Showing 1–16 of 16 results for author: Dort, K

Simulations and Performance Studies of a MAPS in 65 nm CMOS Imaging Technology

Authors: Adriana Simancas, Justus Braach, Eric Buschmann, Ankur Chauhan, Dominik Dannheim, Manuel Del Rio Viera, Katharina Dort, Doris Eckstein, Finn Feindt, Ingrid-Maria Gregor, Karsten Hansen, Lennart Huth, Larissa Mendes, Budi Mulyanto, Daniil Rastorguev, Christian Reckleben, Sara Ruiz Daza, Judith Schlaadt, Paul Schütze, Walter Snoeys, Simon Spannagel, Marcel Stanitzki, Anastasiia Velyka, Gianpiero Vignola, Håkan Wennlöf

Abstract: Monolithic active pixel sensors (MAPS) produced in a 65 nm CMOS imaging technology are being investigated for applications in particle physics. The MAPS design has a small collection electrode characterized by an input capacitance of ~fF, granting a high signal-to-noise ratio and low power consumption. Additionally, the 65 nm CMOS imaging technology brings a reduction in material budget and improv… ▽ More Monolithic active pixel sensors (MAPS) produced in a 65 nm CMOS imaging technology are being investigated for applications in particle physics. The MAPS design has a small collection electrode characterized by an input capacitance of ~fF, granting a high signal-to-noise ratio and low power consumption. Additionally, the 65 nm CMOS imaging technology brings a reduction in material budget and improved logic density of the readout circuitry, compared to previously studied technologies. Given these features, this technology was chosen by the TANGERINE project to develop the next generation of silicon pixel sensors. The sensor design targets temporal and spatial resolutions compatible with the requirements for a vertex detector at future lepton colliders. Simulations and test-beam characterization of technology demonstrators have been carried out in close collaboration with the CERN EP R&D program and the ALICE ITS3 upgrade. TCAD device simulations using generic do** profiles and Monte Carlo simulations have been used to build an understanding of the technology and predict the performance parameters of the sensor. Technology demonstrators of a 65 nm CMOS MAPS with a small collection electrode have been characterized in laboratory and test-beam facilities by studying performance parameters such as cluster size, charge collection, and efficiency. This work compares simulation results to test-beam data. The experimental results establish this technology as a promising candidate for a vertex detector at future lepton colliders and give valuable information for improving the simulation approach. △ Less

Submitted 22 February, 2024; originally announced February 2024.

Comments: 6 pages, 5 figures, submitted to Nuclear Instruments and Methods in Physics Research, Section A as a conference proceeding for the 13th International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors

Test-beam Performance Results of the FASTPIX Sub-Nanosecond CMOS Pixel Sensor Demonstrator

Authors: Justus Braach, Eric Buschmann, Dominik Dannheim, Katharina Dort, Thanushan Kugathasan, Magdalena Munker, Walter Snoeys, Peter Švihra, Mateus Vicente

Abstract: Within the ATTRACT FASTPIX project, a monolithic pixel sensor demonstrator chip has been developed in a modified 180 nm CMOS imaging process technology, targeting sub-nanosecond timing precision for single ionising particles. It features a small collection electrode design on a 25 micrometers-thick epitaxial layer and contains 32 mini matrices of 68 hexagonal pixels each, with pixel pitches rangin… ▽ More Within the ATTRACT FASTPIX project, a monolithic pixel sensor demonstrator chip has been developed in a modified 180 nm CMOS imaging process technology, targeting sub-nanosecond timing precision for single ionising particles. It features a small collection electrode design on a 25 micrometers-thick epitaxial layer and contains 32 mini matrices of 68 hexagonal pixels each, with pixel pitches ranging from 8.66 to 20 micrometers. Four pixels are transmitting an analog output signal and 64 are transmitting binary hit information. Various design variations are explored, aiming at accelerating the charge collection and making the timing of the charge collection more uniform over the pixel area. Signal treatment of the analog waveforms, as well as reconstruction of digital position, time and charge information, is carried out off-chip. This contribution introduces the design of the sensor and readout system and presents performance results for various pixel designs achieved in recent test beam measurements with external tracking and timing reference detectors. A time resolution below 150 ps is obtained at full efficiency for all pixel pitches. △ Less

Submitted 25 September, 2023; v1 submitted 9 June, 2023; originally announced June 2023.

Comments: 15 pages, 15 figures, content as published in NIM A as part of a special issue for the ULITIMA 2023 conference

Journal ref: Nuclear Instruments and Methods in Physics Research Section A, Volume 1056, 2023

Develo** a Monolithic Silicon Sensor in a 65 nm CMOS Imaging Technology for Future Lepton Collider Vertex Detectors

Authors: Adriana Simancas, Justus Braach, Eric Buschmann, Ankur Chauhan, Dominik Dannheim, Manuel Del Rio Viera, Katharina Dort, Doris Eckstein, Finn Feindt, Ingrid-Maria Gregor, Karsten Hansen, Lennart Huth, Larissa Mendes, Budi Mulyanto, Daniil Rastorguev, Christian Reckleben, Sara Ruiz Daza, Paul Schütze, Walter Snoeys, Simon Spannagel, Marcel Stanitzki, Anastasiia Velyka, Gianpiero Vignola, Håkan Wennlöf

Abstract: Monolithic CMOS sensors in a 65 nm imaging technology are being investigated by the CERN EP Strategic R&D Programme on Technologies for Future Experiments for an application in particle physics. The appeal of monolithic detectors lies in the fact that both sensor volume and readout electronics are integrated in the same silicon wafer, providing a reduction in production effort, costs and scatterin… ▽ More Monolithic CMOS sensors in a 65 nm imaging technology are being investigated by the CERN EP Strategic R&D Programme on Technologies for Future Experiments for an application in particle physics. The appeal of monolithic detectors lies in the fact that both sensor volume and readout electronics are integrated in the same silicon wafer, providing a reduction in production effort, costs and scattering material. The Tangerine Project WP1 at DESY participates in the Strategic R&D Programme and is focused on the development of a monolithic active pixel sensor with a time and spatial resolution compatible with the requirements for a future lepton collider vertex detector. By fulfilling these requirements, the Tangerine detector is suitable as well to be used as telescope planes for the DESY-II Test Beam facility. The project comprises all aspects of sensor development, from the electronics engineering and the sensor design using simulations, to laboratory and test beam investigations of prototypes. Generic TCAD Device and Monte-Carlo simulations are used to establish an understanding of the technology and provide important insight into performance parameters of the sensor. Testing prototypes in laboratory and test beam facilities allows for the characterization of their response to different conditions. By combining results from all these studies it is possible to optimize the sensor layout. This contribution presents results from generic TCAD and Monte-Carlo simulations, and measurements performed with test chips of the first sensor submission. △ Less

Submitted 31 March, 2023; originally announced March 2023.

Comments: 7 pages, 8 figures, submitted to IEEE Xplore as conference record for 2022 IEEE NSS/MIC/RTSD

Development of novel single-die hybridisation processes for small-pitch pixel detectors

Authors: Peter Svihra, Justus Braach, Eric Buschmann, Dominik Dannheim, Katharina Dort, Thomas Fritzsch, Helge Kristiansen, Mario Rothermund, Janis Viktor Schmidt, Mateus Vicente Barreto Pinto, Morag Williams

Abstract: Hybrid pixel detectors require a reliable and cost-effective interconnect technology adapted to the pitch and die sizes of the respective applications. During the ASIC and sensor R\&D phase, especially for small-scale applications, such interconnect technologies need to be suitable for the assembly of single dies, typically available from Multi-Project-Wafer submissions. Within the CERN EP R&D pro… ▽ More Hybrid pixel detectors require a reliable and cost-effective interconnect technology adapted to the pitch and die sizes of the respective applications. During the ASIC and sensor R\&D phase, especially for small-scale applications, such interconnect technologies need to be suitable for the assembly of single dies, typically available from Multi-Project-Wafer submissions. Within the CERN EP R&D programme and the AIDAinnova collaboration, innovative hybridisation concepts targeting vertex-detector applications at future colliders are under development. Recent results of two novel interconnect methods for pixel pitches of 25um and 55um are presented in this contribution -- an industrial fine-pitch SnAg solder bump-bonding process adapted to single-die processing using support wafers, as well as a newly developed in-house single-die interconnection process based on ACF. The fine-pitch bump-bonding process is qualified with hybrid assemblies from a recent bonding campaign at Frauenhofer IZM. Individual CLICpix2 ASICs with 25um pixel pitch were bump-bonded to active-edge silicon sensors with thicknesses ranging from 50um to 130um. The device characterisation was conducted in the laboratory as well as during a beam test campaign at the CERN SPS beam-line, demonstrating an interconnect yield of about 99.7%. The ACF interconnect technology replaces the solder bumps by conductive micro-particles embedded in an epoxy film. The electro-mechanical connection between the sensor and ASIC is achieved via thermocompression of the ACF using a flip-chip device bonder. The required pixel pad topology is achieved with an in-house ENIG plating process. This newly developed ACF hybridisation process is first qualified with the Timepix3 ASICs and sensors with 55um pixel pitch. The technology can be also used for ASIC-PCB/FPC integration, replacing wire bonding or large-pitch solder bum** techniques. △ Less

Submitted 5 October, 2022; originally announced October 2022.

Comments: 23rd iWoRiD proceedings

Journal ref: 2023_JINST_18_C03008

Comparison of different sensor thicknesses and substrate materials for the monolithic small collection-electrode technology demonstrator CLICTD

Authors: Katharina Dort, Rafael Ballabriga, Justus Braach, Eric Buschmann, Michael Campbell, Dominik Dannheim, Lennart Huth, Iraklis Kremastiotis, Jens Kröger, Lucie Linssen, Magdalena Munker, Walter Snoeys, Simon Spannagel, Peter Švihra, Tomas Vanat

Abstract: Small collection-electrode monolithic CMOS sensors profit from a high signal-to-noise ratio and a small power consumption, but have a limited active sensor volume due to the fabrication process based on thin high-resistivity epitaxial layers. In this paper, the active sensor depth is investigated in the monolithic small collection-electrode technology demonstrator CLICTD. Charged particle beams ar… ▽ More Small collection-electrode monolithic CMOS sensors profit from a high signal-to-noise ratio and a small power consumption, but have a limited active sensor volume due to the fabrication process based on thin high-resistivity epitaxial layers. In this paper, the active sensor depth is investigated in the monolithic small collection-electrode technology demonstrator CLICTD. Charged particle beams are used to study the charge-collection properties and the performance of devices with different thicknesses both for perpendicular and inclined particle incidence. In CMOS sensors with a high-resistivity Czochralski substrate, the depth of the sensitive volume is found to increase by a factor two in comparison with standard epitaxial material and leads to significant improvements in the hit-detection efficiency and the spatial and time resolution. △ Less

Submitted 30 August, 2022; v1 submitted 22 April, 2022; originally announced April 2022.

The International Linear Collider: Report to Snowmass 2021

Authors: Alexander Aryshev, Ties Behnke, Mikael Berggren, James Brau, Nathaniel Craig, Ayres Freitas, Frank Gaede, Spencer Gessner, Stefania Gori, Christophe Grojean, Sven Heinemeyer, Daniel Jeans, Katja Kruger, Benno List, Jenny List, Zhen Liu, Shinichiro Michizono, David W. Miller, Ian Moult, Hitoshi Murayama, Tatsuya Nakada, Emilio Nanni, Mihoko Nojiri, Hasan Padamsee, Maxim Perelstein , et al. (487 additional authors not shown)

Abstract: The International Linear Collider (ILC) is on the table now as a new global energy-frontier accelerator laboratory taking data in the 2030s. The ILC addresses key questions for our current understanding of particle physics. It is based on a proven accelerator technology. Its experiments will challenge the Standard Model of particle physics and will provide a new window to look beyond it. This docu… ▽ More The International Linear Collider (ILC) is on the table now as a new global energy-frontier accelerator laboratory taking data in the 2030s. The ILC addresses key questions for our current understanding of particle physics. It is based on a proven accelerator technology. Its experiments will challenge the Standard Model of particle physics and will provide a new window to look beyond it. This document brings the story of the ILC up to date, emphasizing its strong physics motivation, its readiness for construction, and the opportunity it presents to the US and the global particle physics community. △ Less

Submitted 16 January, 2023; v1 submitted 14 March, 2022; originally announced March 2022.

Comments: 356 pages, Large pdf file (40 MB) submitted to Snowmass 2021; v2 references to Snowmass contributions added, additional authors; v3 references added, some updates, additional authors

Report number: DESY-22-045, IFT--UAM/CSIC--22-028, KEK Preprint 2021-61, PNNL-SA-160884, SLAC-PUB-17662

Comparison of Supervised and Unsupervised Anomaly Detection in Belle II Pixel Detector Data

Authors: Katharina Dort, Johannes Bilk, Stephanie Käs, Jens Sören Lange, Marvin Peter, Timo Schellhass, Benjamin Schwenker, Björn Spruck

Abstract: Machine learning has become a popular instrument for the identification of dark matter candidates at particle collider experiments. They enable the processing of large datasets and are therefore suitable to operate directly on raw data coming from the detector, instead of reconstructed objects. Here, we investigate patterns of raw pixel hits recorded by the Belle II pixel detector, that is operati… ▽ More Machine learning has become a popular instrument for the identification of dark matter candidates at particle collider experiments. They enable the processing of large datasets and are therefore suitable to operate directly on raw data coming from the detector, instead of reconstructed objects. Here, we investigate patterns of raw pixel hits recorded by the Belle II pixel detector, that is operational since 2019 and presently features 4 M pixels and trigger rates up to 5 kHz. In particular, we focus on unsupervised techniques that operate without the need for a theoretical model. These model-agnostic approaches allow for an unbiased exploration of data, while filtering out anomalous detector signatures that could hint at new physics scenarios. We present the identification of hypothetical magnetic monopoles against Belle II beam background using Self-Organizing Kohonen Maps and Autoencoders. The two unsupervised algorithms are compared to a convolutional Multilayer Perceptron and a superior signal efficiency is found at high background rejection levels. Our results strengthen the case for using unsupervised machine learning techniques to complement traditional search strategies at particle colliders and pave the way to potential online applications of the algorithms in the near future. △ Less

Submitted 16 February, 2022; originally announced February 2022.

Transient Monte Carlo Simulations for the Optimisation and Characterisation of Monolithic Silicon Sensors

Authors: Rafael Ballabriga, Justus Braach, Eric Buschmann, Michael Campbell, Dominik Dannheim, Katharina Dort, Lennart Huth, Iraklis Kremastiotis, Jens Kröger, Lucie Linssen, Magdalena Munker, Paul Schütze, Walter Snoeys, Simon Spannagel, Tomas Vanat

Abstract: An ever-increasing demand for high-performance silicon sensors requires complex sensor designs that are challenging to simulate and model. The combination of electrostatic finite element simulations with a transient Monte Carlo approach provides simultaneous access to precise sensor modelling and high statistics. The high simulation statistics enable the inclusion of Landau fluctuations and produc… ▽ More An ever-increasing demand for high-performance silicon sensors requires complex sensor designs that are challenging to simulate and model. The combination of electrostatic finite element simulations with a transient Monte Carlo approach provides simultaneous access to precise sensor modelling and high statistics. The high simulation statistics enable the inclusion of Landau fluctuations and production of secondary particles, which offers a realistic simulation scenario. The transient simulation approach is an important tool to achieve an accurate time-resolved description of the sensor, which is crucial in the face of novel detector prototypes with increasingly precise timing capabilities. The simulated time resolution as a function of operating parameters as well as the full transient pulse can be monitored and assessed, which offers a new perspective on the optimisation and characterisation of silicon sensors. In this paper, a combination of electrostatic finite-element simulations using 3D TCAD and transient Monte Carlo simulations with the Allpix Squared framework are presented for a monolithic CMOS pixel sensor with a small collection diode, that is characterised by a highly inhomogeneous, complex electric field. The results are compared to transient 3D TCAD simulations that offer a precise simulation of the transient behaviour but long computation times. Additionally, the simulations are benchmarked against test-beam data and good agreement is found for the performance parameters over a wide range of different operation conditions. △ Less

Submitted 9 February, 2022; v1 submitted 7 February, 2022; originally announced February 2022.

Test-beam and simulation studies for the CLICTD technology demonstrator -- a monolithic CMOS pixel sensor with a small collection diode

Authors: Katharina Dort

Abstract: The CLIC Tracker Detector (CLICTD) is a monolithic pixel sensor featuring pixels of 30um x 37.5um and a small collection diode. The sensor is fabricated in a 180 nm CMOS imaging process, using two different pixel flavours: the first with a continuous n-type implant for full lateral depletion, and the second with a segmentation in the n-type implant for accelerated charge collection. Moreover, CLIC… ▽ More The CLIC Tracker Detector (CLICTD) is a monolithic pixel sensor featuring pixels of 30um x 37.5um and a small collection diode. The sensor is fabricated in a 180 nm CMOS imaging process, using two different pixel flavours: the first with a continuous n-type implant for full lateral depletion, and the second with a segmentation in the n-type implant for accelerated charge collection. Moreover, CLICTD features an innovative sub-pixel segmentation scheme that allows the digital footprint to be reduced while maintaining a small sub-pixel pitch. In this contribution, test-beam measurements for the pixel flavour with the segmented n-implant are presented. The performance is evaluated in terms of time and spatial resolution as well as efficiency. Furthermore, the test-beam data is compared to simulation studies using a combination of 3D TCAD and Monte Carlo simulation tools. △ Less

Submitted 24 June, 2021; originally announced June 2021.

Test-beam characterisation of the CLICTD technology demonstrator - a small collection electrode High-Resistivity CMOS pixel sensor with simultaneous time and energy measurement

Authors: R. Ballabriga, E. Buschmann, M. Campbell, D. Dannheim, K. Dort, N. Egidos, L. Huth, I. Kremastiotis, J. Kröger, L. Linssen, X. Llopart, M. Munker, A. Nürnberg, W. Snoeys, S. Spannagel, T. Vanat, M. Vicente, M. Williams

Abstract: The CLIC Tracker Detector (CLICTD) is a monolithic pixel sensor. It is fabricated in a 180 nm CMOS imaging process, modified with an additional deep low-dose n-type implant to obtain full lateral depletion. The sensor features a small collection diode, which is essential for achieving a low input capacitance. The CLICTD sensor was designed as a technology demonstrator in the context of the trackin… ▽ More The CLIC Tracker Detector (CLICTD) is a monolithic pixel sensor. It is fabricated in a 180 nm CMOS imaging process, modified with an additional deep low-dose n-type implant to obtain full lateral depletion. The sensor features a small collection diode, which is essential for achieving a low input capacitance. The CLICTD sensor was designed as a technology demonstrator in the context of the tracking detector studies for the Compact Linear Collider (CLIC). Its design characteristics are of broad interest beyond CLIC, for HL-LHC tracking detector upgrades. It is produced in two different pixel flavours: one with a continuous deep n-type implant, and one with a segmented n-type implant to ensure fast charge collection. The pixel matrix consists of $16\times128$ detection channels measuring $300 \times 30$ microns. Each detection channel is segmented into eight sub-pixels to reduce the amount of digital circuity while maintaining a small collection electrode pitch. This paper presents the characterisation results of the CLICTD sendor in a particle beam. The different pixel flavours are compared in detail by using the simultaneous time-over-threshold and time-of-arrival measurement functionalities. Most notably, a time resolution down to $(5.8 \pm 0.1)$ ns and a spatial resolution down to $(4.6 \pm 0.2)$ microns are measured. The hit detection efficiency is found to be well above 99.7% for thresholds of the order of several hundred electrons. △ Less

Submitted 8 February, 2021; originally announced February 2021.

Corryvreckan: A Modular 4D Track Reconstruction and Analysis Software for Test Beam Data

Authors: Dominik Dannheim, Katharina Dort, Lennart Huth, Daniel Hynds, Iraklis Kremastiotis, Jens Kröger, Magdalena Munker, Florian Pitters, Paul Schütze, Simon Spannagel, Tomas Vanat, Morag Williams

Abstract: Corryvreckan is a versatile, highly configurable software with a modular structure designed to reconstruct and analyse test beam and laboratory data. It caters to the needs of the test beam community by providing a flexible offline event building facility to combine detectors with different read-out schemes, with or without trigger information, and includes the possibility to correlate data from m… ▽ More Corryvreckan is a versatile, highly configurable software with a modular structure designed to reconstruct and analyse test beam and laboratory data. It caters to the needs of the test beam community by providing a flexible offline event building facility to combine detectors with different read-out schemes, with or without trigger information, and includes the possibility to correlate data from multiple devices based on timestamps. Hit timing information, available with high precision from an increasing number of detectors, can be used in clustering and tracking to reduce combinatorics. Several algorithms, including an implementation of Millepede-II, are provided for offline alignment. A graphical user interface enables direct monitoring of the reconstruction progress and can be employed for quasi-online monitoring during data taking. This work introduces the Corryvreckan framework architecture and user interface, and provides a detailed overview of the event building algorithm. The reconstruction and analysis capabilities are demonstrated with data recorded at the DESY II Test Beam Facility using the EUDAQ2 data acquisition framework with an EUDET-type beam telescope, a Timepix3 timing reference, a fine-pitch planar silicon sensor with CLICpix2 readout and the AIDA Trigger Logic Unit. The individual steps of the reconstruction chain are presented in detail. △ Less

Submitted 13 January, 2021; v1 submitted 25 November, 2020; originally announced November 2020.

Report number: CLICdp-Pub-2020-005

The CLICTD Monolithic CMOS Sensor

Authors: Katharina Dort

Abstract: CLICTD is a monolithic silicon pixel sensor fabricated in a modified 180 nm CMOS imaging process with a small collection electrode design and a high-resistivity epitaxial layer. It features an innovative sub-pixel segmentation scheme and is optimised for fast charge collection and high spatial resolution. The sensor was developed to target the requirements for the tracking detector of the proposed… ▽ More CLICTD is a monolithic silicon pixel sensor fabricated in a modified 180 nm CMOS imaging process with a small collection electrode design and a high-resistivity epitaxial layer. It features an innovative sub-pixel segmentation scheme and is optimised for fast charge collection and high spatial resolution. The sensor was developed to target the requirements for the tracking detector of the proposed future Compact Linear Collider (CLIC). Most notably, a temporal resolution of a few nanoseconds and a spatial resolution below 7 microns are demanded. In this contribution, the sensor performance measured in beam tests is presented with emphasis on recent studies using assemblies with different thicknesses (down to 50 microns to minimize the material budget) and inclined particle tracks. △ Less

Submitted 18 November, 2020; originally announced November 2020.

Silicon vertex and tracking detector R&D for CLIC

Authors: Katharina Dort

Abstract: The physics aims at the proposed future high-energy linear $e^+e^-$ collider CLIC pose challenging demands on the performance of the detector system. In particular, the vertex and tracking detectors have to combine a spatial resolution of a few micrometres and a low material budget with a time-stam** accuracy of a few nanoseconds. For the vertex detector, fine-pitch sensors, dedicated 65nm reado… ▽ More The physics aims at the proposed future high-energy linear $e^+e^-$ collider CLIC pose challenging demands on the performance of the detector system. In particular, the vertex and tracking detectors have to combine a spatial resolution of a few micrometres and a low material budget with a time-stam** accuracy of a few nanoseconds. For the vertex detector, fine-pitch sensors, dedicated 65nm readout ASICs, fine-pitch bonding techniques using solder bumps or anisotropic conductive films as well as monolithic devices based on Silicon-On-Insulator technology are explored. Fully monolithic CMOS sensors with large and small collection electrodes are under investigation for the large surface CLIC tracker. This contribution gives an overview of the CLIC vertex and tracking detector R&D, focusing on recent results from test-beam campaigns and simulation-based sensor optimisation studies. △ Less

Submitted 21 October, 2020; originally announced October 2020.

CLICTD: A monolithic HR-CMOS sensor chip for the CLIC silicon tracker

Authors: I. Kremastiotis, R. Ballabriga, K. Dort, N. Egidos, M. Munker

Abstract: The CLIC Tracker Detector (CLICTD) is a monolithic pixelated sensor chip produced in a $180$ nm imaging CMOS process built on a high-resistivity epitaxial layer. The chip, designed in the context of the CLIC tracking detector study, comprises a matrix of ${16\times128}$ elongated pixels, each measuring ${300\times30}$ $μ$m$^2$. To ensure prompt charge collection, every elongated pixel is segmented… ▽ More The CLIC Tracker Detector (CLICTD) is a monolithic pixelated sensor chip produced in a $180$ nm imaging CMOS process built on a high-resistivity epitaxial layer. The chip, designed in the context of the CLIC tracking detector study, comprises a matrix of ${16\times128}$ elongated pixels, each measuring ${300\times30}$ $μ$m$^2$. To ensure prompt charge collection, every elongated pixel is segmented in eight sub-pixels, each containing a collection diode and a separate analog front-end. A simultaneous $8$-bit time measurement with $10$ ns time bins and $5$-bit energy measurement with programmable range is performed in the on-pixel digital logic. The main design aspects as well as the first results from laboratory measurements with the CLICTD chip are presented. △ Less

Submitted 6 April, 2020; originally announced April 2020.

Comments: 5 pages, 8 figures. Proceedings for the Topical Workshop on Electronics for Particle Physics (TWEPP 2019). 2-6 September 2019, Santiago de Compostela, Spain

Journal ref: PoS(TWEPP2019)039

Combining TCAD and Monte Carlo Methods to Simulate CMOS Pixel Sensors with a Small Collection Electrode using the Allpix Squared Framework

Authors: Dominik Dannheim, Katharina Dort, Daniel Hynds, Magdalena Munker, Andreas Nürnberg, Walter Snoeys, Simon Spannagel

Abstract: Combining electrostatic field simulations with Monte Carlo methods enables realistic modeling of the detector response for novel monolithic silicon detectors with strongly non-linear electric fields. Both the precise field description and the inclusion of Landau fluctuations and production of secondary particles in the sensor are crucial ingredients for the understanding and reproduction of detect… ▽ More Combining electrostatic field simulations with Monte Carlo methods enables realistic modeling of the detector response for novel monolithic silicon detectors with strongly non-linear electric fields. Both the precise field description and the inclusion of Landau fluctuations and production of secondary particles in the sensor are crucial ingredients for the understanding and reproduction of detector characteristics. In this paper, a CMOS pixel sensor with small collection electrode design, implemented in a high-resistivity epitaxial layer, is simulated by integrating a detailed electric field model from finite element TCAD into a Monte Carlo based simulation with the Allpix$^2$ framework. The simulation results are compared to data recorded in test-beam measurements and very good agreement is found for various quantities such as cluster size, spatial resolution and efficiency. Furthermore, the observables are studied as a function of the intra-pixel incidence position to enable a detailed comparison with the detector behavior observed in data. The validation of such simulations is fundamental for modeling the detector response and for predicting the performance of future prototype designs. Moreover, visualization plots extracted from the charge carrier drift model of the framework can aid in understanding the charge propagation behavior in different regions of the sensor. △ Less

Submitted 28 February, 2020; originally announced February 2020.

Comments: 15 pages, 18 figures

Report number: CLICdp-Pub-2019-008

Search for Highly Ionizing Particles with the Pixel Detector at Belle II

Authors: Katharina Dort, Jens Soeren Lange, Klemens Lautenbach

Abstract: The Belle II experiment, located at the SuperKEKB collider at the high-energy research facility KEK in Tsukuba, Japan, started operation in 2018. Compared to the predecessor experiment Belle, Belle II plans to increase the peak luminosity by a factor of about 40, by employing nano-beam technology in the interaction region. In particular the new, innermost sub-detector of Belle II - the Pixel Verte… ▽ More The Belle II experiment, located at the SuperKEKB collider at the high-energy research facility KEK in Tsukuba, Japan, started operation in 2018. Compared to the predecessor experiment Belle, Belle II plans to increase the peak luminosity by a factor of about 40, by employing nano-beam technology in the interaction region. In particular the new, innermost sub-detector of Belle II - the Pixel Vertex Detector (PXD) - is in close proximity to the interaction point. This allows for the detection of particles, which do not leave a signal in the outer sub-detectors. Among these, Highly Ionizing Particles (HIPs) encounter a characteristically high energy loss, limiting their penetration depth into the detector. Anti-deuterons and magnetic monopoles as possible HIPs are considered. Without a signal in the outer sub-detectors, no track trigger is issued, resulting in possible information loss. The possibility of identifying HIPs solely with information provided by the PXD is presented, by using neural network algorithms operating in a multidimensional parameter space of PXD cluster data. △ Less

Submitted 12 June, 2019; originally announced June 2019.

Comments: Conference: International Workshop on e+e- collisions from Phi to Psi 2019