Showing 1–6 of 6 results for author: Neher, C

Pressure Dependence of Carbon Foam Bonding Strength using Reactive Film

Authors: Maxwell Chertok, Jeske Dioquino, Jeremy Hansen, Michael Irving, Christian Neher, Mani Tripathi, Yao Yao, Gayle Zheng

Abstract: Reactive bonding film is a relatively new method of fusing materials with the potential to meet needs of particle tracker mechanics under development due to its resulting tensile strength, thermal conductivity, radiation tolerance, and low mass. Employing a new apparatus to vary pressure applied to samples during bonding, we find improved ultimate tensile strengths compared with previous results. Reactive bonding film is a relatively new method of fusing materials with the potential to meet needs of particle tracker mechanics under development due to its resulting tensile strength, thermal conductivity, radiation tolerance, and low mass. Employing a new apparatus to vary pressure applied to samples during bonding, we find improved ultimate tensile strengths compared with previous results. △ Less

Submitted 3 July, 2018; originally announced July 2018.

Comments: 5 pages, 4 figures, 1 table

On the Evaluation of Silicon Photomultipliers for Use as Photosensors in Liquid Xenon Detectors

Authors: Benjamin Godfrey, Tyler Anderson, Earl Breedon, Jacob Cutter, Navneet Dhaliwal, Olivia Dalager, Seth Hillbrand, Michael Irving, Aaron Manalaysay, Juan Montoya, James Morad, Christian Neher, Dustin Stolp, Mani Tripathi, Ryan Wilson

Abstract: Silicon photomultipliers (SiPMs) are potential solid-state alternatives to traditional photomultiplier tubes (PMTs) for single-photon detection. In this paper, we report on evaluating SensL MicroFC-10035-SMT SiPMs for their suitability as PMT replacements. The devices were successfully operated in a liquid-xenon detector, which demonstrates that SiPMs can be used in noble element time projection c… ▽ More Silicon photomultipliers (SiPMs) are potential solid-state alternatives to traditional photomultiplier tubes (PMTs) for single-photon detection. In this paper, we report on evaluating SensL MicroFC-10035-SMT SiPMs for their suitability as PMT replacements. The devices were successfully operated in a liquid-xenon detector, which demonstrates that SiPMs can be used in noble element time projection chambers as photosensors. The devices were also cooled down to 170 K to observe dark count dependence on temperature. No dependencies on the direction of an applied 3.2 kV/cm electric field were observed with respect to dark-count rate, gain, or photon detection efficiency. △ Less

Submitted 3 April, 2018; v1 submitted 16 June, 2017; originally announced June 2017.

Comments: This is an author-created, un-copyedited version of an article accepted for publication/published in Journal of Instrumentation. IOP Publishing Ltd is not responsible for any errors or omissions in this version of the manuscript or any version derived from it. The Version of Record is available online at https://doi.org/10.1088/1748-0221/13/03/C03041

Journal ref: B. Godfrey, T. Anderson, E. Breedon, J. Cutter, N. Dhaliwal, O.Dalager et al., 2018 On the Evaluation of Silicon Photomultipliers for Use as Photosensors in Liquid Xenon Detectors JINST 13 C03041

Thermal and Tensile Strength Testing of Thermally-Conductive Adhesives and Carbon Foam

Authors: Maxwell Chertok, Minmin Fu, Michael Irving, Christian Neher, Mengyao Shi, Kirk Tolfa, Mani Tripathi, Yasmeen Vinson, Ruby Wang, Gayle Zheng

Abstract: Future collider detectors, including silicon tracking detectors planned for the High Luminosity LHC, will require components and mechanical structures providing unprecedented strength-to-mass ratios, thermal conductivity, and radiation tolerance. This paper studies carbon foam used in conjunction with thermally conductive epoxy and thermally conductive tape for such applications. Thermal performan… ▽ More Future collider detectors, including silicon tracking detectors planned for the High Luminosity LHC, will require components and mechanical structures providing unprecedented strength-to-mass ratios, thermal conductivity, and radiation tolerance. This paper studies carbon foam used in conjunction with thermally conductive epoxy and thermally conductive tape for such applications. Thermal performance and tensile strength measurements of aluminum-carbon foam-adhesive stacks are reported, along with initial radiation damage test results. △ Less

Submitted 16 January, 2017; v1 submitted 29 August, 2016; originally announced August 2016.

Comments: 10 pages, 10 figures

Journal ref: 2017 JINST 12 P01010

Reactive Bonding Film for Bonding Carbon Foam Through Metal Extrusion

Authors: Maxwell Chertok, Minmin Fu, Michael Irving, Christian Neher, Mani Tripathi, Ruby Wang, Gayle Zheng

Abstract: Future tracking detectors, such as those under development for the High Luminosity LHC, will require mechanical structures employing novel materials to reduce mass while providing excellent strength, thermal conductivity, and radiation tolerance. Adhesion methods for such materials are under study at present. This paper demonstrates the use of reactive bonding film as an adhesion method for bondin… ▽ More Future tracking detectors, such as those under development for the High Luminosity LHC, will require mechanical structures employing novel materials to reduce mass while providing excellent strength, thermal conductivity, and radiation tolerance. Adhesion methods for such materials are under study at present. This paper demonstrates the use of reactive bonding film as an adhesion method for bonding carbon foam. △ Less

Submitted 24 March, 2017; v1 submitted 24 June, 2016; originally announced June 2016.

Comments: 9 pages, 7 figures, 1 table

Journal ref: 2017_JINST_12_T03005

Further Developments in Gold-stud Bump Bonding

Authors: C. Neher, R. L. Lander, A. Moskaleva, J. Pasner, M. Tripathi, M. Woods

Abstract: As silicon detectors in high energy physics experiments require increasingly complex assembly procedures, the availability of a wide variety of interconnect technologies provides more options for overcoming obstacles in generic R&D. Gold ball bonding has been a staple in the interconnect industry due to its ease of use and reliability. However, due to some limitations in the standard technique, al… ▽ More As silicon detectors in high energy physics experiments require increasingly complex assembly procedures, the availability of a wide variety of interconnect technologies provides more options for overcoming obstacles in generic R&D. Gold ball bonding has been a staple in the interconnect industry due to its ease of use and reliability. However, due to some limitations in the standard technique, alternate methods of gold-stud bonding are being developed. This paper presents recent progress and challenges faced in the development of double gold-stud bonding and 0.5 mil wire gold-stud bonding at the UC Davis Facility for Interconnect Technology. Advantages and limitations of each technique are analyzed to provide insight into potential applications for each method. Optimization of procedures and parameters is also presented. △ Less

Submitted 5 December, 2011; originally announced December 2011.

Comments: TWEPP 2011 conference proceeding, 8 pages, 7 figures

Development of Readout Interconnections for the Si-W Calorimeter of SiD

Authors: M. Woods, R. G. Fields, B. Holbrook, R. L. Lander, A. Moskaleva, C. Neher, J. Pasner, M. Tripathi, J. E. Brau, R. E. Frey, D. Strom, M. Breidenbach, D. Freytag, G. Haller, R. Herbst, T. Nelson, S. Schier, B. Schumm

Abstract: The SiD collaboration is develo** a Si-W sampling electromagnetic calorimeter, with anticipated application for the International Linear Collider. Assembling the modules for such a detector will involve special bonding technologies for the interconnections, especially for attaching a silicon detector wafer to a flex cable readout bus. We review the interconnect technologies involved, including o… ▽ More The SiD collaboration is develo** a Si-W sampling electromagnetic calorimeter, with anticipated application for the International Linear Collider. Assembling the modules for such a detector will involve special bonding technologies for the interconnections, especially for attaching a silicon detector wafer to a flex cable readout bus. We review the interconnect technologies involved, including oxidation removal processes, pad surface preparation, solder ball selection and placement, and bond quality assurance. Our results show that solder ball bonding is a promising technique for the Si-W ECAL, and unresolved issues are being addressed. △ Less

Submitted 21 November, 2011; v1 submitted 31 October, 2011; originally announced October 2011.

Comments: 8 pages + title, 6 figures