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Alleviation of Temperature Variation Induced Accuracy Degradation in Ferroelectric FinFET Based Neural Network
Authors:
Sourav De,
Hoang-Hiep Le,
Md. Aftab Baig,
Yao-Jen Lee,
Darsen D. Lu,
Thomas Kämpfe
Abstract:
This paper reports the impacts of temperature variation on the inference accuracy of pre-trained all-ferroelectric FinFET deep neural networks, along with plausible design techniques to abate these impacts. We adopted a pre-trained artificial neural network (N.N.) with 96.4% inference accuracy on the MNIST dataset as the baseline. As an aftermath of temperature change, a compact model captured the…
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This paper reports the impacts of temperature variation on the inference accuracy of pre-trained all-ferroelectric FinFET deep neural networks, along with plausible design techniques to abate these impacts. We adopted a pre-trained artificial neural network (N.N.) with 96.4% inference accuracy on the MNIST dataset as the baseline. As an aftermath of temperature change, a compact model captured the conductance drift of a programmed cell over a wide range of gate biases. We observed a significant inference accuracy degradation in the analog neural network at 233 K for an N.N. trained at 300 K. Finally, we deployed binary neural networks with "read voltage" optimization to ensure immunity of N.N. to accuracy degradation under temperature variation, maintaining an inference accuracy of 96%. Keywords: Ferroelectric memories
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Submitted 15 August, 2022; v1 submitted 3 March, 2021;
originally announced March 2021.
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Formation of Uniform Crystal and Reduction of Electrical Variation in HfZrO$_2$ Ferroelectric Memory by Thermal Engineering
Authors:
Sourav De,
Bo-Han Qiu,
Md. Aftab Baig,
Darsen D. Lu,
Yao-Jen Lee
Abstract:
In this paper we proclaim excellent variation control in Hf$_{0.5}$Zr$_{0.5}$O$_2$ based ferroelectric films obtained by germination of large ferroelectric domain via extended duration of thermal annealing. 10nm thick Hf$_{0.5}$Zr$_{0.5}$O$_2$ based ferroelectric capacitors with TiN as bottom and top electrodes are fabricated and characterized. The duration of rapid thermal annealing (RTA) is vari…
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In this paper we proclaim excellent variation control in Hf$_{0.5}$Zr$_{0.5}$O$_2$ based ferroelectric films obtained by germination of large ferroelectric domain via extended duration of thermal annealing. 10nm thick Hf$_{0.5}$Zr$_{0.5}$O$_2$ based ferroelectric capacitors with TiN as bottom and top electrodes are fabricated and characterized. The duration of rapid thermal annealing (RTA) is varied to observe its effect on crystal formation and device electrical properties at 700C. The device to device variation in terms of coercive voltage and peak capacitance are reduced from 0.4V to 0.01V and from 2*$10^{-5}$nF/cm$^2$ to 4*$10^{-6}$nF/cm$^2$, respectively, by increasing the RTA duration. High resolution transmission electron micrograph clearly shows large and uniform ferroelectric domains with RTA of 180 seconds. Extended duration of RTA likely allows uniform crystal to form, which mitigates the stochasticity of the distribution of ferroelectric and paraelectric domains, and deterministic switching has been infused. This improvement paves the way for implementing Hf$_{0.5}$Zr$_{0.5}$O$_2$ based deeply scaled devices for memory and steep slope device applications.
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Submitted 18 June, 2020;
originally announced June 2020.
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Compact Device Models for FinFET and Beyond
Authors:
Darsen D. Lu,
Mohan V. Dunga,
Ali M. Niknejad,
Chenming Hu,
Fu-Xiang Liang,
Wei-Chen Hung,
Jia-Wei Lee,
Chun-Hsiang Hsu,
Meng-Hsueh Chiang
Abstract:
Compact device models play a significant role in connecting device technology and circuit design. BSIM-CMG and BSIM-IMG are industry standard compact models suited for the FinFET and UTBB technologies, respectively. Its surface potential based modeling framework and symmetry preserving properties make them suitable for both analog/RF and digital design. In the era of artificial intelligence / deep…
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Compact device models play a significant role in connecting device technology and circuit design. BSIM-CMG and BSIM-IMG are industry standard compact models suited for the FinFET and UTBB technologies, respectively. Its surface potential based modeling framework and symmetry preserving properties make them suitable for both analog/RF and digital design. In the era of artificial intelligence / deep learning, compact models further enhanced our ability to explore RRAM and other NVM-based neuromorphic circuits. We have demonstrated simulation of RRAM neuromorphic circuits with Verilog-A based compact model at NCKU. Further abstraction with macromodels is performed to enable larger scale machine learning simulation.
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Submitted 5 May, 2020;
originally announced May 2020.
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A computationally efficient compact model for ferroelectric FETs for the simulation of online training of neural networks
Authors:
Darsen D. Lu,
Sourav De,
Mohammed Aftab Baig,
Bo-Han Qiu,
Yao-Jen Lee
Abstract:
Tri-gate ferroelectric FETs with Hf0.5Zr0.5O2 gate insulator for memory and neuromorphic applications are fabricated and characterized for multi-level operation. The conductance and threshold voltage exhibit highly linear and symmetric characteristics. A compact analytical model is developed to accurately capture FET transfer characteristics, including series resistance, coulombic scattering, and…
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Tri-gate ferroelectric FETs with Hf0.5Zr0.5O2 gate insulator for memory and neuromorphic applications are fabricated and characterized for multi-level operation. The conductance and threshold voltage exhibit highly linear and symmetric characteristics. A compact analytical model is developed to accurately capture FET transfer characteristics, including series resistance, coulombic scattering, and vertical field dependent mobility degradation effects, as well as the evolvement of threshold voltage and mobility with ferroelectric polarization switching. The model covers both sub-threshold and strong inversion operation. Additional measurements confirm ferroelectric switching as opposed to carrier-trap**-based memory operation. The compact model is implemented in a simulation platform for online training of deep neural networks.
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Submitted 8 April, 2020;
originally announced April 2020.
