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Framework for Automatic PCB Marking Detection and Recognition for Hardware Assurance
Authors:
Olivia P. Dizon-Paradis,
Daniel E. Capecci,
Nathan T. Jessurun,
Damon L. Woodard,
Mark M. Tehranipoor,
Navid Asadizanjani
Abstract:
A Bill of Materials (BoM) is a list of all components on a printed circuit board (PCB). Since BoMs are useful for hardware assurance, automatic BoM extraction (AutoBoM) is of great interest to the government and electronics industry. To achieve a high-accuracy AutoBoM process, domain knowledge of PCB text and logos must be utilized. In this study, we discuss the challenges associated with automati…
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A Bill of Materials (BoM) is a list of all components on a printed circuit board (PCB). Since BoMs are useful for hardware assurance, automatic BoM extraction (AutoBoM) is of great interest to the government and electronics industry. To achieve a high-accuracy AutoBoM process, domain knowledge of PCB text and logos must be utilized. In this study, we discuss the challenges associated with automatic PCB marking extraction and propose 1) a plan for collecting salient PCB marking data, and 2) a framework for incorporating this data for automatic PCB assurance. Given the proposed dataset plan and framework, subsequent future work, implications, and open research possibilities are detailed.
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Submitted 24 July, 2023;
originally announced July 2023.
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FPIC: A Novel Semantic Dataset for Optical PCB Assurance
Authors:
Nathan Jessurun,
Olivia P. Dizon-Paradis,
Jacob Harrison,
Shajib Ghosh,
Mark M. Tehranipoor,
Damon L. Woodard,
Navid Asadizanjani
Abstract:
Outsourced printed circuit board (PCB) fabrication necessitates increased hardware assurance capabilities. Several assurance techniques based on automated optical inspection (AOI) have been proposed that leverage PCB images acquired using digital cameras. We review state-of-the-art AOI techniques and observe a strong, rapid trend toward machine learning (ML) solutions. These require significant am…
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Outsourced printed circuit board (PCB) fabrication necessitates increased hardware assurance capabilities. Several assurance techniques based on automated optical inspection (AOI) have been proposed that leverage PCB images acquired using digital cameras. We review state-of-the-art AOI techniques and observe a strong, rapid trend toward machine learning (ML) solutions. These require significant amounts of labeled ground truth data, which is lacking in the publicly available PCB data space. We contribute the FICS PCB Image Collection (FPIC) dataset to address this need. Additionally, we outline new hardware security methodologies enabled by our data set.
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Submitted 14 March, 2023; v1 submitted 16 February, 2022;
originally announced February 2022.
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Hardware Trust and Assurance through Reverse Engineering: A Survey and Outlook from Image Analysis and Machine Learning Perspectives
Authors:
Ulbert J. Botero,
Ronald Wilson,
Hangwei Lu,
Mir Tanjidur Rahman,
Mukhil A. Mallaiyan,
Fatemeh Ganji,
Navid Asadizanjani,
Mark M. Tehranipoor,
Damon L. Woodard,
Domenic Forte
Abstract:
In the context of hardware trust and assurance, reverse engineering has been often considered as an illegal action. Generally speaking, reverse engineering aims to retrieve information from a product, i.e., integrated circuits (ICs) and printed circuit boards (PCBs) in hardware security-related scenarios, in the hope of understanding the functionality of the device and determining its constituent…
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In the context of hardware trust and assurance, reverse engineering has been often considered as an illegal action. Generally speaking, reverse engineering aims to retrieve information from a product, i.e., integrated circuits (ICs) and printed circuit boards (PCBs) in hardware security-related scenarios, in the hope of understanding the functionality of the device and determining its constituent components. Hence, it can raise serious issues concerning Intellectual Property (IP) infringement, the (in)effectiveness of security-related measures, and even new opportunities for injecting hardware Trojans. Ironically, reverse engineering can enable IP owners to verify and validate the design. Nevertheless, this cannot be achieved without overcoming numerous obstacles that limit successful outcomes of the reverse engineering process. This paper surveys these challenges from two complementary perspectives: image processing and machine learning. These two fields of study form a firm basis for the enhancement of efficiency and accuracy of reverse engineering processes for both PCBs and ICs. In summary, therefore, this paper presents a roadmap indicating clearly the actions to be taken to fulfill hardware trust and assurance objectives.
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Submitted 7 April, 2021; v1 submitted 11 February, 2020;
originally announced February 2020.
