An elongated quantum dot as a distributed charge sensor
Authors:
S. M. Patomäki,
J. Williams,
F. Berritta,
C. Laine,
M. A. Fogarty,
R. C. C. Leon,
J. Jussot,
S. Kubicek,
A. Chatterjee,
B. Govoreanu,
F. Kuemmeth,
J. J. L. Morton,
M. F. Gonzalez-Zalba
Abstract:
Increasing the separation between semiconductor quantum dots offers scaling advantages by fa- cilitating gate routing and the integration of sensors and charge reservoirs. Elongated quantum dots have been utilized for this purpose in GaAs heterostructures to extend the range of spin-spin interactions. Here, we study a metal-oxide-semiconductor (MOS) device where two quantum dot arrays are separate…
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Increasing the separation between semiconductor quantum dots offers scaling advantages by fa- cilitating gate routing and the integration of sensors and charge reservoirs. Elongated quantum dots have been utilized for this purpose in GaAs heterostructures to extend the range of spin-spin interactions. Here, we study a metal-oxide-semiconductor (MOS) device where two quantum dot arrays are separated by an elongated quantum dot (340 nm long, 50 nm wide). We monitor charge transitions of the elongated quantum dot by measuring radiofrequency single-electron currents to a reservoir to which we connect a lumped-element resonator. We operate the dot as a single electron box to achieve charge sensing of remote quantum dots in each array, separated by a distance of 510 nm. Simultaneous charge detection on both ends of the elongated dot demonstrates that the charge is well distributed across its nominal length, supported by the simulated quantum-mechanical electron density. Our results illustrate how single-electron boxes can be realised with versatile foot- prints that may enable novel and compact quantum processor layouts, offering distributed charge sensing in addition to the possibility of mediated coupling.
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Submitted 4 January, 2023;
originally announced January 2023.
A flexible 300 mm integrated Si MOS platform for electron- and hole-spin qubits exploration
Authors:
R. Li,
N. I. Dumoulin Stuyck,
S. Kubicek,
J. Jussot,
B. T. Chan,
F. A. Mohiyaddin,
A. Elsayed,
M. Shehata,
G. Simion,
C. Godfrin,
Y. Canvel,
Ts. Ivanov,
L. Goux,
B. Govoreanu,
I. P. Radu
Abstract:
We report on a flexible 300 mm process that optimally combines optical and electron beam lithography to fabricate silicon spin qubits. It enables on-the-fly layout design modifications while allowing devices with either n- or p-type ohmic implants, a pitch smaller than 100 nm, and uniform critical dimensions down to 30 nm with a standard deviation ~ 1.6 nm. Various n- and p-type qubits are charact…
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We report on a flexible 300 mm process that optimally combines optical and electron beam lithography to fabricate silicon spin qubits. It enables on-the-fly layout design modifications while allowing devices with either n- or p-type ohmic implants, a pitch smaller than 100 nm, and uniform critical dimensions down to 30 nm with a standard deviation ~ 1.6 nm. Various n- and p-type qubits are characterized in a dilution refrigerator at temperatures ~ 10 mK. Electrical measurements demonstrate well-defined quantum dots, tunable tunnel couplings, and coherent spin control, which are essential requirements for the implementation of a large-scale quantum processor.
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Submitted 7 February, 2021;
originally announced February 2021.
