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Characterisation of analogue Monolithic Active Pixel Sensor test structures implemented in a 65 nm CMOS imaging process
Authors:
Gianluca Aglieri Rinella,
Giacomo Alocco,
Matias Antonelli,
Roberto Baccomi,
Stefania Maria Beole,
Mihail Bogdan Blidaru,
Bent Benedikt Buttwill,
Eric Buschmann,
Paolo Camerini,
Francesca Carnesecchi,
Marielle Chartier,
Yongjun Choi,
Manuel Colocci,
Giacomo Contin,
Dominik Dannheim,
Daniele De Gruttola,
Manuel Del Rio Viera,
Andrea Dubla,
Antonello di Mauro,
Maurice Calvin Donner,
Gregor Hieronymus Eberwein,
Jan Egger,
Laura Fabbietti,
Finn Feindt,
Kunal Gautam
, et al. (69 additional authors not shown)
Abstract:
Analogue test structures were fabricated using the Tower Partners Semiconductor Co. CMOS 65 nm ISC process. The purpose was to characterise and qualify this process and to optimise the sensor for the next generation of Monolithic Active Pixels Sensors for high-energy physics. The technology was explored in several variants which differed by: do** levels, pixel geometries and pixel pitches (10-25…
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Analogue test structures were fabricated using the Tower Partners Semiconductor Co. CMOS 65 nm ISC process. The purpose was to characterise and qualify this process and to optimise the sensor for the next generation of Monolithic Active Pixels Sensors for high-energy physics. The technology was explored in several variants which differed by: do** levels, pixel geometries and pixel pitches (10-25 $μ$m). These variants have been tested following exposure to varying levels of irradiation up to 3 MGy and $10^{16}$ 1 MeV n$_\text{eq}$ cm$^{-2}$. Here the results from prototypes that feature direct analogue output of a 4$\times$4 pixel matrix are reported, allowing the systematic and detailed study of charge collection properties. Measurements were taken both using $^{55}$Fe X-ray sources and in beam tests using minimum ionizing particles. The results not only demonstrate the feasibility of using this technology for particle detection but also serve as a reference for future applications and optimisations.
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Submitted 13 March, 2024;
originally announced March 2024.
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Digital Pixel Test Structures implemented in a 65 nm CMOS process
Authors:
Gianluca Aglieri Rinella,
Anton Andronic,
Matias Antonelli,
Mauro Aresti,
Roberto Baccomi,
Pascal Becht,
Stefania Beole,
Justus Braach,
Matthew Daniel Buckland,
Eric Buschmann,
Paolo Camerini,
Francesca Carnesecchi,
Leonardo Cecconi,
Edoardo Charbon,
Giacomo Contin,
Dominik Dannheim,
Joao de Melo,
Wen**g Deng,
Antonello di Mauro,
Jan Hasenbichler,
Hartmut Hillemanns,
Geun Hee Hong,
Artem Isakov,
Antoine Junique,
Alex Kluge
, et al. (27 additional authors not shown)
Abstract:
The ALICE ITS3 (Inner Tracking System 3) upgrade project and the CERN EP R&D on monolithic pixel sensors are investigating the feasibility of the Tower Partners Semiconductor Co. 65 nm process for use in the next generation of vertex detectors. The ITS3 aims to employ wafer-scale Monolithic Active Pixel Sensors thinned down to 20 to 40 um and bent to form truly cylindrical half barrels. Among the…
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The ALICE ITS3 (Inner Tracking System 3) upgrade project and the CERN EP R&D on monolithic pixel sensors are investigating the feasibility of the Tower Partners Semiconductor Co. 65 nm process for use in the next generation of vertex detectors. The ITS3 aims to employ wafer-scale Monolithic Active Pixel Sensors thinned down to 20 to 40 um and bent to form truly cylindrical half barrels. Among the first critical steps towards the realisation of this detector is to validate the sensor technology through extensive characterisation both in the laboratory and with in-beam measurements. The Digital Pixel Test Structure (DPTS) is one of the prototypes produced in the first sensor submission in this technology and has undergone a systematic measurement campaign whose details are presented in this article.
The results confirm the goals of detection efficiency and non-ionising and ionising radiation hardness up to the expected levels for ALICE ITS3 and also demonstrate operation at +20 C and a detection efficiency of 99% for a DPTS irradiated with a dose of $10^{15}$ 1 MeV n$_{\mathrm{eq}}/$cm$^2$. Furthermore, spatial, timing and energy resolutions were measured at various settings and irradiation levels.
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Submitted 10 July, 2023; v1 submitted 16 December, 2022;
originally announced December 2022.
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Performance of the Electromagnetic Pixel Calorimeter Prototype EPICAL-2
Authors:
J. Alme,
R. Barthel,
A. van Bochove,
V. Borshchov,
R. Bosley,
A. van den Brink,
E. Broeils,
H. Büsching,
V. N. Eikeland,
O. S. Groettvik,
Y. H. Han,
N. van der Kolk,
J. H. Kim,
T. J. Kim,
Y. Kwon,
M. Mager,
Q. W. Malik,
E. Okkinga,
T. Y. Park,
T. Peitzmann,
F. Pliquett,
M. Protsenko,
F. Reidt,
S. van Rijk,
K. Røed
, et al. (9 additional authors not shown)
Abstract:
The first evaluation of an ultra-high granularity digital electromagnetic calorimeter prototype using 1.0-5.8 GeV/c electrons is presented. The $25\times10^6$ pixel detector consists of 24 layers of ALPIDE CMOS MAPS sensors, with a pitch of around 30~$μ$m, and has a depth of almost 20 radiation lengths of tungsten absorber. Ultra-thin cables allow for a very compact design. The properties that are…
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The first evaluation of an ultra-high granularity digital electromagnetic calorimeter prototype using 1.0-5.8 GeV/c electrons is presented. The $25\times10^6$ pixel detector consists of 24 layers of ALPIDE CMOS MAPS sensors, with a pitch of around 30~$μ$m, and has a depth of almost 20 radiation lengths of tungsten absorber. Ultra-thin cables allow for a very compact design. The properties that are critical for physics studies are measured: electromagnetic shower response, energy resolution and linearity. The stochastic energy resolution is comparable with the state-of-the art resolution for a Si-W calorimeter, with data described well by a simulation model using GEANT and Allpix$^2$. The performance achieved makes this technology a good candidate for use in the ALICE FoCal upgrade, and in general demonstrates the strong potential for future applications in high-energy physics.
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Submitted 28 December, 2022; v1 submitted 6 September, 2022;
originally announced September 2022.
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Results from the EPICAL-2 Ultra-High Granularity Electromagnetic Calorimeter Prototype
Authors:
T. Peitzmann,
J. Alme,
R. Barthel,
A. van Bochove,
V. Borshchov,
R. Bosley,
A. van den Brink,
E. Broeils,
H. Büsching,
V. N. Eikeland,
O. S. Groettvik,
Y. H. Han,
N. van der Kolk,
J. H. Kim,
T. J. Kim,
Y. Kwon,
M. Mager,
Q. W. Malik,
E. Okkinga,
T. Y. Park,
F. Pliquett,
M. Protsenko,
F. Reidt,
S. van Rijk,
K. Røed
, et al. (9 additional authors not shown)
Abstract:
A prototype of a new type of calorimeter has been designed and constructed, based on a silicon-tungsten sampling design using pixel sensors with digital readout. It makes use of the Alpide MAPS sensor developed for the ALICE ITS upgrade. A binary readout is possible due to the pixel size of $\approx 30 \times 30 \, μ\mathrm{m}^2$. This prototype has been successfully tested with cosmic muons and w…
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A prototype of a new type of calorimeter has been designed and constructed, based on a silicon-tungsten sampling design using pixel sensors with digital readout. It makes use of the Alpide MAPS sensor developed for the ALICE ITS upgrade. A binary readout is possible due to the pixel size of $\approx 30 \times 30 \, μ\mathrm{m}^2$. This prototype has been successfully tested with cosmic muons and with test beams at DESY and the CERN SPS. We report on performance results obtained at DESY, showing good energy resolution and linearity, and compare to detailed MC simulations. Also shown are preliminary results of the high-energy performance as measured at the SPS. The two-shower separation capabilities are discussed.
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Submitted 27 September, 2022; v1 submitted 5 July, 2022;
originally announced July 2022.
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The MAPS foil
Authors:
S. Beolé,
F. Carnesecchi,
G. Contin,
R. de Oliveira,
A. di Mauro,
S. Ferry,
H. Hillemanns,
A. Junique,
A. Kluge,
L. Lautner,
M. Mager,
B. Mehl,
K. Rebane,
F. Reidt,
I. Sanna,
M. Šuljić,
A. Yüncü
Abstract:
We present a method of embedding a Monolithic Active Pixel Sensor (MAPS) into a flexible printed circuit board (FPC) and its interconnection by means of through-hole copper plating. The resulting assembly, baptised "MAPS foil", is a flexible, light, protected, and fully integrated detector module. By using widely available printed circuit board manufacturing techniques, the production of these dev…
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We present a method of embedding a Monolithic Active Pixel Sensor (MAPS) into a flexible printed circuit board (FPC) and its interconnection by means of through-hole copper plating. The resulting assembly, baptised "MAPS foil", is a flexible, light, protected, and fully integrated detector module. By using widely available printed circuit board manufacturing techniques, the production of these devices can be scaled easily in size and volume, making it a compelling candidate for future large-scale applications.
A first series of prototypes that embed the ALPIDE chip has been produced, functionally tested, and shown to be working.
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Submitted 19 October, 2022; v1 submitted 25 May, 2022;
originally announced May 2022.
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First demonstration of in-beam performance of bent Monolithic Active Pixel Sensors
Authors:
ALICE ITS project,
:,
G. Aglieri Rinella,
M. Agnello,
B. Alessandro,
F. Agnese,
R. S. Akram,
J. Alme,
E. Anderssen,
D. Andreou,
F. Antinori,
N. Apadula,
P. Atkinson,
R. Baccomi,
A. Badalà,
A. Balbino,
C. Bartels,
R. Barthel,
F. Baruffaldi,
I. Belikov,
S. Beole,
P. Becht,
A. Bhatti,
M. Bhopal,
N. Bianchi
, et al. (230 additional authors not shown)
Abstract:
A novel approach for designing the next generation of vertex detectors foresees to employ wafer-scale sensors that can be bent to truly cylindrical geometries after thinning them to thicknesses of 20-40$μ$m. To solidify this concept, the feasibility of operating bent MAPS was demonstrated using 1.5$\times$3cm ALPIDE chips. Already with their thickness of 50$μ$m, they can be successfully bent to ra…
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A novel approach for designing the next generation of vertex detectors foresees to employ wafer-scale sensors that can be bent to truly cylindrical geometries after thinning them to thicknesses of 20-40$μ$m. To solidify this concept, the feasibility of operating bent MAPS was demonstrated using 1.5$\times$3cm ALPIDE chips. Already with their thickness of 50$μ$m, they can be successfully bent to radii of about 2cm without any signs of mechanical or electrical damage. During a subsequent characterisation using a 5.4GeV electron beam, it was further confirmed that they preserve their full electrical functionality as well as particle detection performance.
In this article, the bending procedure and the setup used for characterisation are detailed. Furthermore, the analysis of the beam test, including the measurement of the detection efficiency as a function of beam position and local inclination angle, is discussed. The results show that the sensors maintain their excellent performance after bending to radii of 2cm, with detection efficiencies above 99.9% at typical operating conditions, paving the way towards a new class of detectors with unprecedented low material budget and ideal geometrical properties.
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Submitted 17 August, 2021; v1 submitted 27 May, 2021;
originally announced May 2021.
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Charge collection properties of TowerJazz 180 nm CMOS Pixel Sensors in dependence of pixel geometries and bias parameters, studied using a dedicated test-vehicle: the Investigator chip
Authors:
G. Aglieri Rinella,
G. Chaosong,
A. di Mauro,
J. Eum,
H. Hillemanns,
A. Junique,
M. Keil,
D. Kim,
H. Kim,
T. Kugathasan,
S. Lee,
M. Mager,
V. Manzari,
C. A. Marin Tobon,
P. Martinengo,
H. Mugnier,
L. Musa,
F. Reidt,
J. Rousset,
K. Sielewicz,
W. Snoeys,
M. Šuljić,
J. W. van Hoorne,
Q. M. Waheed,
P. Yang
, et al. (1 additional authors not shown)
Abstract:
This paper contains a compilation of parameters influencing the charge collection process extracted from a comprehensive study of partially depleted Monolithic Active Pixel Sensors with small (<25 um$^2$) collection electrodes fabricated in the TowerJazz 180 nm CMOS process. These results gave guidance for the optimisation of the diode implemented in ALPIDE, the chip used in the second generation…
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This paper contains a compilation of parameters influencing the charge collection process extracted from a comprehensive study of partially depleted Monolithic Active Pixel Sensors with small (<25 um$^2$) collection electrodes fabricated in the TowerJazz 180 nm CMOS process. These results gave guidance for the optimisation of the diode implemented in ALPIDE, the chip used in the second generation Inner Tracking System of ALICE, and serve as reference for future simulation studies of similar devices. The studied parameters include: reverse substrate bias, epitaxial layer thickness, charge collection electrode size and the spacing of the electrode to surrounding in-pixel electronics. The results from pixels of 28 um pitch confirm that even in partially depleted circuits, charge collection can be fast (<10 ns), and quantify the influence of the parameters onto the signal sharing and amplitudes, highlighting the importance of a correct spacing between wells and of the impact of the reverse substrate bias.
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Submitted 23 September, 2020; v1 submitted 22 September, 2020;
originally announced September 2020.
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Measurement of single event upsets in the ALICE-TPC front-end electronics
Authors:
M. Mager,
L. Musa,
A. Rehman,
A. Szczepankiewicz
Abstract:
The Time Projection Chamber of the ALICE experiment at the CERN Large Hadron Collider features highly integrated on-detector read-out electronics. It is following the general trend of high energy physics experiments by placing the front-end electronics as close to the detector as possible -- only some 10 cm away from its active volume. Being located close to the beams and the interaction region, t…
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The Time Projection Chamber of the ALICE experiment at the CERN Large Hadron Collider features highly integrated on-detector read-out electronics. It is following the general trend of high energy physics experiments by placing the front-end electronics as close to the detector as possible -- only some 10 cm away from its active volume. Being located close to the beams and the interaction region, the electronics is subject to a moderate radiation load, which allowed us to use commercial off-the-shelf components. However, they needed to be selected and qualified carefully for radiation hardness and means had to be taken to protect their functionality against soft errors, i.e. single event upsets.
Here we report on the first measurements of LHC induced radiation effects on ALICE front-end electronics and on how they attest to expectations.
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Submitted 14 October, 2011;
originally announced October 2011.
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The ALICE TPC, a large 3-dimensional tracking device with fast readout for ultra-high multiplicity events
Authors:
J. Alme,
Y. Andres,
H. Appelshauser,
S. Bablok,
N. Bialas,
R. Bolgen,
U. Bonnes,
R. Bramm,
P. Braun-Munzinger,
R. Campagnolo,
P. Christiansen,
A. Dobrin,
C. Engster,
D. Fehlker,
P. Foka,
U. Frankenfeld,
J. J. Gaardhoje,
C. Garabatos,
P. Glassel,
C. Gonzalez Gutierrez,
P. Gros,
H. -A. Gustafsson,
H. Helstrup,
M. Hoch,
M. Ivanov
, et al. (51 additional authors not shown)
Abstract:
The design, construction, and commissioning of the ALICE Time-Projection Chamber (TPC) is described. It is the main device for pattern recognition, tracking, and identification of charged particles in the ALICE experiment at the CERN LHC. The TPC is cylindrical in shape with a volume close to 90 m^3 and is operated in a 0.5 T solenoidal magnetic field parallel to its axis.
In this paper we des…
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The design, construction, and commissioning of the ALICE Time-Projection Chamber (TPC) is described. It is the main device for pattern recognition, tracking, and identification of charged particles in the ALICE experiment at the CERN LHC. The TPC is cylindrical in shape with a volume close to 90 m^3 and is operated in a 0.5 T solenoidal magnetic field parallel to its axis.
In this paper we describe in detail the design considerations for this detector for operation in the extreme multiplicity environment of central Pb--Pb collisions at LHC energy. The implementation of the resulting requirements into hardware (field cage, read-out chambers, electronics), infrastructure (gas and cooling system, laser-calibration system), and software led to many technical innovations which are described along with a presentation of all the major components of the detector, as currently realized. We also report on the performance achieved after completion of the first round of stand-alone calibration runs and demonstrate results close to those specified in the TPC Technical Design Report.
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Submitted 12 January, 2010;
originally announced January 2010.