Showing 1–11 of 11 results for author: Hopkins, P E

Disorder controlled sound speed and thermal conductivity of hybrid metalcone films

Authors: Md Shafkat Bin Hoque, Rachel A. Nye, Saman Zare, Stephanie Atkinson, Siyao Wang, Andrew H. Jones, John T. Gaskins, Gregory Parsons, Patrick E. Hopkins

Abstract: The multifaceted applications of polymers are often limited by their thermal conductivity. Therefore, understanding the mechanisms of thermal transport in polymers is of vital interest. Here, we leverage molecular layer deposition to grow three types of hybrid metalcone (i.e., alucone, zincone, and tincone) films and study their thermal and acoustic properties. The thermal conductivity of the hybr… ▽ More The multifaceted applications of polymers are often limited by their thermal conductivity. Therefore, understanding the mechanisms of thermal transport in polymers is of vital interest. Here, we leverage molecular layer deposition to grow three types of hybrid metalcone (i.e., alucone, zincone, and tincone) films and study their thermal and acoustic properties. The thermal conductivity of the hybrid polymer films ranges from 0.43 to 1.14 W/mK. Using kinetic theory, we trace the origin of thermal conductivity difference to sound speed change, which is dictated by the structural disorder within the films. Changing the disorder has negligible impacts on volumetric heat capacity and vibrational lifetimes. Our findings provide means to improve the thermal conductivity of organic, hybrid, and inorganic polymer films. △ Less

Submitted 20 February, 2024; originally announced February 2024.

Ultrafast evanescent heat transfer across solid interfaces via hyperbolic phonon polaritons in hexagonal boron nitride

Authors: William Hutchins, John A. Tomko, Dan M. Hirt, Saman Zare, Joseph R. Matson, Katja Diaz-Granados, Mingze He, Thomas Pfeifer, Jiahan Li, James Edgar, Jon-Paul Maria, Joshua D. Caldwell, Patrick E. Hopkins

Abstract: The efficiency of phonon-mediated heat transport is limited by the intrinsic atomistic properties of materials, seemingly providing an upper limit to heat transfer in materials and across their interfaces. The typical speeds of conductive transport, which are inherently limited by the chemical bonds and atomic masses, dictate how quickly heat will move in solids. Given that phonon-polaritons, or c… ▽ More The efficiency of phonon-mediated heat transport is limited by the intrinsic atomistic properties of materials, seemingly providing an upper limit to heat transfer in materials and across their interfaces. The typical speeds of conductive transport, which are inherently limited by the chemical bonds and atomic masses, dictate how quickly heat will move in solids. Given that phonon-polaritons, or coupled phonon-photon modes, can propagate at speeds approaching 1 percent of the speed of light - orders of magnitude faster than transport within a pure diffusive phonon conductor - we demonstrate that volume-confined, hyperbolic phonon-polariton(HPhP) modes supported by many biaxial polar crystals can couple energy across solid-solid interfaces at an order of magnitude higher rates than phonon-phonon conduction alone. Using pump-probe thermoreflectance with a mid-infrared, tunable, probe pulse with sub-picosecond resolution, we demonstrate remote and spectrally selective excitation of the HPhP modes in hexagonal boron nitride in response to radiative heating from a thermally emitting gold source. Our work demonstrates a new avenue for interfacial heat transfer based on broadband radiative coupling from a hot spot in a gold film to hBN HPhPs, independent of the broad spectral mismatch between the pump(visible) and probe(mid-IR) pulses employed. This methodology can be used to bypass the intrinsically limiting phonon-phonon conductive pathway, thus providing an alternative means of heat transfer across interfaces. Further, our time-resolved measurements of the temperature changes of the HPhP modes in hBN show that through polaritonic coupling, a material can transfer heat across and away from an interface at rates orders of magnitude faster than diffusive phonon speeds intrinsic to the material, thus demonstrating a pronounced thermal transport enhancement in hBN via phonon-polariton coupling. △ Less

Submitted 20 February, 2024; v1 submitted 17 January, 2024; originally announced January 2024.

Ruddlesden-Popper chalcogenides push the limit of mechanical stiffness and glass-like thermal conductivity in crystals

Authors: Md Shafkat Bin Hoque, Eric R. Hoglund, Boyang Zhao, De-Liang Bao, Hao Zhou, Sandip Thakur, Eric Osei-Agyemang, Khalid Hattar, Ethan A. Scott, Mythili Surendran, John A. Tomko, John T. Gaskins, Kiumars Aryana, Sara Makarem, Ganesh Balasubramanian, Ashutosh Giri, Tianli Feng, Jordan A. Hachtel, Jayakanth Ravichandran, Sokrates T. Pantelides, Patrick E. Hopkins

Abstract: Insulating materials featuring ultralow thermal conductivity for diverse applications also require robust mechanical properties. Conventional thinking, however, which correlates strong bonding with high atomic-vibration-mediated heat conduction, led to diverse weakly bonded materials that feature ultralow thermal conductivity and low elastic moduli. One must, therefore, search for strongly-bonded… ▽ More Insulating materials featuring ultralow thermal conductivity for diverse applications also require robust mechanical properties. Conventional thinking, however, which correlates strong bonding with high atomic-vibration-mediated heat conduction, led to diverse weakly bonded materials that feature ultralow thermal conductivity and low elastic moduli. One must, therefore, search for strongly-bonded materials in which heat transport is impeded by other means. Here, we report intrinsic, glass-like, ultralow thermal conductivity and ultrahigh elastic-modulus/thermal-conductivity ratio in single-crystalline, BaZrS3-derived, Ruddlesden-Popper phases Ban+1ZrnS3n+1, n = 2, 3. Their key features are strong anharmonicity and intra-unit-cell rock-salt blocks. The latter produce strongly bonded intrinsic superlattices, impeding heat conduction by broadband reduction of phonon velocities and mean free paths and concomitant strong phonon localization. The present study initiates a paradigm of "mechanically stiff phonon glasses". △ Less

Submitted 5 December, 2023; originally announced December 2023.

Photoconductive Effects in Single Crystals of BaZrS$_3$

Authors: Boyang Zhao, Huandong Chen, Ragib Ahsan, Fei Hou, Eric R Hoglund, Shantanu Singh, Huan Zhao, Han Htoon, Andrey Krayev, Maruda Shanmugasundaram, Patrick E Hopkins, Jan Seidel, Rehan Kapadia, Jayakanth Ravichandran

Abstract: Chalcogenide perovskites, such as BaZrS$_3$, are emerging semiconductors with potential for high photovoltaic power conversion efficiency. The role of defects in the efficiency of the generation and collection of photo-excited carriers has not been experimentally investigated extensively. We study the effect of processing-induced defects on the photoconductive properties of single crystals of BaZr… ▽ More Chalcogenide perovskites, such as BaZrS$_3$, are emerging semiconductors with potential for high photovoltaic power conversion efficiency. The role of defects in the efficiency of the generation and collection of photo-excited carriers has not been experimentally investigated extensively. We study the effect of processing-induced defects on the photoconductive properties of single crystals of BaZrS$_3$. We achieved ohmic contacts to single crystals of BaZrS$_3$ and observed positive surface photovoltage, which is typically observed in p-type semiconductors. However, mechanical polishing of BaZrS$_3$ to remove the surface oxide leads to dense deformation grain boundaries and leads to trap-dominated photoconductive response. In comparison, ohmic contacts achieved in cleaved crystals leave fewer deformation defects and greatly improve optoelectronic properties. Defect-controlled crystal growth and contact fabrication are potentially limiting factors for achieving high photon-to-excited electron conversion efficiency in BaZrS$_3$. △ Less

Submitted 4 October, 2023; originally announced October 2023.

Predictions and Measurements of Thermal Conductivity of Ceramic Materials at High Temperature

Authors: Zherui Han, Zixin Xiong, William T. Riffe, Hunter B. Schonfeld, Mauricio Segovia, Jiawei Song, Haiyan Wang, Xianfan Xu, Patrick E. Hopkins, Amy Marconnet, Xiulin Ruan

Abstract: The lattice thermal conductivity ($κ$) of two ceramic materials, cerium dioxide (CeO$_2$) and magnesium oxide (MgO), is computed up to 1500 K using first principles and the phonon Boltzmann Transport Equation (PBTE) and compared to time-domain thermoreflectance (TDTR) measurements up to 800 K. Phonon renormalization and the four-phonon effect, along with high temperature thermal expansion, are int… ▽ More The lattice thermal conductivity ($κ$) of two ceramic materials, cerium dioxide (CeO$_2$) and magnesium oxide (MgO), is computed up to 1500 K using first principles and the phonon Boltzmann Transport Equation (PBTE) and compared to time-domain thermoreflectance (TDTR) measurements up to 800 K. Phonon renormalization and the four-phonon effect, along with high temperature thermal expansion, are integrated in our \textit{ab initio} molecular dynamics (AIMD) calculations. This is done by first relaxing structures and then fitting to a set of effective force constants employed in a temperature-dependent effective potential (TDEP) method. Both three-phonon and four-phonon scattering rates are computed based on these effective force constants. Our calculated thermal conductivities from the PBTE solver agree well with literature and our TDTR measurements. Other predicted thermal properties including thermal expansion, frequency shift, and phonon linewidth also compare well with available experimental data. Our results show that high temperature softens phonon frequency and reduces four-phonon scattering strength in both ceramics. Compared to MgO, we find that CeO$_2$ has weaker four-phonon effect and renormalization greatly reduces its four-phonon scattering rates. △ Less

Submitted 18 May, 2023; originally announced May 2023.

Journal ref: Phys. Rev. B 108, 184306 (2023)

Plasma-induced surface cooling

Authors: John A. Tomko, Michael J. Johnson, David R. Boris, Tzvetelina B. Petrova, Scott G. Walton, Patrick E. Hopkins

Abstract: Here we show that, despite a massive incident flux of energetic species, plasmas can induce transient cooling of a material surface. Using time-resolved optical thermometry in-situ with this plasma excitation, we reveal the novel underlying physics that drive this `plasma cooling' that is driven by the diverse chemical and energetic species that comprise this fourth state of matter. We show that t… ▽ More Here we show that, despite a massive incident flux of energetic species, plasmas can induce transient cooling of a material surface. Using time-resolved optical thermometry in-situ with this plasma excitation, we reveal the novel underlying physics that drive this `plasma cooling' that is driven by the diverse chemical and energetic species that comprise this fourth state of matter. We show that the photons and massive particles in the plasma impart energy to different chemical species on a surface, leading to local and temporally changing temperatures that lead to both increases and decreases in temperature on the surface of the sample, even though energy is being imparted to the material. This balance comes from the interplay between chemical reactions, momentum transfer, and energy exchange which occur on different time scales over the course of picoseconds to milliseconds. Thus, we show that through energetically exciting a material with a plasma, we can induce cooling, which can lead to revolutionary advances in refrigeration and thermal mitigation with this new process that is not inhibited by the same limitations in the current state-of-the-art systems. △ Less

Submitted 4 August, 2021; originally announced August 2021.

Thermal conductivity measurements of sub-surface buried substrates by steady-state thermoreflectance

Authors: Md Shafkat Bin Hoque, Yee Rui Koh, Kiumars Aryana, Eric Hoglund, Jeffrey L. Braun, David H. Olson, John T. Gaskins, Habib Ahmad, Mirza Mohammad Mahbube Elahi, Jennifer K. Hite, Zayd C. Leseman, W. Alan Doolittle, Patrick E. Hopkins

Abstract: Measuring the thermal conductivity of sub-surface buried substrates are of significant practical interests. However, this remains challenging with traditional pump-probe spectroscopies due to their limited thermal penetration depths (TPD). Here, we experimentally and numerically investigate the TPD of recently developed optical pump-probe technique steady-state thermoreflectance (SSTR) and explore… ▽ More Measuring the thermal conductivity of sub-surface buried substrates are of significant practical interests. However, this remains challenging with traditional pump-probe spectroscopies due to their limited thermal penetration depths (TPD). Here, we experimentally and numerically investigate the TPD of recently developed optical pump-probe technique steady-state thermoreflectance (SSTR) and explore its capability for measuring the thermal properties of buried substrates. The conventional definition of the TPD does not truly represent the upper limit of how far beneath the surface SSTR can probe. For estimating the uncertainty of SSTR measurements of a buried substrate a priori, sensitivity calculations provide the best means. Thus, detailed sensitivity calculations are provided to guide future measurements. Due to the steady-state nature of SSTR, it can measure the thermal conductivity of buried substrates typically inaccessible by traditional pump-probe techniques, exemplified by measuring three control samples. We also discuss the required criteria for SSTR to isolate the thermal properties of a buried film. Our study establishes SSTR as a suitable technique for thermal characterizations of sub-surface buried substrates in typical device geometries. △ Less

Submitted 25 February, 2021; originally announced February 2021.

Journal ref: Review of Scientific Instruments 92, 064906 (2021)

Interface controlled thermal properties of ultra-thin chalcogenide-based phase change memory devices

Authors: Kiumars Aryana, John T. Gaskins, Joyeeta Nag, Derek A. Stewart, Zhaoqiang Bai, Saikat Mukhopadhyay, John C. Read, David H. Olson, Eric R. Hoglund, James M. Howe, Ashutosh Giri, Michael K. Grobis, Patrick E. Hopkins

Abstract: Phase change memory (PCM) is a rapidly growing technology that not only offers advancements in storage-class memories but also enables in-memory data storage and processing towards overcoming the von Neumann bottleneck. In PCMs, the primary mechanism for data storage is thermal excitation. However, there is a limited body of research regarding the thermal properties of PCMs at length scales close… ▽ More Phase change memory (PCM) is a rapidly growing technology that not only offers advancements in storage-class memories but also enables in-memory data storage and processing towards overcoming the von Neumann bottleneck. In PCMs, the primary mechanism for data storage is thermal excitation. However, there is a limited body of research regarding the thermal properties of PCMs at length scales close to the memory cell dimension and, thus, the impact of interfaces on PCM operation is unknown. Our work presents a new paradigm to manage thermal transport in memory cells by manipulating the interfacial thermal resistance between the phase change unit and the electrodes without incorporating additional insulating layers. Experimental measurements show a substantial change in thermal boundary resistance as GST transitions from one crystallographic structure (cubic) to another (hexagonal) and as the thickness of tungsten contacts is reduced from five to two nanometers. Simulations reveal that interfacial resistance between the phase change unit and its adjacent layer can reduce the reset current for 20 and 120 nm diameter devices by up to ~40% and ~50%, respectively. The resultant phase-dependent and geometric effects on thermal boundary resistance dictate that the effective thermal conductivity of the phase change unit can be reduced by a factor of four, presenting a new opportunity to reduce operating currents in PCMs. △ Less

Submitted 10 November, 2020; originally announced November 2020.

Report number: Nature Communications 12, 774 (2021)

Long-lived modulation of plasmonic absorption by ballistic thermal injection

Authors: John A. Tomko, Evan L. Runnerstrom, Yi-Siang Wang, Joshua R. Nolen, David H. Olson, Kyle P. Kelley, Angela Cleri, Josh Nordlander, Joshua D. Caldwell, Oleg V. Prezhdo, Jon-Paul Maria, Patrick E. Hopkins

Abstract: Energy and charge transfer across metal-semiconductor interfaces are the fundamental driving forces for a broad range of applications, such as computing, energy harvesting, and photodetection. However, the exact roles and physical separation of these two phenomena remains unclear, particularly in plasmonically-excited systems or cases of strong nonequilibrium. We report on a series of ultrafast pl… ▽ More Energy and charge transfer across metal-semiconductor interfaces are the fundamental driving forces for a broad range of applications, such as computing, energy harvesting, and photodetection. However, the exact roles and physical separation of these two phenomena remains unclear, particularly in plasmonically-excited systems or cases of strong nonequilibrium. We report on a series of ultrafast plasmonic measurements that provide a direct measure of electronic distributions, both spatially and temporally, following optical excitation of a metal-semiconductor heterostructure. For the first time, we explicitly show that in cases of strong non-equilibrium, a novel energy transduction mechanism arises at the metal/semiconductor interface. We find that hot electrons in the metal contact transfer their energy to pre-existing electrons in the semiconductor, without transfer of charge. These experimental results findings are well-supported by both rigorous multilayer optical modeling and first-principle, ab initio calculations. △ Less

Submitted 20 May, 2020; originally announced May 2020.

Heat Diffusion Imaging: In-Plane Thermal Conductivity Measurement of Thin Films in a Broad Temperature Range

Authors: T. Zhu, D. H. Olson, P. E. Hopkins, M. Zebarjadi

Abstract: This work combines the principles of the heat spreader method and imaging capability of the thermoreflectance measurements to measure the in-plane thermal conductivity of thin-films without the requirement of film suspension or multiple thermometer deposition. We refer to this hybrid technique as heat diffusion imaging. The thermoreflectance imaging system provides a temperature distribution map a… ▽ More This work combines the principles of the heat spreader method and imaging capability of the thermoreflectance measurements to measure the in-plane thermal conductivity of thin-films without the requirement of film suspension or multiple thermometer deposition. We refer to this hybrid technique as heat diffusion imaging. The thermoreflectance imaging system provides a temperature distribution map across the film surface. The in-plane thermal conductivity can be extracted from the temperature decay profile. By coupling the system with a cryostat, we were able to conduct measurements from 40 K to 400 K. Silicon thin film samples with and without periodic holes were measured and compared with in-plane time-domain thermoreflectance (TDTR) measurement and literature data as validation for heat diffusion imaging. △ Less

Submitted 15 April, 2020; originally announced April 2020.

Comments: 7 pages, 5 figures

Thermal Conductance Across Harmonic-matched Epitaxial Al-sapphire Heterointerfaces

Authors: Zhe Cheng, Yee Rui Koh, Habib Ahmad, Renjiu Hu, **g**g Shi, Michael E. Liao, Yekan Wang, Tingyu Bai, Ruiyang Li, Eungkyu Lee, Evan A. Clinton, Christopher M. Matthews, Zachary Engel, Yates, Tengfei Luo, Mark S. Goorsky, William Doolittle, Zhiting Tian, Patrick E. Hopkins, Samuel Graham

Abstract: A unified understanding of interfacial thermal transport is missing due to the complicated nature of interfaces which involves complex factors such as interfacial bonding, interfacial mixing, surface chemistry, crystal orientation, roughness, contamination, and interfacial disorder. This is especially true for metal nonmetal interfaces which incorporate multiple fundamental heat transport mechanis… ▽ More A unified understanding of interfacial thermal transport is missing due to the complicated nature of interfaces which involves complex factors such as interfacial bonding, interfacial mixing, surface chemistry, crystal orientation, roughness, contamination, and interfacial disorder. This is especially true for metal nonmetal interfaces which incorporate multiple fundamental heat transport mechanisms such as elastic and inelastic phonon scattering as well as electron phonon coupling in the metal and across the interface. All these factors jointly affect thermal boundary conductance (TBC). As a result, the experimentally measured interfaces may not be the same as the ideally modelled interfaces, thus obfuscating any conclusions drawn from experimental and modeling comparisons. This work provides a systematic study of interfacial thermal conductance across well controlled and ultraclean epitaxial (111) Al parallel (0001) sapphire interfaces, known as harmonic matched interface. A comparison with thermal models such as atomistic Green s function (AGF) and a nonequilibrium Landauer approach shows that elastic phonon scattering dominates the interfacial thermal transport of Al sapphire interface. By scaling the TBC with the Al heat capacity, a nearly constant transmission coefficient is observed, indicating that the phonons on the Al side limits the Al sapphire TBC. This nearly constant transmission coefficient validates the assumptions in AGF and nonequilibrium Landauer calculations. Our work not only provides a benchmark for interfacial thermal conductance across metal nonmetal interfaces and enables a quantitative study of TBC to validate theoretical thermal carrier transport mechanisms, but also acts as a reference when studying how other factors impact TBC. △ Less

Submitted 23 September, 2019; v1 submitted 13 June, 2019; originally announced June 2019.

Journal ref: Communications Physics 3.1 (2020): 1-8