Showing 1–25 of 25 results for author: Randel, S

Freeform terahertz structures fabricated by multi-photon lithography and metal coating

Authors: Pascal Maier, Alexander Kotz, Joachim Hebeler, Qiaoshuang Zhang, Christian Benz, Alexander Quint, Marius Kretschmann, Tobias Harter, Sebastian Randel, Uli Lemmer, Wolfgang Freude, Thomas Zwick, Christian Koos

Abstract: Direct-write multi-photon laser lithography (MPL) combines highest resolution on the nanoscale with essentially unlimited 3D design freedom. Over the previous years, the groundbreaking potential of this technique has been demonstrated in various application fields, including micromechanics, material sciences, microfluidics, life sciences as well as photonics, where in-situ printed optical coupling… ▽ More Direct-write multi-photon laser lithography (MPL) combines highest resolution on the nanoscale with essentially unlimited 3D design freedom. Over the previous years, the groundbreaking potential of this technique has been demonstrated in various application fields, including micromechanics, material sciences, microfluidics, life sciences as well as photonics, where in-situ printed optical coupling elements offer new perspectives for package-level system integration. However, millimeter-wave (mmW) and terahertz (THz) devices could not yet leverage the unique strengths of MPL, even though the underlying devices and structures could also greatly benefit from 3D freeform microfabrication. One of the key challenges in this context is the fact that functional mmW and THz structures require materials with high electrical conductivity and low dielectric losses, which are not amenable to structuring by multi-photon polymerization. In this work, we introduce and experimentally demonstrate a novel approach that allows to leverage MPL for fabricating high-performance mmW and THz structures with hitherto unachieved functionalities. Our concept exploits in-situ printed polymer templates that are selectively coated through highly directive metal deposition techniques in combination with precisely aligned 3D-printed shadowing structures. The resulting metal-coated freeform structures offer high surface quality in combination with low dielectric losses and conductivities comparable to bulk material values, while lending themselves to fabrication on planar mmW/THz circuits. We experimentally show the viability of our concept by demonstrating a series of functional THz structures such as THz interconnects, probe tips, and suspended antennas. We believe that our approach offers disruptive potential in the field of mmW and THz technology and may unlock an entirely new realm of laser-based 3D manufacturing. △ Less

Submitted 6 January, 2024; originally announced January 2024.

Non-sliced Optical Arbitrary Waveform Measurement (OAWM) Using a Silicon Photonic Receiver Chip

Authors: Daniel Drayss, Dengyang Fang, Christoph Füllner, Wolfgang Freude, Sebastian Randel, Christian Koos

Abstract: Comb-based optical arbitrary waveform measurement (OAWM) techniques can overcome the bandwidth limitations of conventional coherent detection schemes and may have disruptive impact on a wide range of scientific and industrial applications. Over the previous years, different OAWM schemes have been demonstrated, showing the performance and the application potential of the concept in laboratory exper… ▽ More Comb-based optical arbitrary waveform measurement (OAWM) techniques can overcome the bandwidth limitations of conventional coherent detection schemes and may have disruptive impact on a wide range of scientific and industrial applications. Over the previous years, different OAWM schemes have been demonstrated, showing the performance and the application potential of the concept in laboratory experiments. However, these demonstrations still relied on discrete fiber-optic components or on combinations of discrete coherent receivers with integrated optical slicing filters that require complex tuning procedures to achieve the desired performance. In this paper, we demonstrate the first wavelength-agnostic OAWM front-end that is integrated on a compact silicon photonic chip and that neither requires slicing filters nor active controls. Our OAWM system comprises four IQ receivers, which are accurately calibrated using a femtosecond mode-locked laser and which offer a total acquisition bandwidth of 170 GHz. Using sinusoidal test signals, we measure a signal-to-noise-and-distortion ratio (SINAD) of 30 dB for the reconstructed signal, which corresponds to an effective number of bits (ENOB) of 4.7 bit, where the underlying electronic analog-to-digital converters (ADC) turn out to be the main limitation. The performance of the OAWM system is further demonstrated by receiving 64QAM data signals at symbol rates of up to 100 GBd, achieving constellation signal-to-noise ratios (CSNR) that are on par with those obtained for conventional coherent receivers. In a theoretical scalability analysis, we show that increasing the channel count of non-sliced OAWM systems can improve both the acquisition bandwidth and the signal quality. We believe that our work represents a key step towards out-of-lab use of highly compact OAWM systems that rely on chip-scale integrated optical front-ends. △ Less

Submitted 21 October, 2023; originally announced October 2023.

Slice-Less Optical Arbitrary Waveform Measurement (OAWM) in a Bandwidth of More than 600 GHz Using Soliton Microcombs

Authors: Daniel Drayss, Dengyang Fang, Christoph Füllner, Grigory Lihachev, Thomas Henauer, Yung Chen, Huanfa Peng, Pablo Marin-Palomo, Thomas Zwick, Wolfgang Freude, Tobias J. Kippenberg, Sebastian Randel, Christian Koos

Abstract: We propose and demonstrate a novel scheme for optical arbitrary waveform measurement (OAWM) that exploits chip-scale Kerr soliton combs as highly scalable multiwavelength local oscillators (LO) for ultra-broadband full-field waveform acquisition. In contrast to earlier concepts, our approach does not require any optical slicing filters and thus lends itself to efficient implementation on state-of-… ▽ More We propose and demonstrate a novel scheme for optical arbitrary waveform measurement (OAWM) that exploits chip-scale Kerr soliton combs as highly scalable multiwavelength local oscillators (LO) for ultra-broadband full-field waveform acquisition. In contrast to earlier concepts, our approach does not require any optical slicing filters and thus lends itself to efficient implementation on state-of-the-art high-index-contrast integration platforms such as silicon photonics. The scheme allows to measure truly arbitrary waveforms with high accuracy, based on a dedicated system model which is calibrated by means of a femtosecond laser with known pulse shape. We demonstrated the viability of the approach in a proof-of-concept experiment by capturing an optical waveform that contains multiple 16 QAM and 64 QAM wavelength-division multiplexed (WDM) data signals with symbol rates of up to 80 GBd, reaching overall line rates of up to 1.92 Tbit/s within an optical acquisition bandwidth of 610 GHz. To the best of our knowledge, this is the highest bandwidth that has so far been demonstrated in an OAWM experiment. △ Less

Submitted 31 March, 2023; originally announced March 2023.

Sub-kHz-linewidth external-cavity laser (ECL) with Si$_{3}$N$_{4}$ resonator used as a tunable pump for a Kerr frequency comb

Authors: Pascal Maier, Yung Chen, Yilin Xu, Yiyang Bao, Matthias Blaicher, Dimitri Geskus, Ronald Dekker, Junqiu Liu, Philipp-Immanuel Dietrich, Huanfa Peng, Sebastian Randel, Wolfgang Freude, Tobias J. Kippenberg, Christian Koos

Abstract: Combining optical gain in direct-bandgap III-V materials with tunable optical feedback offered by advanced photonic integrated circuits is key to chip-scale external-cavity lasers (ECL), offering wideband tunability along with low optical linewidths. External feedback circuits can be efficiently implemented using low-loss silicon nitride (Si$_{3}$N$_{4}$) waveguides, which do not suffer from two-p… ▽ More Combining optical gain in direct-bandgap III-V materials with tunable optical feedback offered by advanced photonic integrated circuits is key to chip-scale external-cavity lasers (ECL), offering wideband tunability along with low optical linewidths. External feedback circuits can be efficiently implemented using low-loss silicon nitride (Si$_{3}$N$_{4}$) waveguides, which do not suffer from two-photon absorption and can thus handle much higher power levels than conventional silicon photonics. However, co-integrating III-V-based gain elements with tunable external feedback circuits in chip-scale modules still represents a challenge, requiring either technologically demanding heterogeneous integration techniques or costly high-precision multi-chip assembly. In this work, we demonstrate Si$_{3}$N$_{4}$-based hybrid integrated ECL that exploit 3D-printed structures such as intra-cavity photonic wire bonds and facet-attached microlenses for low-loss optical coupling with relaxed alignment tolerances, thereby overcoming the need for active alignment while maintaining the full flexibility of multi-chip integration techniques. In a proof-of-concept experiment, we demonstrate an ECL offering a 90 nm tuning range (1480 nm - 1570 nm) with on-chip output powers above 12 dBm and side-mode suppression ratios of up to 59 dB. We achieve an intrinsic linewidth of 979 Hz, which is among the lowest values reported for comparable feedback architectures. The optical loss of the intra-cavity photonic wire bond between the III-V gain element and the Si$_{3}$N$_{4}$-based tunable feedback circuit amounts to approximately (1.6 $\pm$ 0.2) dB. We use the ECL as a tunable pump laser to generate a dissipative Kerr soliton frequency comb. To the best of our knowledge, our experiments represent the first demonstration of a single-soliton Kerr comb generated with a pump that is derived from a hybrid ECL. △ Less

Submitted 10 February, 2023; v1 submitted 11 November, 2022; originally announced November 2022.

3D-printed facet-attached optical elements for connecting VCSEL and photodiodes to fiber arrays and multi-core fibers

Authors: Pascal Maier, Yilin Xu, Mareike Trappen, Matthias Lauermann, Alexandra Henniger-Ludwig, Hermann Kapim, Torben Kind, Philipp-Immanuel Dietrich, Achim Weber, Matthias Blaicher, Clemens Wurster, Sebastian Randel, Wolfgang Freude, Christian Koos

Abstract: Multicore optical fibers and ribbons based on fiber arrays allow for massively parallel transmission of signals via spatially separated channels, thereby offering attractive bandwidth scaling with linearly increasing technical effort. However, low-loss coupling of light between fiber arrays or multicore fibers and standard linear arrays of vertical-cavity surface-emitting lasers (VCSEL) or photodi… ▽ More Multicore optical fibers and ribbons based on fiber arrays allow for massively parallel transmission of signals via spatially separated channels, thereby offering attractive bandwidth scaling with linearly increasing technical effort. However, low-loss coupling of light between fiber arrays or multicore fibers and standard linear arrays of vertical-cavity surface-emitting lasers (VCSEL) or photodiodes (PD) still represents a challenge. In this paper, we demonstrate that 3D-printed facet-attached microlenses (FaML) offer an attractive path for connecting multimode fiber arrays as well as individual cores of multimode multicore fibers to standard arrays of VCSEL or PD. The freeform coupling elements are printed in situ with high precision on the device and fiber facets by high-resolution multi-photon lithography. We demonstrate coupling losses down to 0.35 dB along with lateral 1 dB alignment tolerances in excess of 10 $μ$m, allowing to leverage fast passive assembly techniques that rely on industry-standard machine vision. To the best of our knowledge, our experiments represent the first demonstration of a coupling interface that connects individual cores of a multicore fiber to VCSEL or PD arranged in a standard linear array without the need for additional fiber-based or waveguide-based fan-out structures. Using this approach, we build a 3 x 25 Gbit/s transceiver assembly which fits into a small form-factor pluggable module and which fulfills many performance metrics specified in the IEEE 802.3 standard. △ Less

Submitted 31 October, 2022; v1 submitted 23 August, 2022; originally announced August 2022.

Journal ref: Optics Express 30(26), 2022, 46602-46625

3D-printed facet-attached optical elements for beam sha** in optical phased arrays

Authors: Stefan Singer, Yilin Xu, Sebastian Tobias Skacel, Yiyang Bao, Heiner Zwickel, Pascal Maier, Lukas Freter, Philipp-Immanuel Dietrich, Mathias Kaschel, Christoph Menzel, Sebastian Randel, Wolfgang Freude, Christian Koos

Abstract: We demonstrate an optical phased-array (OPA) equipped with a 3D-printed facet-attached element for sha** and deflection of the emitted beam. The beam shaper combines freeform refractive surfaces with total-internal-reflection (TIR) mirrors and is in-situ printed to edge-emitting waveguide facets using high-resolution multi-photon lithography, thereby ensuring precise alignment with respect to on… ▽ More We demonstrate an optical phased-array (OPA) equipped with a 3D-printed facet-attached element for sha** and deflection of the emitted beam. The beam shaper combines freeform refractive surfaces with total-internal-reflection (TIR) mirrors and is in-situ printed to edge-emitting waveguide facets using high-resolution multi-photon lithography, thereby ensuring precise alignment with respect to on-chip waveguide structures. In a proof-of-concept experiment, we achieve a grating-lobe free steering range of $\pm 30°$ and a full-width-halfmaximum (FWHM) beam divergence of approximately $2°$. The concept opens an attractive alternative to currently used grating structures and is applicable to a wide range of integration platforms. △ Less

Submitted 9 January, 2023; v1 submitted 24 March, 2022; originally announced March 2022.

Ultra-broadband polarization beam splitter and rotator based on 3D-printed waveguides

Authors: Aleksandar Nesic, Matthias Blaicher, Pablo Marin-Palomo, Christoph Füllner, Sebastian Randel, Wolfgang Freude, Christian Koos

Abstract: Multi-photon lithography has emerged as a powerful tool for photonic integration, allowing to complement planar photonic circuits by 3D-printed freeform structures such as waveguides or micro-optical elements. These structures can be fabricated with high precision on the facets of optical devices and lend themselves to highly efficient package-level chip-chip-connections in photonic assemblies. Ho… ▽ More Multi-photon lithography has emerged as a powerful tool for photonic integration, allowing to complement planar photonic circuits by 3D-printed freeform structures such as waveguides or micro-optical elements. These structures can be fabricated with high precision on the facets of optical devices and lend themselves to highly efficient package-level chip-chip-connections in photonic assemblies. However, plain light transport and efficient coupling is far from exploiting the full geometrical design freedom that is offered by 3D laser lithography. Here, we extend the functionality of 3D-printed optical structures to manipulation of optical polarization states. We demonstrate compact ultra-broadband polarization beam splitters (PBS) that can be combined with polarization rotators (PR) and mode-field adapters into a monolithic 3D-printed structure, fabricated directly on the facets of optical devices. In a proof-of-concept experiment, we demonstrate measured polarization extinction ratios beyond 11 dB over a bandwidth of 350 nm at near-infrared (NIR) telecommunication wavelengths around 1550 nm. We demonstrate the viability of the device by receiving a 640 Gbit/s dual-polarization data signal using 16-state quadrature amplitude modulation (16QAM), without any measurable optical-signal-to-noise-ratio (OSNR) penalty compared to a commercial PBS. △ Less

Submitted 26 July, 2021; originally announced July 2021.

Comments: 11 pages and 4 figures in the main part + 7 pages and 4 figures in the supplementary

Hybrid Electro-Optic Modulator Combining Silicon Photonic Slot Waveguides with High-k Radio-Frequency Slotlines

Authors: Sandeep Ummethala, Juned N. Kemal, Ahmed S. Alam, Matthias Lauermann, Yasar Kutuvantavida, Sree H. Nandam, Lothar Hahn, Delwin L. Elder, Larry R. Dalton, Thomas Zwick, Sebastian Randel, Wolfgang Freude, Christian Koos

Abstract: Electro-optic (EO) modulators rely on interaction of optical and electrical signals with second-order nonlinear media. For the optical signal, this interaction can be strongly enhanced by using dielectric slot-waveguide structures that exploit a field discontinuity at the interface between a high-index waveguide core and the low-index EO cladding. In contrast to this, the electrical signal is usua… ▽ More Electro-optic (EO) modulators rely on interaction of optical and electrical signals with second-order nonlinear media. For the optical signal, this interaction can be strongly enhanced by using dielectric slot-waveguide structures that exploit a field discontinuity at the interface between a high-index waveguide core and the low-index EO cladding. In contrast to this, the electrical signal is usually applied through conductive regions in the direct vicinity of the optical waveguide. To avoid excessive optical loss, the conductivity of these regions is maintained at a moderate level, thus leading to inherent RC-limitations of the modulation bandwidth. In this paper, we show that these limitations can be overcome by extending the slot-waveguide concept to the modulating radio-frequency (RF) signal. Our device combines an RF slotline that relies on BaTiO3 as a high-k dielectric material with a conventional silicon photonic slot waveguide and a highly efficient organic EO cladding material. In a proof-of-concept experiment, we demonstrate a 1 mm-long Mach-Zehnder modulator that offers a 3 dB-bandwidth of 76 GHz and a 6 dB-bandwidth of 110 GHz along with a small π-voltage of 1.3 V (UπL = 1.3 V mm). To the best of our knowledge, this represents the largest EO bandwidth so far achieved with a silicon photonic modulator based on dielectric waveguides. We further demonstrate the viability of the device in a data transmission experiment using four-state pulse-amplitude modulation (PAM4) at line rates up to 200 Gbit/s. Our first-generation devices leave vast room for further improvement and may open an attractive route towards highly efficient silicon photonic modulators that combine sub-1 mm device lengths with sub-1 V drive voltages and modulation bandwidths of more than 100 GHz. △ Less

Submitted 20 October, 2020; originally announced November 2020.

Comments: 8 pages main paper, 7 pages supplementary info, 11 figures

Silicon-Organic Hybrid (SOH) Mach-Zehnder Modulators for 100 GBd PAM4 Signaling With Sub-1 dB Phase-Shifter Loss

Authors: Clemens Kieninger, Christoph Füllner, Heiner Zwickel, Yasar Kutuvantavida, Juned N. Kemal, Carsten Eschenbaum, Delwin L. Elder, Larry R. Dalton, Wolfgang Freude, Sebastian Randel, Christian Koos

Abstract: We report on compact and efficient silicon-organic hybrid (SOH) Mach-Zehnder modulators (MZM) with low phase shifter insertion loss of 0.7 dB. The 280 $μ$m-long phase shifters feature a $π$-voltage-length product of 0.41 Vmm and a loss-efficiency product as small as $aU_πL = 1.0\space\rm{VdB}$. The device performance is demonstrated in a data transmission experiment, where we generate on-off-keyin… ▽ More We report on compact and efficient silicon-organic hybrid (SOH) Mach-Zehnder modulators (MZM) with low phase shifter insertion loss of 0.7 dB. The 280 $μ$m-long phase shifters feature a $π$-voltage-length product of 0.41 Vmm and a loss-efficiency product as small as $aU_πL = 1.0\space\rm{VdB}$. The device performance is demonstrated in a data transmission experiment, where we generate on-off-keying (OOK) and four-level pulse-amplitude modulation (PAM4) signals at symbol rates of 100 GBd, resulting in line rates of up to 200 Gbit/s. Bit error ratios are below the threshold for hard-decision forward error correction (HD-FEC) with 7 % coding overhead, leading to net data rates of 187 Gbit/s. This is the highest PAM4 data rate ever achieved for a sub-1 mm silicon photonic MZM. △ Less

Submitted 19 February, 2020; originally announced February 2020.

A verified equivalent-circuit model for slotwaveguide modulators

Authors: Heiner Zwickel, Stefan Singer, Clemens Kieninger, Yasar Kutuvantavida, Narek Muradyan, Thorsten Wahlbrink, Shiyoshi Yokoyama, Sebastian Randel, Wolfgang Freude, Christian Koos

Abstract: We formulate and experimentally validate an equivalent-circuit model based on distributed elements to describe the electric and electro-optic (EO) properties of travellingwave silicon-organic hybrid (SOH) slot-waveguide modulators. The model allows to reliably predict the small-signal EO frequency response of the modulators exploiting purely electrical measurements of the frequency-dependent RF tr… ▽ More We formulate and experimentally validate an equivalent-circuit model based on distributed elements to describe the electric and electro-optic (EO) properties of travellingwave silicon-organic hybrid (SOH) slot-waveguide modulators. The model allows to reliably predict the small-signal EO frequency response of the modulators exploiting purely electrical measurements of the frequency-dependent RF transmission characteristics. We experimentally verify the validity of our model, and we formulate design guidelines for an optimum trade-off between optical loss due to free-carrier absorption (FCA), electro-optic bandwidth, and π-voltage of SOH slot-waveguide modulators. △ Less

Submitted 10 December, 2019; originally announced January 2020.

Hardwire-Configurable Photonic Integrated Circuits Enabled by 3D Nano-Printing

Authors: Tobias Hoose, Matthias Blaicher, Juned Nassir Kemal, Heiner Zwickel, Muhammad Rodlin Billah, Philipp-Immanuel Dietrich, Andreas Hofmann, Wolfgang Freude, Sebastian Randel, Christian Koos

Abstract: Photonic integrated circuits (PIC) currently rely on application-specific designs that are geared towards a particular functionality. Development of such application-specific PIC requires considerable effort and often involves several design, fabrication, and characterization iterations, each with cycle times of several months, to reach acceptable performance. At the same time, the number of chips… ▽ More Photonic integrated circuits (PIC) currently rely on application-specific designs that are geared towards a particular functionality. Development of such application-specific PIC requires considerable effort and often involves several design, fabrication, and characterization iterations, each with cycle times of several months, to reach acceptable performance. At the same time, the number of chips that is eventually needed to serve a certain application is often too small to benefit from the scalability of advanced photonic integration platforms. As a consequence, large-scale photonic integration has hitherto been unable to unfold its full economic advantages within the highly fragmented application space of photonics. Here we introduce a novel approach to configurable PIC that can overcome these challenges. The concept exploits generic PIC designs consisting of standard building blocks that can be concatenated to provide an application-specific functionality. Configuration of the PIC relies on establishing hardwired optical connections between suitable ports of an optical wire board using highly flexible 3D direct-write laser lithography. Hardwire-configurable PIC allow to exploit high-throughput production of generic chips in large-scale fabrication facilities for serving a wide variety of applications with small or medium volumes of specifically configured devices. △ Less

Submitted 19 December, 2019; originally announced December 2019.

Comments: 8-page manuscript with 4 figures, 8-page supplementary with 8 figures, all in one file

Coherent WDM transmission using quantum-dash mode-locked laser diodes as multi-wavelength source and local oscillator

Authors: Juned N. Kemal, Pablo Marin-Palomo, Vivek Panapakkam, Philipp Trocha, Stefan Wolf, Kamel Merghem, Francois Lelarge, Abderrahim Ramdane, Sebastian Randel, Wolfgang Freude, Christian Koos

Abstract: Quantum-dash (QD) mode-locked laser diodes (MLLD) lend themselves as chip-scale frequency comb generators for highly scalable wavelength-division multiplexing (WDM) links in future data-center, campus-area, or metropolitan networks. Driven by a simple DC current, the devices generate flat broadband frequency combs, containing tens of equidistant optical tones with line spacings of tens of GHz. Her… ▽ More Quantum-dash (QD) mode-locked laser diodes (MLLD) lend themselves as chip-scale frequency comb generators for highly scalable wavelength-division multiplexing (WDM) links in future data-center, campus-area, or metropolitan networks. Driven by a simple DC current, the devices generate flat broadband frequency combs, containing tens of equidistant optical tones with line spacings of tens of GHz. Here we show that QD-MLLDs can not only be used as multi-wavelength light sources at a WDM transmitter, but also as multi-wavelength local oscillators (LO) for parallel coherent reception. In our experiments, we demonstrate transmission of an aggregate data rate of 4.1 Tbit/s (23x45 GBd PDM-QPSK) over 75 km standard single-mode fiber (SSMF). To the best of our knowledge, this represents the first demonstration of a coherent WDM link that relies on QD-MLLD both at the transmitter and the receiver. △ Less

Submitted 5 August, 2019; originally announced September 2019.

Generalized Kramers-Kronig Receiver for Coherent THz Communications

Authors: Tobias Harter, Christoph Füllner, Juned N. Kemal, Sandeep Ummethala, Johannes L. Steinmann, Miriam Brosi, Jeffrey L. Hesler, Erik Bründermann, Anke-Susanne Müller, Wolfgang Freude, Sebastian Randel, Christian Koos

Abstract: High-speed communication systems rely on spectrally efficient modulation formats that encode information both on the amplitude and on the phase of an electromagnetic carrier. Coherent detection of such signals typically uses rather complex receiver schemes, requiring a continuous-wave (c.w.) local oscillator (LO) as a phase reference and a mixer circuit for spectral down-conversion. In optical com… ▽ More High-speed communication systems rely on spectrally efficient modulation formats that encode information both on the amplitude and on the phase of an electromagnetic carrier. Coherent detection of such signals typically uses rather complex receiver schemes, requiring a continuous-wave (c.w.) local oscillator (LO) as a phase reference and a mixer circuit for spectral down-conversion. In optical communications, the so-called Kramers-Kronig (KK) scheme has been demonstrated to greatly simplify the receiver, reducing the hardware to a single photodiode. In this approach, an LO tone is transmitted along with the signal, and the amplitude and phase of the complex signal envelope are reconstructed from the photocurrent by digital signal processing. This reconstruction exploits the fact that the real and the imaginary part, or, equivalently, the amplitude and the phase of an analytic signal are connected by a KK-type relation. Here, we transfer the KK scheme to high-speed wireless communications at THz carrier frequencies. We use a Schottky-barrier diode (SBD) as a nonlinear element and generalize the theory of KK processing to account for the non-quadratic characteristics of this device. Using 16-state quadrature amplitude modulation (16QAM), we transmit a net data rate of 115 Gbit/s at a carrier frequency of 0.3 THz over a distance of 110 m. △ Less

Submitted 8 July, 2019; originally announced July 2019.

Comments: 9 pages Main Paper + 7 pages Supplementary Information

OSNR limitations of chip-based optical frequency comb sources for WDM coherent communications

Authors: Pablo Marin-Palomo, Juned N. Kemal, Wolfgang Freude, Sebastian Randel, Christian Koos

Abstract: Optical frequency combs have the potential to become key building blocks of optical communication subsystems. The strictly equidistant, narrow-band spectral lines of a frequency comb can serve both as carriers for massively parallel data transmission and as local oscillator for coherent reception. Recent experiments have demonstrated the viability of various chip-based comb generator concepts for… ▽ More Optical frequency combs have the potential to become key building blocks of optical communication subsystems. The strictly equidistant, narrow-band spectral lines of a frequency comb can serve both as carriers for massively parallel data transmission and as local oscillator for coherent reception. Recent experiments have demonstrated the viability of various chip-based comb generator concepts for communication applications, offering transmission capacities of tens of Tbit/s. Here, we investigate the influence of the comb line power and of the carrier-to-noise power ratio on the performance of a frequency comb in a WDM system. We distinguish two regimes of operation depending on whether the comb source or the transmission link limits the performance of the system, i.e., defines the link reach, restricts the choice of modulation format and sets the maximum symbol rate. Finally, we investigate the achievable OSNR and channel capacity when using the tones of a soliton Kerr frequency comb as multi-wavelength carriers for WDM systems. △ Less

Submitted 1 July, 2019; originally announced July 2019.

Comments: 8 pages, 5 figures

Comb-based WDM transmission at 10 Tbit/s using a DC-driven quantum-dash mode-locked laser diode

Authors: Pablo Marin-Palomo, Juned N. Kemal, Philipp Trocha, Stefan Wolf, Kamel Merghem, François Lelarge, Abderrahim Ramdane, Wolfgang Freude, Sebastian Randel, Christian Koos

Abstract: Chip-scale frequency comb generators have the potential to become key building blocks of compact wavelength-division multiplexing (WDM) transceivers in future metropolitan or campus-area networks. Among the various comb generator concepts, quantum-dash (QD) mode-locked laser diodes (MLLD) stand out as a particularly promising option, combining small footprint with simple operation by a DC current… ▽ More Chip-scale frequency comb generators have the potential to become key building blocks of compact wavelength-division multiplexing (WDM) transceivers in future metropolitan or campus-area networks. Among the various comb generator concepts, quantum-dash (QD) mode-locked laser diodes (MLLD) stand out as a particularly promising option, combining small footprint with simple operation by a DC current and offering flat broadband comb spectra. However, the data transmission performance achieved with QD-MLLD was so far limited by strong phase noise of the individual comb tones, restricting experiments to rather simple modulation formats such as quadrature phase shift keying (QPSK) or requiring hard-ware-based compensation schemes. Here we demonstrate that these limitations can be over-come by digital symbol-wise phase tracking algorithms, avoiding any hardware-based phase-noise compensation. We demonstrate 16QAM dual-polarization WDM transmission on 38 channels at an aggregate net data rate of 10.68 Tbit/s over 75 km of standard single-mode fiber. To the best of our knowledge, this corresponds to the highest data rate achieved through a DC-driven chip-scale comb generator without any hardware-based phase-noise reduction schemes. △ Less

Submitted 3 May, 2019; v1 submitted 22 April, 2019; originally announced April 2019.

Hybrid 2D/3D photonic integration for non-planar circuit topologies

Authors: Aleksandar Nesic, Matthias Blaicher, Tobias Hoose, Andreas Hofmann, Matthias Lauermann, Yasar Kutuvantavida, Martin Nöllenburg, Sebastian Randel, Wolfgang Freude, Christian Koos

Abstract: Complex photonic integrated circuits (PIC) may have strongly non-planar topologies that require waveguide crossings (WGX) when realized in single-layer integration platforms. The number of WGX increases rapidly with the complexity of the circuit, in particular when it comes to highly interconnected optical switch topologies. Here, we present a concept for WGX-free PIC that rely on 3D-printed freef… ▽ More Complex photonic integrated circuits (PIC) may have strongly non-planar topologies that require waveguide crossings (WGX) when realized in single-layer integration platforms. The number of WGX increases rapidly with the complexity of the circuit, in particular when it comes to highly interconnected optical switch topologies. Here, we present a concept for WGX-free PIC that rely on 3D-printed freeform waveguide overpasses (WOP). We experimentally demonstrate the viability of our approach using the example of a $4 \times 4$ switch-and-select (SAS) circuit realized on the silicon photonic platform. We further present a comprehensive graph-theoretical analysis of different $n \times n$ SAS circuit topologies. We find that for increasing port counts $n$ of the SAS circuit, the number of WGX increases with $n^4$, whereas the number of WOP increases only in proportion to $n^2$. △ Less

Submitted 24 January, 2019; originally announced January 2019.

Comments: 22 pages, 8 figures

Journal ref: Optics Express Vol. 27, Issue 12, pp. 17402-17425 (2019)

Wireless THz link with optoelectronic transmitter and receiver

Authors: Tobias Harter, Sandeep Ummethala, Matthias Blaicher, Sascha Muehlbrandt, Stefan Wolf, Marco Weber, Md Mosaddek Hossain Adib, Juned N. Kemal, Marco Merboldt, Florian Boes, Simon Nellen, Axel Tessmann, Martin Walther, Björn Globisch, Thomas Zwick, Wolfgang Freude, Sebastian Randel, Christian Koos

Abstract: Photonics might play a key role in future wireless communication systems that operate at THz carrier frequencies. A prime example is the generation of THz data streams by mixing optical signals in high-speed photodetectors. Over the previous years, this concept has enabled a series of wireless transmission experiments at record-high data rates. Reception of THz signals in these experiments, howeve… ▽ More Photonics might play a key role in future wireless communication systems that operate at THz carrier frequencies. A prime example is the generation of THz data streams by mixing optical signals in high-speed photodetectors. Over the previous years, this concept has enabled a series of wireless transmission experiments at record-high data rates. Reception of THz signals in these experiments, however, still relied on electronic circuits. In this paper, we show that wireless THz receivers can also greatly benefit from optoelectronic signal processing techniques, in particular when carrier frequencies beyond 0.1 THz and wideband tunability over more than an octave is required. Our approach relies on a high-speed photoconductor and a photonic local oscillator for optoelectronic down-conversion of THz data signals to an intermediate frequency band that is easily accessible by conventional microelectronics. By tuning the frequency of the photonic local oscillator, we can cover a wide range of carrier frequencies between 0.03 THz and 0.34 THz. We demonstrate line rates of up to 10 Gbit/s on a single channel and up to 30 Gbit/s on multiple channels over a distance of 58 m. To the best of our knowledge, our experiments represent the first demonstration of a THz transmission link that exploits optoelectronic signal processing techniques both at the transmitter and the receiver. △ Less

Submitted 10 January, 2019; originally announced January 2019.

Comments: 7 pages Main Paper + 6 pages Supplementary Information

Journal ref: Optica, 6, 1063-1070 (2019)

THz-to-Optical Conversion in Wireless Communications Using an Ultra-Broadband Plasmonic Modulator

Authors: Sandeep Ummethala, Tobias Harter, Kira Koehnle, Zheng Li, Sascha Muehlbrandt, Yasar Kutuvantavida, Juned Kemal, Jochen Schaefer, Axel Tessmann, Suresh Kumar Garlapati, Andreas Bacher, Lothar Hahn, Martin Walther, Thomas Zwick, Sebastian Randel, Wolfgang Freude, Christian Koos

Abstract: Future wireless communication networks have to handle data rates of tens or even hundreds of Gbit/s per link, requiring carrier frequencies in the unallocated terahertz (THz) spectrum. In this context, seamless integration of THz links into existing fiber-optic infrastructures is of great importance to complement the inherent portability and flexibility advantages of wireless networks by the relia… ▽ More Future wireless communication networks have to handle data rates of tens or even hundreds of Gbit/s per link, requiring carrier frequencies in the unallocated terahertz (THz) spectrum. In this context, seamless integration of THz links into existing fiber-optic infrastructures is of great importance to complement the inherent portability and flexibility advantages of wireless networks by the reliable and virtually unlimited capacity of optical transmission systems. On the technological level, this requires novel device and signal processing concepts for direct conversion of data streams between the THz and the optical domains. Here, we report on the first demonstration of a THz link that is seamlessly integrated into a fiber-optic network using direct terahertz-to-optical (T/O) conversion at the wireless receiver. We exploit an ultra-broadband silicon-plasmonic modulator having a 3 dB bandwidth in excess of 0.36 THz for T/O conversion of a 50 Gbit/s data stream that is transmitted on a 0.2885 THz carrier over a 16 m-long wireless link. Optical-to-terahertz (O/T) conversion at the wireless transmitter relies on photomixing in a uni-travelling-carrier photodiode. △ Less

Submitted 6 November, 2018; originally announced December 2018.

Comments: 7 pages Main Paper + 10 pages Supplementary Information

Electrically packaged silicon-organic hybrid (SOH) I/Q-modulator for 64 GBd operation

Authors: Heiner Zwickel, Juned N. Kemal, Clemens Kieninger, Yasar Kutuvantavida, Jonas Rittershofer, Matthias Lauermann, Wolfgang Freude, Sebastian Randel, Christian Koos

Abstract: Silicon-organic hybrid (SOH) electro-optic (EO) modulators combine small footprint with low operating voltage and hence low power dissipation, thus lending themselves to on-chip integration of large-scale device arrays. Here we demonstrate an electrical packaging concept that enables high-density radio-frequency (RF) interfaces between on-chip SOH devices and external circuits. The concept combine… ▽ More Silicon-organic hybrid (SOH) electro-optic (EO) modulators combine small footprint with low operating voltage and hence low power dissipation, thus lending themselves to on-chip integration of large-scale device arrays. Here we demonstrate an electrical packaging concept that enables high-density radio-frequency (RF) interfaces between on-chip SOH devices and external circuits. The concept combines high-resolution $\mathrm{Al_2O_3}$ printed-circuit boards with technically simple metal wire bonds and is amenable to packaging of device arrays with small on-chip bond pad pitches. In a set of experiments, we characterize the performance of the underlying RF building blocks and we demonstrate the viability of the overall concept by generation of high-speed optical communication signals. Achieving line rates (symbols rates) of 128 Gbit/s (64 GBd) using quadrature-phase-shiftkeying (QPSK) modulation and of 160 Gbit/s (40 GBd) using 16-state quadrature-amplitudemodulation (16QAM), we believe that our demonstration represents an important step in bringing SOH modulators from proof-of-concept experiments to deployment in commercial environments. △ Less

Submitted 15 July, 2019; v1 submitted 30 July, 2018; originally announced September 2018.

Demonstration of long-term thermally stable Silicon-Organic Hybrid Modulators at 85 °C

Authors: Clemens Kieninger, Yasar Kutuvantavida, Hiroki Miura, Juned N. Kemal, Heiner Zwickel, Feng Qiu, Matthias Lauermann, Wolfgang Freude, Sebastian Randel, Shiyoshi Yokoyama, Christian Koos

Abstract: We report on the first demonstration of long-term thermally stable silicon-organic hybrid (SOH) modulators in accordance with Telcordia standards of high-temperature storage. The devices rely on an organic electro-optic sidechain polymer with a high glass transition temperature of 172 °C. In our high-temperature storage experiments at 85 °C, we find that the electro-optic activity converges to a c… ▽ More We report on the first demonstration of long-term thermally stable silicon-organic hybrid (SOH) modulators in accordance with Telcordia standards of high-temperature storage. The devices rely on an organic electro-optic sidechain polymer with a high glass transition temperature of 172 °C. In our high-temperature storage experiments at 85 °C, we find that the electro-optic activity converges to a constant long-term stable level after an initial decay. If we consider a burn-in time of 300 h, the π-voltage of the modulators increases on average by less than 15 % if we store the devices for additional 2400 h. The performance of the devices is demonstrated by generating high-quality 40 Gbit/s OOK signals both after the burn-in period and after extended high-temperature storage. △ Less

Submitted 2 July, 2018; originally announced July 2018.

Journal ref: Opt. Express 26 (2018) 27955-27964

Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding

Authors: Muhammad Rodlin Billah, Matthias Blaicher, Tobias Hoose, Philipp-Immanuel Dietrich, Pablo Marin-Palomo, Nicole Lindenmann, Aleksandar Nesic, Andreas Hofmann, Ute Troppenz, Martin Moehrle, Sebastian Randel, Wolfgang Freude, Christian Koos

Abstract: Efficient coupling of III-V light sources to silicon photonic circuits is one of the key challenges of integrated optics. Important requirements are low coupling losses, as well as small footprint and high yield of the overall assembly, along with the ability to use automated processes for large-scale production. In this paper, we demonstrate that photonic wire bonding addresses these challenges b… ▽ More Efficient coupling of III-V light sources to silicon photonic circuits is one of the key challenges of integrated optics. Important requirements are low coupling losses, as well as small footprint and high yield of the overall assembly, along with the ability to use automated processes for large-scale production. In this paper, we demonstrate that photonic wire bonding addresses these challenges by exploiting direct-write two-photon lithography for in-situ fabrication of three-dimensional freeform waveguides between optical chips. In a series proof-of-concept experiments, we connect InP-based horizontal-cavity surface emitting lasers (HCSEL) to passive silicon photonic circuits with insertion losses down to 0.4 dB. To the best of our knowledge, this is the most efficient interface between an InP light source and a silicon photonic chip that has so far been demonstrated. Our experiments represent a key step in advancing photonic wire bonding to a universal integration platform for hybrid photonic multi-chip assemblies that combine known-good dies of different materials to high-performance hybrid multi-chip modules. △ Less

Submitted 9 February, 2018; originally announced February 2018.

Comments: 9 pages, 5 figures

Journal ref: Optica Vol. 5, Issue 7, pp. 876-883 (2018)

Coherent modulation up to 100 GBd 16QAM using silicon-organic hybrid (SOH) devices

Authors: Stefan Wolf, Heiner Zwickel, Clemens Kieninger, Matthias Lauermann, Wladislaw Hartmann, Yasar Kutuvantavida, Wolfgang Freude, Sebastian Randel, Christian Koos

Abstract: We demonstrate the generation of higher-order modulation formats using silicon-based inphase/quadrature (IQ) modulators at symbol rates of up to 100 GBd. Our devices exploit the advantages of silicon-organic hybrid (SOH) integration, which combines silicon-on-insulator waveguides with highly efficient organic electro-optic (EO) cladding materials to enable small drive voltages and sub-millimeter d… ▽ More We demonstrate the generation of higher-order modulation formats using silicon-based inphase/quadrature (IQ) modulators at symbol rates of up to 100 GBd. Our devices exploit the advantages of silicon-organic hybrid (SOH) integration, which combines silicon-on-insulator waveguides with highly efficient organic electro-optic (EO) cladding materials to enable small drive voltages and sub-millimeter device lengths. In our experiments, we use an SOH IQ modulator with a π-voltage of 1.6 V to generate 100 GBd 16QAM signals. This is the first time that the 100 GBd mark is reached with an IQ modulator realized on a semiconductor substrate, leading to a single-polarization line rate of 400 Gbit/s. The peak-to-peak drive voltages amount to 1.5 Vpp, corresponding to an electrical energy dissipation in the modulator of only 25 fJ/bit. △ Less

Submitted 19 September, 2017; originally announced October 2017.

Ultra-High Electro-Optic Activity Demonstrated in a Silicon-Organic Hybrid (SOH) Modulator

Authors: Clemens Kieninger, Yasar Kutuvantavida, Delwin L. Elder, Stefan Wolf, Heiner Zwickel, Matthias Blaicher, Juned N. Kemal, Matthias Lauermann, Sebastian Randel, Wolfgang Freude, Larry R. Dalton, Christian Koos

Abstract: Efficient electro-optic (EO) modulators crucially rely on advanced materials that exhibit strong electro-optic activity and that can be integrated into high-speed and efficient phase shifter structures. In this paper, we demonstrate ultra-high in-device EO figures of merit of up to n3r33 = 2300 pm/V achieved in a silicon-organic hybrid (SOH) Mach-Zehnder Modulator (MZM) using the EO chromophore JR… ▽ More Efficient electro-optic (EO) modulators crucially rely on advanced materials that exhibit strong electro-optic activity and that can be integrated into high-speed and efficient phase shifter structures. In this paper, we demonstrate ultra-high in-device EO figures of merit of up to n3r33 = 2300 pm/V achieved in a silicon-organic hybrid (SOH) Mach-Zehnder Modulator (MZM) using the EO chromophore JRD1. This is the highest material-related in-device EO figure of merit hitherto achieved in a high-speed modulator at any operating wavelength. The π-voltage of the 1.5 mm-long device amounts to 210 mV, leading to a voltage-length product of UπL = 320 Vμm - the lowest value reported for MZM that are based on low-loss dielectric waveguides. The viability of the devices is demonstrated by generating high-quality on-off-keying (OOK) signals at 40 Gbit/s with Q factors in excess of 8 at a drive voltage as low as 140 mVpp. We expect that efficient high-speed EO modulators will not only have major impact in the field of optical communications, but will also open new avenues towards ultra-fast photonic-electronic signal processing. △ Less

Submitted 23 April, 2018; v1 submitted 19 September, 2017; originally announced September 2017.

Comments: 9 pages, 4 figures

Journal ref: Optica 5 (2018) 739-748

Silicon-Organic Hybrid (SOH) Mach-Zehnder Modulators for 100 Gbit/s On-Off Keying

Authors: Stefan Wolf, Heiner Zwickel, Wladislaw Hartmann, Matthias Lauermann, Yasar Kutuvantavida, Clemens Kieninger, Lars Altenhain, Rolf Schmid, **gdong Luo, Alex K. -Y. Jen, Sebastian Randel, Wolfgang Freude, Christian Koos

Abstract: Electro-optic modulators for high-speed on-off keying (OOK) are key components of short- and mediumreach interconnects in data-center networks. Besides small footprint and cost-efficient large-scale production, small drive voltages and ultra-low power consumption are of paramount importance for such devices. Here we demonstrate that the concept of silicon-organic hybrid (SOH) integration is perfec… ▽ More Electro-optic modulators for high-speed on-off keying (OOK) are key components of short- and mediumreach interconnects in data-center networks. Besides small footprint and cost-efficient large-scale production, small drive voltages and ultra-low power consumption are of paramount importance for such devices. Here we demonstrate that the concept of silicon-organic hybrid (SOH) integration is perfectly suited for meeting these challenges. The approach combines the unique processing advantages of large-scale silicon photonics with unrivalled electro-optic (EO) coefficients obtained by molecular engineering of organic materials. In our proof-of-concept experiments, we demonstrate generation and transmission of OOK signals with line rates of up to 100 Gbit/s using a 1.1 mm-long SOH Mach-Zehnder modulator (MZM) which features a π-voltage of only 0.9 V. This experiment represents not only the first demonstration of 100 Gbit/s OOK on the silicon photonic platform, but also leads to the lowest drive voltage and energy consumption ever demonstrated at this data rate for a semiconductor-based device. We support our experimental results by a theoretical analysis and show that the nonlinear transfer characteristic of the MZM can be exploited to overcome bandwidth limitations of the modulator and of the electric driver circuitry. The devices are fabricated in a commercial silicon photonics line and can hence be combined with the full portfolio of standard silicon photonic devices. We expect that high-speed power-efficient SOH modulators may have transformative impact on short-reach optical networks, enabling compact transceivers with unprecedented energy efficiency that will be at the heart of future Ethernet interfaces at Tbit/s data rates. △ Less

Submitted 12 September, 2017; v1 submitted 1 September, 2017; originally announced September 2017.

Ultrafast optical ranging using microresonator soliton frequency combs

Authors: Philipp Trocha, Denis Ganin, Maxim Karpov, Martin H. P. Pfeiffer, Arne Kordts, Jonas Krockenberger, Stefan Wolf, Pablo Marin-Palomo, Claudius Weimann, Sebastian Randel, Wolfgang Freude, Tobias J. Kippenberg, Christian Koos

Abstract: Light detection and ranging (LIDAR) is critical to many fields in science and industry. Over the last decade, optical frequency combs were shown to offer unique advantages in optical ranging, in particular when it comes to fast distance acquisition with high accuracy. However, current comb-based concepts are not suited for emerging high-volume applications such as drone navigation or autonomous dr… ▽ More Light detection and ranging (LIDAR) is critical to many fields in science and industry. Over the last decade, optical frequency combs were shown to offer unique advantages in optical ranging, in particular when it comes to fast distance acquisition with high accuracy. However, current comb-based concepts are not suited for emerging high-volume applications such as drone navigation or autonomous driving. These applications critically rely on LIDAR systems that are not only accurate and fast, but also compact, robust, and amenable to cost-efficient mass-production. Here we show that integrated dissipative Kerr-soliton (DKS) comb sources provide a route to chip-scale LIDAR systems that combine sub-wavelength accuracy and unprecedented acquisition speed with the opportunity to exploit advanced photonic integration concepts for wafer-scale mass production. In our experiments, we use a pair of free-running DKS combs, each providing more than 100 carriers for massively parallel synthetic-wavelength interferometry. We demonstrate dual-comb distance measurements with record-low Allan deviations down to 12 nm at averaging times of 14 $μ$s as well as ultrafast ranging at unprecedented measurement rates of up to 100 MHz. We prove the viability of our technique by sampling the naturally scattering surface of air-gun projectiles flying at 150 m/s (Mach 0.47). Combining integrated dual-comb LIDAR engines with chip-scale nanophotonic phased arrays, the approach could allow widespread use of compact ultrafast ranging systems in emerging mass applications. △ Less

Submitted 20 July, 2017; v1 submitted 19 July, 2017; originally announced July 2017.

Comments: 9 pages, 3 figures, Supplementary information is attached in 'Ancillary files'

Journal ref: Science 23 Feb 2018, Vol. 359, Issue 6378, pp. 887-891