The Need for Speed: Efficient Exact Simulation of Silicon Dangling Bond Logic
Authors:
Jan Drewniok,
Marcel Walter,
Robert Wille
Abstract:
The Silicon Dangling Bond (SiDB) logic platform, an emerging computational beyond-CMOS nanotechnology, is a promising competitor due to its ability to achieve integration density and clock speed values that are several orders of magnitude higher compared to current CMOS fabrication nodes. However, the exact physical simulation of SiDB layouts, which is an essential component of any design validati…
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The Silicon Dangling Bond (SiDB) logic platform, an emerging computational beyond-CMOS nanotechnology, is a promising competitor due to its ability to achieve integration density and clock speed values that are several orders of magnitude higher compared to current CMOS fabrication nodes. However, the exact physical simulation of SiDB layouts, which is an essential component of any design validation workflow, is computationally expensive. In this paper, we propose a novel algorithm called QuickExact, which aims to be both, efficient and exact. To this end, we are introducing three techniques, namely 1) Physically-informed Search Space Pruning, 2) Partial Solution Caching, and 3) Effective State Enumeration. Extensive experimental evaluations confirm that, compared to the state-of-the-art algorithm, the resulting approach leads to a paramount runtime advantage of more than a factor of 5000 on randomly generated layouts and more than a factor of 2000 on an established gate library.
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Submitted 8 August, 2023;
originally announced August 2023.
QuickSim: Efficient and Accurate Physical Simulation of Silicon Dangling Bond Logic
Authors:
Jan Drewniok,
Marcel Walter,
Samuel Sze Hang Ng,
Konrad Walus,
Robert Wille
Abstract:
Silicon Dangling Bonds have established themselves as a promising competitor in the field of beyond-CMOS technologies. Their integration density and potential for energy dissipation advantages of several orders of magnitude over conventional circuit technologies sparked the interest of academia and industry alike. While fabrication capabilities advance rapidly and first design automation methodolo…
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Silicon Dangling Bonds have established themselves as a promising competitor in the field of beyond-CMOS technologies. Their integration density and potential for energy dissipation advantages of several orders of magnitude over conventional circuit technologies sparked the interest of academia and industry alike. While fabrication capabilities advance rapidly and first design automation methodologies have been proposed, physical simulation effectiveness has yet to keep pace. Established algorithms in this domain either suffer from exponential runtime behavior or subpar accuracy levels. In this work, we propose a novel algorithm for the physical simulation of Silicon Dangling Bond systems based on statistical methods that offers both a time-to-solution and an accuracy advantage over the state of the art by more than one order of magnitude and a factor of more than three, respectively, as demonstrated by an exhaustive experimental evaluation.
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Submitted 6 March, 2023;
originally announced March 2023.