan, Chi Siang Ong, Xin Guo, Khong Nee Koo, Xiang Li, Wanjun Wang, Samuel Serna, Chongyang Liu, Rusli, Callum G. Littlejohns, Graham T. Reed, Juejun Hu, Hong Wang, Jia Xu Brian Sia

Abstract: Lead (Pb2+) toxification in society is one of the most concerning public health crisis that remains unaddressed. The exposure to Pb2+ poisoning leads to a multitude of enduring health issues, even at the part-per-billion scale (ppb). Yet, public action dwarfs its impact. Pb2+ poisoning is estimated to account for 1 million deaths per year globally, which is in addition to its chronic impact on chi… ▽ More Lead (Pb2+) toxification in society is one of the most concerning public health crisis that remains unaddressed. The exposure to Pb2+ poisoning leads to a multitude of enduring health issues, even at the part-per-billion scale (ppb). Yet, public action dwarfs its impact. Pb2+ poisoning is estimated to account for 1 million deaths per year globally, which is in addition to its chronic impact on children. With their ring-shaped cavities, crown ethers are uniquely capable of selectively binding to specific ions. In this work, for the first time, the synergistic integration of highly-scalable silicon photonics, with crown ether amine conjugation via Fischer esterification in an environmentally-friendly fashion is demonstrated. This realises a photonic platform that enables the in-situ, highly-selective and quantitative detection of various ions. The development dispels the existing notion that Fischer esterification is restricted to organic compounds, laying the ground for subsequent amine conjugation for various crown ethers. In this work, the platform is engineered for Pb2+ detection, demonstrating a large dynamic detection range of 1 - 262000 ppb with high selectivity against a wide range of relevant ions. These results indicate the potential for the pervasive implementation of the technology to safeguard against ubiquitous lead poisoning in our society. △ Less

Submitted 31 October, 2023; originally announced November 2023.

An Open-Source Multi-functional Testing Platform for Optical Phase Change Materials

Authors: Cosmin-Constantin Popescu, Khoi Phuong Dao, Luigi Ranno, Brian Mills, Louis Martin, Yifei Zhang, David Bono. Brian Neltner, Tian Gu, Juejun Hu, Kiumars Aryana, William M. Humphreys, Hyun Jung Kim, Steven Vitale, Paul Miller, Christopher Roberts, Sarah Geiger, Dennis Callahan, Michael Moebius, Myungkoo Kang, Kathleen Richardson, Carlos A. Ríos Ocampo

Abstract: Owing to their unique tunable optical properties, chalcogenide phase change materials are increasingly being investigated for optics and photonics applications. However, in situ characterization of their phase transition characteristics is a capability that remains inaccessible to many researchers. In this article, we introduce a multi-functional silicon microheater platform capable of in situ mea… ▽ More Owing to their unique tunable optical properties, chalcogenide phase change materials are increasingly being investigated for optics and photonics applications. However, in situ characterization of their phase transition characteristics is a capability that remains inaccessible to many researchers. In this article, we introduce a multi-functional silicon microheater platform capable of in situ measurement of structural, kinetic, optical, and thermal properties of these materials. The platform can be fabricated leveraging industry-standard silicon foundry manufacturing processes. We fully open-sourced this platform, including complete hardware design and associated software codes. △ Less

Submitted 12 July, 2023; originally announced July 2023.

Comments: 13 pages main text, 5 figures +1 (supplementary)

Multi-material heterogeneous integration on a 3-D Photonic-CMOS platform

Authors: Luigi Ranno, Jia Xu Brian Sia, Khoi Phuong Dao, Juejun Hu

Abstract: Photonics has been one of the primary beneficiaries of advanced silicon manufacturing. By leveraging on mature complementary metal-oxide-semiconductor (CMOS) process nodes, unprecedented device uniformities and scalability have been achieved at low costs. However, some functionalities, such as optical memory, Pockels modulation, and magnetooptical activity, are challenging or impossible to acquire… ▽ More Photonics has been one of the primary beneficiaries of advanced silicon manufacturing. By leveraging on mature complementary metal-oxide-semiconductor (CMOS) process nodes, unprecedented device uniformities and scalability have been achieved at low costs. However, some functionalities, such as optical memory, Pockels modulation, and magnetooptical activity, are challenging or impossible to acquire on group-IV materials alone. Heterogeneous integration promises to expand the range of capabilities within silicon photonics. Existing heterogeneous integration protocols are nonetheless not compatible with active silicon processes offered at most photonic foundries. In this work, we propose a novel heterogeneous integration platform that will enable wafer-scale, multi-material integration with active silicon-based photonics, requiring zero-change to existing foundry process. Furthermore, the platform will also pave the way to a class of high-performance devices. We propose a grating coupler design with peak coupling efficiency reaching 93%, an antenna with peak diffraction efficiency in excess of 97%, and a broadband adiabatic polarization rotator with conversion efficiency exceeding 99%. △ Less

Submitted 13 April, 2023; originally announced April 2023.

Journal ref: Opt. Mater. Express 13, 2711-2725 (2023)

Free-form micro-optics enabling ultra-broadband low-loss fiber-to-chip coupling

Authors: Shaoliang Yu, Luigi Ranno, Qingyang Du, Samuel Serna, Colin McDonough, Nicholas Fahrenkopf, Tian Gu, Juejun Hu

Abstract: Efficient fiber-to-chip coupling has been a major hurdle to cost-effective packaging and scalable interconnections of photonic integrated circuits. Conventional photonic packaging methods relying on edge or grating coupling are constrained by high insertion losses, limited bandwidth density, narrow band operation, and sensitivity to misalignment. Here we present a new fiber-to-chip coupling scheme… ▽ More Efficient fiber-to-chip coupling has been a major hurdle to cost-effective packaging and scalable interconnections of photonic integrated circuits. Conventional photonic packaging methods relying on edge or grating coupling are constrained by high insertion losses, limited bandwidth density, narrow band operation, and sensitivity to misalignment. Here we present a new fiber-to-chip coupling scheme based on free-form reflective micro-optics. A design approach which simplifies the high-dimensional free-form optimization problem to as few as two full-wave simulations is implemented to empower computationally efficient design of high-performance free-form reflectors while capitalizing on the expanded geometric degrees of freedom. We demonstrated fiber array coupling to waveguides taped out through a standard foundry shuttle run and backend integrated with 3-D printed micro-optics. A low coupling loss down to 0.5 dB was experimentally measured at 1550 nm wavelength with a record 1-dB bandwidth of 300 nm spanning O to U bands. The coupling scheme further affords large alignment tolerance, high bandwidth density and solder reflow compatibility, qualifying it as a promising optical packaging solution for applications such as wavelength division multiplexing communications, broadband spectroscopic sensing, and nonlinear optical signal processing. △ Less

Submitted 28 December, 2021; originally announced December 2021.

Emissivity measurements with an Atomic Force Microscope

Authors: Pieter Jan van Zwol, Laurent Ranno, Joel Chevrier

Abstract: We show that functionalized micromechanical bilayer levers can be used as sensitive probes to accurately measure radiative heat flux in vacuum between two materials at the micro scale. By means of calibration to one material these measurements can be made quantitative for radiative heat flux or for either temperature or material emissivity. We discuss issues and opportunities for our method and pr… ▽ More We show that functionalized micromechanical bilayer levers can be used as sensitive probes to accurately measure radiative heat flux in vacuum between two materials at the micro scale. By means of calibration to one material these measurements can be made quantitative for radiative heat flux or for either temperature or material emissivity. We discuss issues and opportunities for our method and provide ample technical details regarding its implementation and demonstrate good correspondence with the Stefan Boltzman law. We use this system to probe the phase transition of VO2 and find that radiative heat transfer in farfield between VO2 and glass can be reversibly modulated by a factor of 5. △ Less

Submitted 4 November, 2011; originally announced November 2011.

Comments: 14 pages 10 figures