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First results on monolithic CMOS detector with internal gain
Authors:
U. Follo,
G. Gioachin,
C. Ferrero,
M. Mandurrino,
M. Bregant,
S. Bufalino,
F. Carnesecchi,
D. Cavazza,
M. Colocci,
T. Corradino,
M. Da Rocha Rolo,
G. Di Nicolantonio,
S. Durando,
G. Margutti,
M. Mignone,
R. Nania,
L. Pancheri,
A. Rivetti,
B. Sabiu,
G. G. A. de Souza,
S. Strazzi,
R. Wheadon
Abstract:
In this paper we report on a set of characterisations carried out on the first monolithic LGAD prototype integrated in a customised 110 nm CMOS process having a depleted active volume thickness of 48 $μ$m. This prototype is formed by a pixel array where each pixel has a total size of 100 $μ$m $\times$ 250 $μ$m and includes a high-speed front-end amplifier. After describing the sensor and the elect…
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In this paper we report on a set of characterisations carried out on the first monolithic LGAD prototype integrated in a customised 110 nm CMOS process having a depleted active volume thickness of 48 $μ$m. This prototype is formed by a pixel array where each pixel has a total size of 100 $μ$m $\times$ 250 $μ$m and includes a high-speed front-end amplifier. After describing the sensor and the electronics architecture, both laboratory and in-beam measurements are reported and described. Optical characterisations performed with an IR pulsed laser setup have shown a sensor internal gain of about 2.5. With the same experimental setup, the electronic jitter was found to be between 50 ps and 150 ps, depending on the signal amplitude. Moreover, the analysis of a test beam performed at the Proton Synchrotron (PS) T10 facility of CERN with 10 GeV/c protons and pions indicated that the overall detector time resolution is in the range of 234 ps to 244 ps. Further TCAD investigations, based on the do** profile extracted from $C(V)$ measurements, confirmed the multiplication gain measured on the test devices. Finally, TCAD simulations were used to tune the future do** concentration of the gain layer implant, targeting sensors with a higher avalanche gain. This adjustment is expected to enhance the timing performance of the sensors of the future productions, in order to cope with the high event rate expected in most of the near future high-energy and high-luminosity physics experiments, where the time resolution will be essential to disentangle overlap** events and it will also be crucial for Particle IDentification (PID).
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Submitted 28 June, 2024;
originally announced June 2024.
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Towards a Muon Collider
Authors:
Carlotta Accettura,
Dean Adams,
Rohit Agarwal,
Claudia Ahdida,
Chiara Aimè,
Nicola Amapane,
David Amorim,
Paolo Andreetto,
Fabio Anulli,
Robert Appleby,
Artur Apresyan,
Aram Apyan,
Sergey Arsenyev,
Pouya Asadi,
Mohammed Attia Mahmoud,
Aleksandr Azatov,
John Back,
Lorenzo Balconi,
Laura Bandiera,
Roger Barlow,
Nazar Bartosik,
Emanuela Barzi,
Fabian Batsch,
Matteo Bauce,
J. Scott Berg
, et al. (272 additional authors not shown)
Abstract:
A muon collider would enable the big jump ahead in energy reach that is needed for a fruitful exploration of fundamental interactions. The challenges of producing muon collisions at high luminosity and 10 TeV centre of mass energy are being investigated by the recently-formed International Muon Collider Collaboration. This Review summarises the status and the recent advances on muon colliders desi…
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A muon collider would enable the big jump ahead in energy reach that is needed for a fruitful exploration of fundamental interactions. The challenges of producing muon collisions at high luminosity and 10 TeV centre of mass energy are being investigated by the recently-formed International Muon Collider Collaboration. This Review summarises the status and the recent advances on muon colliders design, physics and detector studies. The aim is to provide a global perspective of the field and to outline directions for future work.
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Submitted 27 November, 2023; v1 submitted 15 March, 2023;
originally announced March 2023.
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High-Precision 4D Tracking with Large Pixels using Thin Resistive Silicon Detectors
Authors:
R. Arcidiacono,
G. Borghi,
M. Boscardin,
N. Cartiglia,
M. Centis Vignali,
M. Costa,
G-F. Dalla Betta,
M. Ferrero,
F. Ficorella,
G. Gioachin,
L. Lanteri,
M. Mandurrino,
L. Menzio,
R. Mulargia,
L. Pancheri,
G. Paternoster,
A. Rojas,
H-F W. Sadrozinski,
A. Seiden,
F. Siviero,
V. Sola,
M. Tornago
Abstract:
The basic principle of operation of silicon sensors with resistive read-out is built-in charge sharing. Resistive Silicon Detectors (RSD, also known as AC-LGAD), exploiting the signals seen on the electrodes surrounding the impact point, achieve excellent space and time resolutions even with very large pixels. In this paper, a TCT system using a 1064 nm picosecond laser is used to characterize sen…
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The basic principle of operation of silicon sensors with resistive read-out is built-in charge sharing. Resistive Silicon Detectors (RSD, also known as AC-LGAD), exploiting the signals seen on the electrodes surrounding the impact point, achieve excellent space and time resolutions even with very large pixels. In this paper, a TCT system using a 1064 nm picosecond laser is used to characterize sensors from the second RSD production at the Fondazione Bruno Kessler. The paper first introduces the parametrization of the errors in the determination of the position and time coordinates in RSD, then outlines the reconstruction method, and finally presents the results. Three different pixel sizes are used in the analysis: 200 x 340, 450 x 450, and 1300 x 1300 microns^2. At gain = 30, the 450 x 450 microns^2 pixel achieves a time jitter of 20 ps and a spatial resolution of 15 microns concurrently, while the 1300 x 1300 microns^2 pixel achieves 30 ps and 30 micron, respectively. The implementation of cross-shaped electrodes improves considerably the response uniformity over the pixel surface.
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Submitted 24 November, 2022;
originally announced November 2022.
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Silicon sensors with resistive read-out: Machine Learning techniques for ultimate spatial resolution
Authors:
Marta Tornago,
Flavio Giobergia,
Luca Menzio,
Federico Siviero,
Roberta Arcidiacono,
Nicolò Cartiglia,
Marco Costa,
Marco Ferrero,
Giulia Gioachin,
Marco Mandurrino,
Valentina Sola
Abstract:
Resistive AC-coupled Silicon Detectors (RSDs) are based on the Low Gain Avalanche Diode (LGAD) technology, characterized by a continuous gain layer, and by the innovative introduction of resistive read-out. Thanks to a novel electrode design aimed at maximizing signal sharing, RSD2, the second RSD production by Fondazione Bruno Kessler (FBK), achieves a position resolution on the whole pixel surfa…
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Resistive AC-coupled Silicon Detectors (RSDs) are based on the Low Gain Avalanche Diode (LGAD) technology, characterized by a continuous gain layer, and by the innovative introduction of resistive read-out. Thanks to a novel electrode design aimed at maximizing signal sharing, RSD2, the second RSD production by Fondazione Bruno Kessler (FBK), achieves a position resolution on the whole pixel surface of about 8 $μm$ for 200-$μm$ pitch. RSD2 arrays have been tested using a Transient Current Technique setup equipped with a 16-channel digitizer, and results on spatial resolution have been obtained with machine learning algorithms.
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Submitted 2 November, 2022; v1 submitted 17 August, 2022;
originally announced August 2022.
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DC-coupled resistive silicon detectors for 4-D tracking
Authors:
L. Menzio,
R. Arcidiacono,
G. Borghi,
M. Boscardin,
N. Cartiglia,
M. Centis Vignali,
M. Costa,
G-F. Dalla Betta,
M. Ferrero,
F. Ficorella,
G. Gioachin,
M. Mandurrino,
L. Pancheri,
G. Paternoster,
F. Siviero,
V. Sola,
M. Tornago
Abstract:
In this work, we introduce a new design concept: the DC-Coupled Resistive Silicon Detectors, based on the LGAD technology. This new approach intends to address a few known features of the first generation of AC-Coupled Resistive Silicon Detectors (RSD). Our simulation exploits a fast hybrid approach based on a combination of two packages, Weightfield2 and LTSpice. It demonstrates that the key feat…
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In this work, we introduce a new design concept: the DC-Coupled Resistive Silicon Detectors, based on the LGAD technology. This new approach intends to address a few known features of the first generation of AC-Coupled Resistive Silicon Detectors (RSD). Our simulation exploits a fast hybrid approach based on a combination of two packages, Weightfield2 and LTSpice. It demonstrates that the key features of the RSD design are maintained, yielding excellent timing and spatial resolutions: a few tens of ps and a few microns. In the presentation, we will outline the optimization methodology and the results of the simulation. We will present detailed studies on the effect of changing the ratio between the n+ layer resistivity and the low-resistivity ring and on the achievable temporal and spatial resolution.
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Submitted 14 April, 2022;
originally announced April 2022.
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4D Tracking: Present Status and Perspective
Authors:
N. Cartiglia,
R. Arcidiacono,
M. Costa,
M. Ferrero,
G. Gioachin,
M. Mandurrino,
L. Menzio,
F. Siviero,
V. Sola,
M. Tornago
Abstract:
The past ten years have seen the advent of silicon-based precise timing detectors for charged particle tracking. The underlying reason for this evolution is a design innovation: the Low-Gain Avalanche Diode (LGAD). In its simplicity, the LGAD design is an obvious step with momentous consequences: low gain leads to large signals maintaining sensors stability and low noise, allowing sensor segmentat…
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The past ten years have seen the advent of silicon-based precise timing detectors for charged particle tracking. The underlying reason for this evolution is a design innovation: the Low-Gain Avalanche Diode (LGAD). In its simplicity, the LGAD design is an obvious step with momentous consequences: low gain leads to large signals maintaining sensors stability and low noise, allowing sensor segmentation. Albeit introduced for a different reason, to compensate for charge trap** in irradiated silicon sensors, LGAD found fertile ground in the design of silicon-based timing detectors. Spurred by this design innovation, solid-state-based timing detectors for charged particles are going through an intense phase of R&D, and hybrid and monolithic sensors, with or without internal gain, are being explored. This contribution offers a review of this booming field.
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Submitted 11 July, 2022; v1 submitted 13 April, 2022;
originally announced April 2022.
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Tuning of gain layer do** concentration and Carbon implantation effect on deep gain layer
Authors:
S. M. Mazza,
C. Gee,
Y. Zhao,
R. Padilla,
E. Ryan,
N. Tournebise,
B. Darby,
F. McKinney-Martinez,
H. F. -W. Sadrozinski,
A. Seiden,
B. Schumm,
V. Cindro,
G. Kramberger,
I. Mandić,
M. Mikuž,
M. Zavrtanik,
R. Arcidiacono,
N. Cartiglia,
M. Ferrero,
M. Mandurrino,
V. Sola,
A. Staiano,
M. Boscardin,
G. F. Della Betta,
F. Ficorella
, et al. (2 additional authors not shown)
Abstract:
Next generation Low Gain Avalanche Diodes (LGAD) produced by Hamamatsu photonics (HPK) and Fondazione Bruno Kessler (FBK) were tested before and after irradiation with ~1MeV neutrons at the JSI facility in Ljubljana. Sensors were irradiated to a maximum 1-MeV equivalent fluence of 2.5E15 Neq/cm2. The sensors analysed in this paper are an improvement after the lessons learned from previous FBK and…
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Next generation Low Gain Avalanche Diodes (LGAD) produced by Hamamatsu photonics (HPK) and Fondazione Bruno Kessler (FBK) were tested before and after irradiation with ~1MeV neutrons at the JSI facility in Ljubljana. Sensors were irradiated to a maximum 1-MeV equivalent fluence of 2.5E15 Neq/cm2. The sensors analysed in this paper are an improvement after the lessons learned from previous FBK and HPK productions that were already reported in precedent papers. The gain layer of HPK sensors was fine-tuned to optimize the performance before and after irradiation. FBK sensors instead combined the benefit of Carbon infusion and deep gain layer to further the radiation hardness of the sensors and reduced the bulk thickness to enhance the timing resolution. The sensor performance was measured in charge collection studies using \b{eta}-particles from a 90Sr source and in capacitance-voltage scans (C-V) to determine the bias to deplete the gain layer. The collected charge and the timing resolution were measured as a function of bias voltage at -30C. Finally a correlation is shown between the bias voltage to deplete the gain layer and the bias voltage needed to reach a certain amount of gain in the sensor. HPK sensors showed a better performance before irradiation while maintaining the radiation hardness of the previous production. FBK sensors showed exceptional radiation hardness allowing a collected charge up to 10 fC and a time resolution of 40 ps at the maximum fluence.
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Submitted 31 January, 2022; v1 submitted 21 January, 2022;
originally announced January 2022.
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Optimization of the Gain Layer Design of Ultra-Fast Silicon Detectors
Authors:
Federico Siviero,
Roberta Arcidiacono,
Giacomo Borghi,
Maurizio Boscardin,
Nicolo Cartiglia,
Matteo Centis Vignali,
Marco Costa,
Gian Franco Dalla Betta,
Marco Ferrero,
Francesco Ficorella,
Giulia Gioachin,
Marco Mandurrino,
Simone Mazza,
Luca Menzio,
Lucio Pancheri,
Giovanni Paternoster,
Hartmut F. W. Sadrozinski,
Abraham Seiden,
Valentina Sola,
Marta Tornago
Abstract:
In the past few years, the need of measuring accurately the spatial and temporal coordinates of the particles generated in high-energy physics experiments has spurred a strong R\&D in the field of silicon sensors. Within these research activities, the so-called Ultra-Fast Silicon Detectors (UFSDs), silicon sensors optimized for timing based on the Low-Gain Avalanche Diode (LGAD) design, have been…
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In the past few years, the need of measuring accurately the spatial and temporal coordinates of the particles generated in high-energy physics experiments has spurred a strong R\&D in the field of silicon sensors. Within these research activities, the so-called Ultra-Fast Silicon Detectors (UFSDs), silicon sensors optimized for timing based on the Low-Gain Avalanche Diode (LGAD) design, have been proposed and adopted by the CMS and ATLAS collaborations for their respective timing layers. The defining feature of the Ultra-Fast Silicon Detectors (UFSDs) is the internal multiplication mechanism, determined by the gain layer design. In this paper, the performances of several types of gain layers, measured with a telescope instrumented with a $^{90}$Sr $β$-source, are reported and compared. The measured sensors are produced by Fondazione Bruno Kessler (FBK) and Hamamatsu Photonics (HPK). The sensor yielding the best performance, both when new and irradiated, is an FBK 45\mum-thick sensor with a carbonated deep gain implant, where the carbon and the boron implants are annealed concurrently with a low thermal load. This sensor is able to achieve a time resolution of 40~ps up to a radiation fluence of~\fluence{2.5}{15}, delivering at least 5~fC of charge.
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Submitted 8 March, 2022; v1 submitted 1 December, 2021;
originally announced December 2021.
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Inter-pad dead regions of irradiated FBK Low Gain Avalanche Detectors
Authors:
B. Darby,
S. M. Mazza,
F. McKinney-Martinez,
R. Padilla,
H. F. -W. Sadrozinski,
A. Seiden,
B. Schumm,
M. Wilder,
Y. Zhao,
R. Arcidiacono,
N. Cartiglia,
M. Ferrero,
M. Mandurrino,
V. Sola,
A. Staiano,
V. Cindro,
G. Kranberger,
I. Mandiz,
M. Mikuz,
M. Zavtranik,
M. Boscardin,
G. F. Della Betta,
F. Ficorella,
L. Pancheri,
G. Paternoster
Abstract:
Low Gain Avalanche Detectors (LGADs) are a type of thin silicon detector with a highly doped gain layer. LGADs manufactured by Fondazione Bruno Kessler (FBK) were tested before and after irradiation with neutrons. In this study, the Inter-pad distances (IPDs), defined as the width of the distances between pads, were measured with a TCT laser system. The response of the laser was tuned using $β$-pa…
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Low Gain Avalanche Detectors (LGADs) are a type of thin silicon detector with a highly doped gain layer. LGADs manufactured by Fondazione Bruno Kessler (FBK) were tested before and after irradiation with neutrons. In this study, the Inter-pad distances (IPDs), defined as the width of the distances between pads, were measured with a TCT laser system. The response of the laser was tuned using $β$-particles from a 90Sr source. These insensitive "dead zones" are created by a protection structure to avoid breakdown, the Junction Termination Extension (JTE), which separates the pads. The effect of neutron radiation damage at \fluence{1.5}{15}, and \fluence{2.5}{15} on IPDs was studied. These distances are compared to the nominal distances given from the vendor, it was found that the higher fluence corresponds to a better matching of the nominal IPD.
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Submitted 19 September, 2022; v1 submitted 24 November, 2021;
originally announced November 2021.
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First application of machine learning algorithms to the position reconstruction in Resistive Silicon Detectors
Authors:
Federico Siviero,
Roberta Arcidiacono,
Nicolò Cartiglia,
Marco Costa,
Marco Ferrero,
Marco Mandurrino,
Valentina Sola,
Amedeo Staiano,
Marta Tornago
Abstract:
RSDs (Resistive AC-Coupled Silicon Detectors) are n-in-p silicon sensors based on the LGAD (Low-Gain Avalanche Diode) technology, featuring a continuous gain layer over the whole sensor area. The truly innovative feature of these sensors is that the signal induced by an ionising particle is seen on several pixels, allowing the use of reconstruction techniques that combine the information from many…
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RSDs (Resistive AC-Coupled Silicon Detectors) are n-in-p silicon sensors based on the LGAD (Low-Gain Avalanche Diode) technology, featuring a continuous gain layer over the whole sensor area. The truly innovative feature of these sensors is that the signal induced by an ionising particle is seen on several pixels, allowing the use of reconstruction techniques that combine the information from many read-out channels. In this contribution, the first application of a machine learning technique to RSD devices is presented. The spatial resolution of this technique is compared to that obtained with the standard RSD reconstruction methods that use analytical descriptions of the signal sharing mechanism. A Multi-Output regressor algorithm, trained with a combination of simulated and real data, leads to a spatial resolution of less than 2 $μm$ for a sensor with a 100 $μm$ pixel. The prospects of future improvements are also discussed.
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Submitted 26 January, 2021; v1 submitted 4 November, 2020;
originally announced November 2020.
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Effect of deep gain layer and Carbon infusion on LGAD radiation hardness
Authors:
R Padilla,
C. Labitan,
Z. Galloway,
C. Gee,
S. M. Mazza,
F. McKinney-Martinez,
H. F. -W. Sadrozinski,
A. Seiden,
B. Schumm,
M. Wilder,
Y. Zhao,
H. Ren,
Y. **,
M. Lockerby,
V. Cindro,
G. Kramberger,
I. Mandiz,
M. Mikuz,
M. Zavrtanik,
R. Arcidiacono,
N. Cartiglia,
M. Ferrero,
M. Mandurrino,
V. Sola,
A. Staiano
Abstract:
The properties of 50 um thick Low Gain Avalanche Diode (LGAD) detectors manufactured by Hamamatsu photonics (HPK) and Fondazione Bruno Kessler (FBK) were tested before and after irradiation with 1 MeV neutrons. Their performance were measured in charge collection studies using b-particles from a 90Sr source and in capacitance-voltage scans (C-V) to determine the bias to deplete the gain layer. Car…
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The properties of 50 um thick Low Gain Avalanche Diode (LGAD) detectors manufactured by Hamamatsu photonics (HPK) and Fondazione Bruno Kessler (FBK) were tested before and after irradiation with 1 MeV neutrons. Their performance were measured in charge collection studies using b-particles from a 90Sr source and in capacitance-voltage scans (C-V) to determine the bias to deplete the gain layer. Carbon infusion to the gain layer of the sensors was tested by FBK in the UFSD3 production. HPK instead produced LGADs with a very thin, highly doped and deep multiplication layer. The sensors were exposed to a neutron fluence from 4e14 neq/cm2 to 4e15 neq/cm2. The collected charge and the timing resolution were measured as a function of bias voltage at -30C, furthermore the profile of the capacitance over voltage of the sensors was measured.
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Submitted 27 July, 2020; v1 submitted 10 April, 2020;
originally announced April 2020.
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Silicon Sensors for Future Particle Trackers
Authors:
N. Cartiglia,
R. Arcidiacono,
G. Borghi,
M. Boscardin,
M. Costa,
Z. Galloway,
F. Fausti,
M. Ferrero,
F. Ficorella,
M. Mandurrino,
S. Mazza,
E. J. Olave,
G. Paternoster,
F. Siviero,
H. F-W. Sadrozinski,
V. Sola,
A. Staiano,
A. Seiden,
M. Tornago,
Y. Zhao
Abstract:
Several future high-energy physics facilities are currently being planned. The proposed projects include high energy $e^+ e^-$ circular and linear colliders, hadron colliders and muon colliders, while the Electron-Ion Collider (EIC) has already been approved for construction at the Brookhaven National Laboratory. Each proposal has its own advantages and disadvantages in term of readiness, cost, sc…
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Several future high-energy physics facilities are currently being planned. The proposed projects include high energy $e^+ e^-$ circular and linear colliders, hadron colliders and muon colliders, while the Electron-Ion Collider (EIC) has already been approved for construction at the Brookhaven National Laboratory. Each proposal has its own advantages and disadvantages in term of readiness, cost, schedule and physics reach, and each proposal requires the design and production of specific new detectors. This paper first presents the performances required to the future silicon tracking systems at the various new facilities, and then it illustrates a few possibilities for the realization of such silicon trackers. The challenges posed by the future facilities require a new family of silicon detectors, where features such as impact ionization, radiation damage saturation, charge sharing, and analog readout are exploited to meet these new demands.
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Submitted 31 March, 2020;
originally announced March 2020.
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Experimental Study of Acceptor Removal in UFSD
Authors:
Y. **,
H. Ren,
S. Christie,
Z. Galloway,
C. Gee,
C. Labitan,
M. Lockerby,
F. Martinez-McKinney,
S. M. Mazza,
R. Padilla,
H. F. -W. Sadrozinski,
B. Schumm,
A. Seiden,
M. Wilder,
W. Wyatt,
Y. Zhao,
R. Arcidiacono,
N. Cartiglia,
M. Ferrero,
M. Mandurrino,
F. Siviero,
V. Sola,
M. Tornago,
V. Cindro,
A. Howard
, et al. (3 additional authors not shown)
Abstract:
The performance of the Ultra-Fast Silicon Detectors (UFSD) after irradiation with neutrons and protons is compromised by the removal of acceptors in the thin layer below the junction responsible for the gain. This effect is tested both with C-V measurements of the do** concentration and with measurements of charge collection using charged particles. We find a perfect linear correlation between t…
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The performance of the Ultra-Fast Silicon Detectors (UFSD) after irradiation with neutrons and protons is compromised by the removal of acceptors in the thin layer below the junction responsible for the gain. This effect is tested both with C-V measurements of the do** concentration and with measurements of charge collection using charged particles. We find a perfect linear correlation between the bias voltage to deplete the gain layer determined with C-V and the bias voltage to collect a defined charge, measured with charge collection. An example for the usefulness of this correlation is presented.
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Submitted 16 September, 2020; v1 submitted 16 March, 2020;
originally announced March 2020.
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Silicon detectors for the LHC Phase-II upgrade and beyond. RD50 status report
Authors:
Marco Mandurrino
Abstract:
It is foreseen to significantly increase the luminosity of the LHC in order to harvest the maximum physics potential. Especially the Phase-II-Upgrade foreseen for 2023 will mean unprecedented radiation levels, significantly beyond the limits of the Silicon trackers currently employed. All-Silicon central trackers are being studied in ATLAS, CMS and LHCb, with extremely radiation-hard Silicon senso…
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It is foreseen to significantly increase the luminosity of the LHC in order to harvest the maximum physics potential. Especially the Phase-II-Upgrade foreseen for 2023 will mean unprecedented radiation levels, significantly beyond the limits of the Silicon trackers currently employed. All-Silicon central trackers are being studied in ATLAS, CMS and LHCb, with extremely radiation-hard Silicon sensors to be employed on the innermost layers. Within the RD50 Collaboration, a large R&D program has been underway for more than a decade across experimental boundaries to develop Silicon sensors with sufficient radiation tolerance for HL-LHC trackers. Key areas of recent RD50 research include new sensor fabrication technologies such as HV-CMOS, exploiting the wide availability of the CMOS process in the semiconductor industry at very competitive prices compared to the highly specialized foundries that normally produce particle detectors on small wafers. We also seek for a deeper understanding of the connection between the macroscopic sensor properties such as radiation-induced increase of leakage current, do** concentration and trap**, and the microscopic properties at the defect level. Another strong activity is the development of advanced sensor types like 3D Silicon detectors, designed for the extreme radiation levels expected for the vertexing layers at the HL-LHC. A further focus area is the field of LGADs, where a dedicated multiplication layer to create a high field region is built into the sensor. LGADs are characterized by a high signal also after irradiation and a very fast signal compared to traditional Silicon detectors with make them ideal candidates for ATLAS and CMS timing layers in the HL-LHC. We will present the state of the art in several Silicon detector technologies as outlined above and at radiation levels corresponding to HL-LHC fluences and partially beyond.
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Submitted 14 October, 2019;
originally announced October 2019.
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First demonstration of 200, 100, and 50 um pitch Resistive AC-Coupled Silicon Detectors (RSD) with 100% fill-factor for 4D particle tracking
Authors:
M. Mandurrino,
R. Arcidiacono,
M. Boscardin,
N. Cartiglia,
G. F. Dalla Betta,
M. Ferrero,
F. Ficorella,
L. Pancheri,
G. Paternoster,
F. Siviero,
M. Tornago
Abstract:
We designed, produced, and tested RSD (Resistive AC-Coupled Silicon Detectors) devices, an evolution of the standard LGAD (Low-Gain Avalanche Diode) technology where a resistive n-type implant and a coupling dielectric layer have been implemented. The first feature works as a resistive sheet, freezing the multiplied charges, while the second one acts as a capacitive coupling for readout pads. We s…
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We designed, produced, and tested RSD (Resistive AC-Coupled Silicon Detectors) devices, an evolution of the standard LGAD (Low-Gain Avalanche Diode) technology where a resistive n-type implant and a coupling dielectric layer have been implemented. The first feature works as a resistive sheet, freezing the multiplied charges, while the second one acts as a capacitive coupling for readout pads. We succeeded in the challenging goal of obtaining very fine pitch (50, 100, and 200 um) while maintaining the signal waveforms suitable for high timing and 4D-tracking performances, as in the standard LGAD-based devices.
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Submitted 23 September, 2019; v1 submitted 7 July, 2019;
originally announced July 2019.
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Proprieties of FBK UFSDs after neutron and proton irradiation up to 6*10e15 neq/cm2
Authors:
S. M. Mazza,
E. Estrada,
Z. Galloway,
C. Gee,
A. Goto,
Z. Luce,
F. McKinney-Martinez,
R. Rodriguez,
H. F. -W. Sadrozinski,
A. Seiden,
B. Smithers,
Y. Zhao,
V. Cindro,
G. Kramberger,
I. Mandić,
M. Mikuž,
M. Zavrtanik R. Arcidiacono,
N. Cartiglia,
M. Ferrero,
M. Mandurrino,
V. Sola,
A. Staiano,
M. Boscardin,
G. F. Della Betta,
F. Ficorella
, et al. (2 additional authors not shown)
Abstract:
The properties of 60-μm thick Ultra-Fast Silicon Detectors (UFSD) detectors manufactured by Fondazione Bruno Kessler (FBK), Trento (Italy) were tested before and after irradiation with minimum ionizing particles (MIPs) from a 90Sr \b{eta}-source . This FBK production, called UFSD2, has UFSDs with gain layer made of Boron, Boron low-diffusion, Gallium, Carbonated Boron and Carbonated. The irradiati…
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The properties of 60-μm thick Ultra-Fast Silicon Detectors (UFSD) detectors manufactured by Fondazione Bruno Kessler (FBK), Trento (Italy) were tested before and after irradiation with minimum ionizing particles (MIPs) from a 90Sr \b{eta}-source . This FBK production, called UFSD2, has UFSDs with gain layer made of Boron, Boron low-diffusion, Gallium, Carbonated Boron and Carbonated. The irradiation with neutrons took place at the TRIGA reactor in Ljubljana, while the proton irradiation took place at CERN SPS. The sensors were exposed to a neutron fluence of 4*10e14, 8*1014, 1.5*10e15, 3*10e15, 6*10e15 neq/cm2 and to a proton fluence of 9.6*10e14 p/cm2, equivalent to a fluence of 6*10e14 neq/cm2. The internal gain and the timing resolution were measured as a function of bias voltage at -20C. The timing resolution was extracted from the time difference with a second calibrated UFSD in coincidence, using the constant fraction method for both.
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Submitted 18 March, 2020; v1 submitted 15 April, 2018;
originally announced April 2018.
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Radiation resistant LGAD design
Authors:
M. Ferrero,
R. Arcidiacono,
M. Barozzi,
M. Boscardin,
N. Cartiglia,
G. F. Dalla Betta,
Z. Galloway,
M. Mandurrino,
S. Mazza,
G. Paternoster,
F. Ficorella,
L. Pancheri,
H-F W. Sadrozinski,
V. Sola,
A. Staiano,
A. Seiden,
F. Siviero,
M. Tornago,
Y. Zhao
Abstract:
In this paper, we report on the radiation resistance of 50-micron thick LGAD detectors manufactured at the Fondazione Bruno Kessler employing several different do** combinations of the gain layer. LGAD detectors with gain layer do** of Boron, Boron low-diffusion, Gallium, Carbonated Boron and Carbonated Gallium have been designed and successfully produced. These sensors have been exposed to ne…
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In this paper, we report on the radiation resistance of 50-micron thick LGAD detectors manufactured at the Fondazione Bruno Kessler employing several different do** combinations of the gain layer. LGAD detectors with gain layer do** of Boron, Boron low-diffusion, Gallium, Carbonated Boron and Carbonated Gallium have been designed and successfully produced. These sensors have been exposed to neutron fluences up to $φ_n \sim 3 \cdot 10^{16}\; n/cm^2$ and to proton fluences up to $φ_p \sim 9\cdot10^{15}\; p/cm^2$ to test their radiation resistance. The experimental results show that Gallium-doped LGADs are more heavily affected by initial acceptor removal than Boron-doped LGAD, while the presence of Carbon reduces initial acceptor removal both for Gallium and Boron do**. Boron low-diffusion shows a higher radiation resistance than that of standard Boron implant, indicating a dependence of the initial acceptor removal mechanism upon the implant width. This study also demonstrates that proton irradiation is at least twice more effective in producing initial acceptor removal, making proton irradiation far more damaging than neutron irradiation.
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Submitted 31 August, 2018; v1 submitted 5 February, 2018;
originally announced February 2018.
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Properties of HPK UFSD after neutron irradiation up to 6e15 n/cm2
Authors:
Z. Galloway,
V. Fadeyev,
P. Freeman,
E. Gkougkousis,
B. Gruey,
C. A. Labitan,
Z. Luce,
F. McKinney-Martinez,
H. F. -W. Sadrozinski,
A. Seiden,
E. Spencer,
M. Wilder,
N. Woods,
A. Zatserklyaniy,
Y. Zhao,
N. Cartiglia,
M. Ferrero,
S. Giordanengo,
M. Mandurrino,
A. Staiano,
V. Sola,
F. Cenna,
F. Fausti,
R. Arcidiacono,
F. Carnasecchi
, et al. (5 additional authors not shown)
Abstract:
In this paper we report results from a neutron irradiation campaign of Ultra-Fast Silicon Detectors (UFSD) with fluences of 1e14, 3e14, 6e14, 1e15, 3e15, 6e15 n/cm2. The UFSD used in this study are circular 50 micro-meter thick Low-Gain Avalanche Detectors (LGAD), with a 1.0 mm diameter active area. They have been produced by Hamamatsu Photonics (HPK), Japan, with pre-radiation internal gain in th…
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In this paper we report results from a neutron irradiation campaign of Ultra-Fast Silicon Detectors (UFSD) with fluences of 1e14, 3e14, 6e14, 1e15, 3e15, 6e15 n/cm2. The UFSD used in this study are circular 50 micro-meter thick Low-Gain Avalanche Detectors (LGAD), with a 1.0 mm diameter active area. They have been produced by Hamamatsu Photonics (HPK), Japan, with pre-radiation internal gain in the range 10-100 depending on the bias voltage. The sensors were tested pre-irradiation and post-irradiation with minimum ionizing particle (MIPs) from a 90Sr based \b{eta}-source. The leakage current, internal gain and the timing resolution were measured as a function of bias voltage at -20C and -30C. The timing resolution was extracted from the time difference with a second calibrated UFSD in coincidence, using the constant fraction method for both. The dependence of the gain upon the irradiation fluence is consistent with the concept of acceptor removal and the gain decreases from about 80 pre-irradiation to 7 after a fluence of 6e15 n/cm2. Consequently, the timing resolution was found to deteriorate from 20 ps to 50 ps. The results indicate that the most accurate time resolution is obtained at a value of the constant fraction discriminator (CFD) threshold used to determine the time of arrival varying with fluence, from 10% pre-radiation to 60% at the highest fluence. Key changes to the pulse shape induced by irradiation, i.e. (i) a reduce sensitivity of the pulse shape on the initial non-uniform charge deposition, (ii) the shortening of the rise time and (iii) the reduced pulse height, were compared with the WF2 simulation program and found to be in agreement.
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Submitted 10 April, 2020; v1 submitted 16 July, 2017;
originally announced July 2017.
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Beam test results of a 16 ps timing system based on ultra-fast silicon detectors
Authors:
N. Cartiglia,
A. Staiano,
V. Sola,
R. Arcidiacono,
R. Cirio,
F. Cenna,
M. Ferrero,
V. Monaco,
R. Mulargia,
M. Obertino,
F. Ravera,
R. Sacchi,
A. Bellora,
S. Durando,
M. Mandurrino,
N. Minafra,
V. Fadeyev,
P. Freeman,
Z. Galloway,
E. Gkougkousis,
H. Grabas,
B. Gruey,
C. A. Labitan,
R. Losakul,
Z. Luce
, et al. (18 additional authors not shown)
Abstract:
In this paper we report on the timing resolution of the first production of 50 micro-meter thick Ultra-Fast Silicon Detectors (UFSD) as obtained in a beam test with pions of 180 GeV/c momentum. UFSD are based on the Low-Gain Avalanche Detectors (LGAD) design, employing n-on-p silicon sensors with internal charge multiplication due to the presence of a thin, low-resistivity diffusion layer below th…
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In this paper we report on the timing resolution of the first production of 50 micro-meter thick Ultra-Fast Silicon Detectors (UFSD) as obtained in a beam test with pions of 180 GeV/c momentum. UFSD are based on the Low-Gain Avalanche Detectors (LGAD) design, employing n-on-p silicon sensors with internal charge multiplication due to the presence of a thin, low-resistivity diffusion layer below the junction. The UFSD used in this test belongs to the first production of thin (50 μm) sensors, with an pad area of 1.4 mm2. The gain was measured to vary between 5 and 70 depending on the bias voltage. The experimental setup included three UFSD and a fast trigger consisting of a quartz bar readout by a SiPM. The timing resolution, determined comparing the time of arrival of the particle in one or more UFSD and the trigger counter, for single UFSD was measured to be 35 ps for a bias voltage of 200 V, and 26 ps for a bias voltage of 240 V, and for the combination of 3 UFSD to be 20 ps for a bias voltage of 200 V, and 15 ps for a bias voltage of 240 V.
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Submitted 3 January, 2017; v1 submitted 30 August, 2016;
originally announced August 2016.