Topmetal-M: a novel pixel sensor for compact tracking applications
Authors:
Wei** Ren,
Wei Zhou,
Bihui You,
Ni Fang,
Yan Wang,
Haibo Yang,
Honglin Zhang,
Yao Wang,
Jun Liu,
Xianqin Li,
** Yang,
Le Xiao,
YuezhaoZhang,
Xiangru Qu,
Shuguang Zou,
GuangmingHuang,
Hua Pei,
Fan Shen,
Dong Wang,
Xiaoyang Niu,
Yuan Mei,
Yubo Han,
ChaosongGao,
Xiangming Sun,
Chengxin Zhao
Abstract:
The Topmetal-M is a large area pixel sensor (18 mm * 23 mm) prototype fabricated in a new 130 nm high-resistivity CMOS process in 2019. It contains 400 rows * 512 columns square pixels with the pitch of 40 μm. In Topmetal-M, a novel charge collection method combing the Monolithic Active Pixel Sensor (MAPS) and the Topmetal sensor has been proposed for the first time. Both the ionized charge deposi…
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The Topmetal-M is a large area pixel sensor (18 mm * 23 mm) prototype fabricated in a new 130 nm high-resistivity CMOS process in 2019. It contains 400 rows * 512 columns square pixels with the pitch of 40 μm. In Topmetal-M, a novel charge collection method combing the Monolithic Active Pixel Sensor (MAPS) and the Topmetal sensor has been proposed for the first time. Both the ionized charge deposited by the particle in the sensor and along the track over the sensor can be collected. The in-pixel circuit mainly consists of a low-noise charge sensitive amplifier to establish the signal for the energy reconstruction, and a discriminator with a Time-to-Amplitude Converter (TAC) for the Time of Arrival (TOA) measurement. With this mechanism, the trajectory, particle hit position, energy and arrival time of the particle can be measured. The analog signal from each pixel is accessible through time-shared multiplexing over the entire pixel array. This paper will discuss the design and preliminary test results of the Topmetal-M sensor.
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Submitted 26 January, 2022;
originally announced January 2022.
