Complete and Near-Optimal Robotic Crack Coverage and Filling in Civil Infrastructure
Authors:
Vishnu Veeraraghavan,
Kyle Hunte,
**gang Yi,
Kaiyan Yu
Abstract:
We present a simultaneous sensor-based inspection and footprint coverage (SIFC) planning and control design with applications to autonomous robotic crack map** and filling. The main challenge of the SIFC problem lies in the coupling of complete sensing (for map**) and robotic footprint (for filling) coverage tasks. Initially, we assume known target information (e.g., crack) and employ classic…
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We present a simultaneous sensor-based inspection and footprint coverage (SIFC) planning and control design with applications to autonomous robotic crack map** and filling. The main challenge of the SIFC problem lies in the coupling of complete sensing (for map**) and robotic footprint (for filling) coverage tasks. Initially, we assume known target information (e.g., crack) and employ classic cell decomposition methods to achieve complete sensing coverage of the workspace and complete robotic footprint coverage using the least-cost route. Subsequently, we generalize the algorithm to handle unknown target information, allowing the robot to scan and incrementally construct the target graph online while conducting robotic footprint coverage. The online polynomial-time SIFC planning algorithm minimizes the total robot traveling distance, guarantees complete sensing coverage of the entire workspace, and achieves near-optimal robotic footprint coverage, as demonstrated through empirical experiments. For the demonstrated application, we design coordinated nozzle motion control with the planned robot trajectory to efficiently fill all cracks within the robot's footprint. Experimental results are presented to illustrate the algorithm's design, performance, and comparisons. The SIFC algorithm offers a high-efficiency motion planning solution for various robotic applications requiring simultaneous sensing and actuation coverage.
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Submitted 1 March, 2024;
originally announced March 2024.
