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Classifier for centrality determination with Zero Degree Calorimeter at the Cooling-Storage-Ring External-target Experiment
Authors:
Biao Zhang,
Li-Ke Liu,
Hua Pei,
Shusu Shi,
Nu Xu,
Ya** Wang
Abstract:
The Zero Degree Calorimeter (ZDC) plays a crucial role in determining centrality at the Cooling-Storage-Ring External-target Experiment (CEE) in the Heavy Ion Research Facility in Lanzhou (HIRFL). A Boosted Decision Trees (BDT) multi-classification algorithm is employed to classify the centrality of the collision events based on the raw features from ZDC such as the number of fired channels and de…
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The Zero Degree Calorimeter (ZDC) plays a crucial role in determining centrality at the Cooling-Storage-Ring External-target Experiment (CEE) in the Heavy Ion Research Facility in Lanzhou (HIRFL). A Boosted Decision Trees (BDT) multi-classification algorithm is employed to classify the centrality of the collision events based on the raw features from ZDC such as the number of fired channels and deposited energy. The data from simulated $\rm ^{238}U$ + $\rm ^{238}U$ collisions at 500 $\rm MeV/u$, generated by the IQMD event generator and subsequently modeled through the GEANT4 package, is employed to train and test the BDT model. The results showed the high accuracy of the multi-classification model adopted in ZDC for centrality determination, which is robust against variations in different factors of detector geometry and response. The study demonstrates a good performance of the CEE-ZDC for determining the centrality in nucleus-nucleus collisions.
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Submitted 15 April, 2023;
originally announced April 2023.
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Topmetal-M: a novel pixel sensor for compact tracking applications
Authors:
Wei** Ren,
Wei Zhou,
Bihui You,
Ni Fang,
Yan Wang,
Haibo Yang,
Honglin Zhang,
Yao Wang,
Jun Liu,
Xianqin Li,
** Yang,
Le Xiao,
YuezhaoZhang,
Xiangru Qu,
Shuguang Zou,
GuangmingHuang,
Hua Pei,
Fan Shen,
Dong Wang,
Xiaoyang Niu,
Yuan Mei,
Yubo Han,
ChaosongGao,
Xiangming Sun,
Chengxin Zhao
Abstract:
The Topmetal-M is a large area pixel sensor (18 mm * 23 mm) prototype fabricated in a new 130 nm high-resistivity CMOS process in 2019. It contains 400 rows * 512 columns square pixels with the pitch of 40 μm. In Topmetal-M, a novel charge collection method combing the Monolithic Active Pixel Sensor (MAPS) and the Topmetal sensor has been proposed for the first time. Both the ionized charge deposi…
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The Topmetal-M is a large area pixel sensor (18 mm * 23 mm) prototype fabricated in a new 130 nm high-resistivity CMOS process in 2019. It contains 400 rows * 512 columns square pixels with the pitch of 40 μm. In Topmetal-M, a novel charge collection method combing the Monolithic Active Pixel Sensor (MAPS) and the Topmetal sensor has been proposed for the first time. Both the ionized charge deposited by the particle in the sensor and along the track over the sensor can be collected. The in-pixel circuit mainly consists of a low-noise charge sensitive amplifier to establish the signal for the energy reconstruction, and a discriminator with a Time-to-Amplitude Converter (TAC) for the Time of Arrival (TOA) measurement. With this mechanism, the trajectory, particle hit position, energy and arrival time of the particle can be measured. The analog signal from each pixel is accessible through time-shared multiplexing over the entire pixel array. This paper will discuss the design and preliminary test results of the Topmetal-M sensor.
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Submitted 26 January, 2022;
originally announced January 2022.
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First demonstration of in-beam performance of bent Monolithic Active Pixel Sensors
Authors:
ALICE ITS project,
:,
G. Aglieri Rinella,
M. Agnello,
B. Alessandro,
F. Agnese,
R. S. Akram,
J. Alme,
E. Anderssen,
D. Andreou,
F. Antinori,
N. Apadula,
P. Atkinson,
R. Baccomi,
A. Badalà,
A. Balbino,
C. Bartels,
R. Barthel,
F. Baruffaldi,
I. Belikov,
S. Beole,
P. Becht,
A. Bhatti,
M. Bhopal,
N. Bianchi
, et al. (230 additional authors not shown)
Abstract:
A novel approach for designing the next generation of vertex detectors foresees to employ wafer-scale sensors that can be bent to truly cylindrical geometries after thinning them to thicknesses of 20-40$μ$m. To solidify this concept, the feasibility of operating bent MAPS was demonstrated using 1.5$\times$3cm ALPIDE chips. Already with their thickness of 50$μ$m, they can be successfully bent to ra…
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A novel approach for designing the next generation of vertex detectors foresees to employ wafer-scale sensors that can be bent to truly cylindrical geometries after thinning them to thicknesses of 20-40$μ$m. To solidify this concept, the feasibility of operating bent MAPS was demonstrated using 1.5$\times$3cm ALPIDE chips. Already with their thickness of 50$μ$m, they can be successfully bent to radii of about 2cm without any signs of mechanical or electrical damage. During a subsequent characterisation using a 5.4GeV electron beam, it was further confirmed that they preserve their full electrical functionality as well as particle detection performance.
In this article, the bending procedure and the setup used for characterisation are detailed. Furthermore, the analysis of the beam test, including the measurement of the detection efficiency as a function of beam position and local inclination angle, is discussed. The results show that the sensors maintain their excellent performance after bending to radii of 2cm, with detection efficiencies above 99.9% at typical operating conditions, paving the way towards a new class of detectors with unprecedented low material budget and ideal geometrical properties.
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Submitted 17 August, 2021; v1 submitted 27 May, 2021;
originally announced May 2021.
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How Molecular Chiralities of Bis(mandelato)borate Anions affect Their Binding Structures with Alkali Metal Ions and Microstructural Properties in Tetraalkylphosphonium Ionic Liquids
Authors:
Han-Wen Pei,
Bin Li,
Aatto Laaksonen,
Yong-Lei Wang
Abstract:
Spiroborate anions based inorganic electrolytes and ionic liquids (ILs) have fascinating electrochemical and tribological properties, and have received widespread attention in industrial applications. Molecular chiralities of spiroborate anions have a significant effect on microstructures and macroscopic functionalities of these ionic materials in applications, and thus deserve a fundamental under…
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Spiroborate anions based inorganic electrolytes and ionic liquids (ILs) have fascinating electrochemical and tribological properties, and have received widespread attention in industrial applications. Molecular chiralities of spiroborate anions have a significant effect on microstructures and macroscopic functionalities of these ionic materials in applications, and thus deserve a fundamental understanding. In current work, we performed quantum chemistry calculations to address binding strength and coordination structures of chiral bis(mandelato)borate ([BMB]) anions with representative alkali metal ions, as well as electronic properties of alkali metal ion-[BMB] ion pair complexes. The optimized [BMB] conformers are categorized into V-shaped, bent, and twisted structures with varied electrostatic potential contours, conformational energies, and distinct alkali metal ion-[BMB] binding structures. Alkali metal ions have additional associations with phenyl groups in V-shaped [BMB] conformers owing to preferential cation-$π$ interactions. Furthermore, effects of molecular chiralities of [BMB] anions on thermodynamics and microstructural properties of tetraalkylphosphonium [BMB] ILs were studied by performing extensive atomistic interactions. Oxygen atoms in [BMB] anions have competitive hydrogen bonding interactions with hydrogen atoms in cations depending on molecular chiralities and steric hindrance effects of [BMB] anions. However, molecular chiralities of [BMB] anions have negligible effect on liquid densities of tetraalkylphosphonium [BMB] ILs and spatial distributions of boron atoms in anions around phosphorous atoms in cations. Enlarging tetraalkylphosphonium cation sizes leads to enhanced cation-anion hydrogen bonding and Coulombic interactions due to enhanced segregation of polar groups in apolar networks in heterogeneous IL matrices.
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Submitted 26 January, 2020;
originally announced January 2020.
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A next-generation LHC heavy-ion experiment
Authors:
D. Adamová,
G. Aglieri Rinella,
M. Agnello,
Z. Ahammed,
D. Aleksandrov,
A. Alici,
A. Alkin,
T. Alt,
I. Altsybeev,
D. Andreou,
A. Andronic,
F. Antinori,
P. Antonioli,
H. Appelshäuser,
R. Arnaldi,
I. C. Arsene,
M. Arslandok,
R. Averbeck,
M. D. Azmi,
X. Bai,
R. Bailhache,
R. Bala,
L. Barioglio,
G. G. Barnaföldi,
L. S. Barnby
, et al. (374 additional authors not shown)
Abstract:
The present document discusses plans for a compact, next-generation multi-purpose detector at the LHC as a follow-up to the present ALICE experiment. The aim is to build a nearly massless barrel detector consisting of truly cylindrical layers based on curved wafer-scale ultra-thin silicon sensors with MAPS technology, featuring an unprecedented low material budget of 0.05% X$_0$ per layer, with th…
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The present document discusses plans for a compact, next-generation multi-purpose detector at the LHC as a follow-up to the present ALICE experiment. The aim is to build a nearly massless barrel detector consisting of truly cylindrical layers based on curved wafer-scale ultra-thin silicon sensors with MAPS technology, featuring an unprecedented low material budget of 0.05% X$_0$ per layer, with the innermost layers possibly positioned inside the beam pipe. In addition to superior tracking and vertexing capabilities over a wide momentum range down to a few tens of MeV/$c$, the detector will provide particle identification via time-of-flight determination with about 20~ps resolution. In addition, electron and photon identification will be performed in a separate shower detector. The proposed detector is conceived for studies of pp, pA and AA collisions at luminosities a factor of 20 to 50 times higher than possible with the upgraded ALICE detector, enabling a rich physics program ranging from measurements with electromagnetic probes at ultra-low transverse momenta to precision physics in the charm and beauty sector.
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Submitted 2 May, 2019; v1 submitted 31 January, 2019;
originally announced February 2019.
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Simulation Study of Energy Resolution with Changing Pixel Size for Radon Monitor Based on \textit{Topmetal-${II}^-$} TPC
Authors:
Mengyao Huang,
Hua Pei,
Xiangming Sun,
Shuguang Zou
Abstract:
In this paper, we study how pixel size influences energy resolution for a proposed pixelated detector---a high sensitivity, low cost, and real-time radon monitor based on \textit{Topmetal-${II}^-$} time projection chamber (TPC). Using \textit{Topmetal-${II}^-$} sensors assembled by 0.35 $μ$m CMOS Integrated Circuit process, this monitor is designed to improve the spatial resolution of detecting ra…
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In this paper, we study how pixel size influences energy resolution for a proposed pixelated detector---a high sensitivity, low cost, and real-time radon monitor based on \textit{Topmetal-${II}^-$} time projection chamber (TPC). Using \textit{Topmetal-${II}^-$} sensors assembled by 0.35 $μ$m CMOS Integrated Circuit process, this monitor is designed to improve the spatial resolution of detecting radon alpha particles. Concerning small pixel size might has a side effect of worsening energy resolution due to lower signal to noise ratio, a Great4-based simulation is used to figure out energy resolution dependence on pixel size ranging from 60 $μ$m to 600 $μ$m. A non-monotonic trend in this region shows a combination effect of pixel size with threshold on pixel, and is analyzed by introducing an empirical expression. Noise on pixel contributes 50 keV Full Width at Half Maximum (FWHM) energy resolution for 400 $μ$m pixel size at 1 $\sim$ 4 $σ$ threshold, which is comparable to the energy resolution caused by energy fluctuation in ionization process of TPC ($\sim$ 20 keV). The total energy resolution after combining both factors is estimated to be 54 keV for 400 $μ$m pixel size at 1 $\sim$ 4 $σ$ threshold. The analysis presented in this paper is helpful to choosing suitable pixel size for future pixelated detectors.
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Submitted 4 January, 2019; v1 submitted 14 December, 2017;
originally announced December 2017.
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A beam monitor using silicon pixel sensors for hadron therapy
Authors:
Zhen Wang,
Shuguang Zou,
Yan Fan,
Jun Liu,
Xiangming Sun,
Dong Wang,
Huili Kang,
Daming Sun,
** Yang,
Hua Pei,
Guangming Huang,
Nu Xu,
Chaosong Gao,
Le Xiao
Abstract:
We report the design and test results of a beam monitor developed for online monitoring in hadron therapy. The beam monitor uses eight silicon pixel sensors, \textit{Topmetal-${II}^-$}, as the anode array. \textit{Topmetal-${II}^-$} is a charge sensor designed in a CMOS 0.35 $μ$m technology. Each \textit{Topmetal-${II}^-$} sensor has $72\times72$ pixels and the pixel size is $83\times83$ $μ$m$^2$.…
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We report the design and test results of a beam monitor developed for online monitoring in hadron therapy. The beam monitor uses eight silicon pixel sensors, \textit{Topmetal-${II}^-$}, as the anode array. \textit{Topmetal-${II}^-$} is a charge sensor designed in a CMOS 0.35 $μ$m technology. Each \textit{Topmetal-${II}^-$} sensor has $72\times72$ pixels and the pixel size is $83\times83$ $μ$m$^2$. In our design, the beam passes through the beam monitor without hitting the electrodes, making the beam monitor especially suitable for monitoring heavy ion beams. This design also reduces radiation damage to the beam monitor itself. The beam monitor is tested with a carbon ion beam at the Heavy Ion Research Facility in Lanzhou (HIRFL). Results indicate that the beam monitor can measure position, incidence angle and intensity of the beam with a position resolution better than 20 $μ$m, angular resolution about 0.5$^\circ$ and intensity statistical accuracy better than 2$\%$.
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Submitted 19 January, 2017; v1 submitted 22 November, 2016;
originally announced November 2016.
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A highly pixelated CdZnTe detector based on \textit{Topmetal-${II}^-$} sensor
Authors:
Shuguang Zou,
Yan Fan,
Xiangming Sun,
Guangming Huang,
Hua Pei,
Zhen Wang,
Jun Liu,
** Yang,
Dong Wang
Abstract:
\textit{Topmetal-${II}^-$} is a low noise CMOS pixel direct charge sensor with a pitch of 83$μm$. CdZnTe is an excellent semiconductor material for radiation detection. The combination of CdZnTe and the sensor makes it possible to build a detector with high spatial resolution. In our experiments, an epoxy adhesive is used as the conductive medium to connect the sensor and Cadmium Zinc Telluride (C…
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\textit{Topmetal-${II}^-$} is a low noise CMOS pixel direct charge sensor with a pitch of 83$μm$. CdZnTe is an excellent semiconductor material for radiation detection. The combination of CdZnTe and the sensor makes it possible to build a detector with high spatial resolution. In our experiments, an epoxy adhesive is used as the conductive medium to connect the sensor and Cadmium Zinc Telluride (CdZnTe). The diffusion coefficient and charge efficiency of electrons are measured at a low bias voltage of -2 Volts, and the image of a single alpha is clear with a reasonable spatial resolution. The detector of such structure has the potential to be applied in X-ray imaging systems with a further improvements of the sensor.
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Submitted 11 January, 2017; v1 submitted 13 November, 2016;
originally announced November 2016.
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Detailed study of the column-based priority logic readout of Topmetal-II- CMOS pixel direct charge sensor
Authors:
Mangmang An,
Chufeng Chen,
Chaosong Gao,
Mikyung Han,
Guangming Huang,
Rong Ji,
Xiaoting Li,
Yuan Mei,
Hua Pei,
Quan Sun,
Xiangming Sun,
Kai Wang,
Le Xiao,
** Yang,
Wei Zhang,
Wei Zhou
Abstract:
We present the detailed study of the digital readout of Topmetal-II- CMOS pixel direct charge sensor. Topmetal-II- is an integrated sensor with an array of 72X72 pixels each capable of directly collecting external charge through exposed metal electrodes in the topmost metal layer. In addition to the time-shared multiplexing readout of the analog output from Charge Sensitive Amplifiers in each pixe…
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We present the detailed study of the digital readout of Topmetal-II- CMOS pixel direct charge sensor. Topmetal-II- is an integrated sensor with an array of 72X72 pixels each capable of directly collecting external charge through exposed metal electrodes in the topmost metal layer. In addition to the time-shared multiplexing readout of the analog output from Charge Sensitive Amplifiers in each pixel, hits are also generated through comparators with individually DAC settable thresholds in each pixel. The hits are read out via a column-based priority logic structure, retaining both hit location and time information. The in-array column-based priority logic is fully combinational hence there is no clock distributed in the pixel array. Sequential logic and clock are placed on the peripheral of the array. We studied the detailed working behavior and performance of this readout, and demonstrated its potential in imaging applications.
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Submitted 23 August, 2016;
originally announced August 2016.
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Test of \textit{Topmetal-${II}^-$} In Liquid Nitrogen For Cryogenic Temperature TPCs
Authors:
Shuguang Zou,
Yan Fan,
Mangmang An,
Chufeng Chen,
Guangming Huang,
Xiaoting Li,
Jun Liu,
Hua Pei,
Xiangming Sun,
** Yang,
Dong Wang,
Le Xiao,
Zhen Wang,
Kai Wang,
Wei Zhou
Abstract:
\textit{Topmetal-${II}^-$} is a highly pixelated direct charge sensor that contains a 72${\times}$72 pixel array of 83$μ$m pitch size. The key feature of \textit{Topmetal-${II}^-$} is that it can directly collect charges via metal nodes of each pixel to form two-dimensional images of charge cloud distributions. \textit{Topmetal-${II}^-$} was proved to measure charged particles without amplificatio…
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\textit{Topmetal-${II}^-$} is a highly pixelated direct charge sensor that contains a 72${\times}$72 pixel array of 83$μ$m pitch size. The key feature of \textit{Topmetal-${II}^-$} is that it can directly collect charges via metal nodes of each pixel to form two-dimensional images of charge cloud distributions. \textit{Topmetal-${II}^-$} was proved to measure charged particles without amplification at room temperature. To measure its performance at cryogenic temperature, a \textit{Topmetal-${II}^-$} sensor is embedded into a liquid nitrogen dewar. The results presented in this paper show that \textit{Topmetal-${II}^-$} can also operate well at this low temperature with a noise (ENC) of 12 e$^-$ lower than that at room temperature (13 e$^-$). From the noise perspective, \textit{Topmetal-${II}^-$} is a promising candidate for the next generation readout of liquid argon and xenon Time Projection Chamber (TPC) used in experiments searching for neutrinoless double beta decay and dark matter.
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Submitted 6 June, 2016; v1 submitted 26 January, 2016;
originally announced January 2016.
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Development of a highly pixelated direct charge sensor, Topmetal-I, for ionizing radiation imaging
Authors:
Yan Fan,
Chaosong Gao,
Guangming Huang,
Xiaoting Li,
Yuan Mei,
Hua Pei,
Quan Sun,
Xiangming Sun,
Dong Wang,
Zhen Wang,
Le Xiao,
** Yang
Abstract:
Using industrial standard 0.35μm CMOS Integrated Circuit process, we realized a highly pixelated sensor that directly collects charge via metal nodes placed on the top of each pixel and forms two dimensional images of charge cloud distribution. The first version, Topmetal-I, features a 64x64 pixel array of 80μm pitch size. Direct charge calibration reveals an average capacitance of 210fF per pixel…
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Using industrial standard 0.35μm CMOS Integrated Circuit process, we realized a highly pixelated sensor that directly collects charge via metal nodes placed on the top of each pixel and forms two dimensional images of charge cloud distribution. The first version, Topmetal-I, features a 64x64 pixel array of 80μm pitch size. Direct charge calibration reveals an average capacitance of 210fF per pixel. The charge collection noise is near the thermal noise limit. With the readout, individual pixel channels exhibit a most probable equivalent noise charge of 330e-.
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Submitted 14 July, 2014;
originally announced July 2014.
