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Distributed sequential federated learning
Authors:
Z. F. Wang,
X. Y. Zhang,
Y-c I. Chang
Abstract:
The analysis of data stored in multiple sites has become more popular, raising new concerns about the security of data storage and communication. Federated learning, which does not require centralizing data, is a common approach to preventing heavy data transportation, securing valued data, and protecting personal information protection. Therefore, determining how to aggregate the information obta…
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The analysis of data stored in multiple sites has become more popular, raising new concerns about the security of data storage and communication. Federated learning, which does not require centralizing data, is a common approach to preventing heavy data transportation, securing valued data, and protecting personal information protection. Therefore, determining how to aggregate the information obtained from the analysis of data in separate local sites has become an important statistical issue. The commonly used averaging methods may not be suitable due to data nonhomogeneity and incomparable results among individual sites, and applying them may result in the loss of information obtained from the individual analyses. Using a sequential method in federated learning with distributed computing can facilitate the integration and accelerate the analysis process. We develop a data-driven method for efficiently and effectively aggregating valued information by analyzing local data without encountering potential issues such as information security and heavy transportation due to data communication. In addition, the proposed method can preserve the properties of classical sequential adaptive design, such as data-driven sample size and estimation precision when applied to generalized linear models. We use numerical studies of simulated data and an application to COVID-19 data collected from 32 hospitals in Mexico, to illustrate the proposed method.
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Submitted 31 January, 2023;
originally announced February 2023.
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Fabrication of Embedded Microvalve on PMMA Microfluidic Devices through Surface Functionalization
Authors:
A. G. G. Toh,
Z. F. Wang,
S. H. Ng
Abstract:
The integration of a PDMS membrane within orthogonally placed PMMA microfluidic channels enables the pneumatic actuation of valves within bonded PMMA-PDMS-PMMA multilayer devices. Here, surface functionalization of PMMA substrates via acid catalyzed hydrolysis and air plasma corona treatment were investigated as possible techniques to permanently bond PMMA microfluidic channels to PDMS surfaces.…
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The integration of a PDMS membrane within orthogonally placed PMMA microfluidic channels enables the pneumatic actuation of valves within bonded PMMA-PDMS-PMMA multilayer devices. Here, surface functionalization of PMMA substrates via acid catalyzed hydrolysis and air plasma corona treatment were investigated as possible techniques to permanently bond PMMA microfluidic channels to PDMS surfaces. FTIR and water contact angle analysis of functionalized PMMA substrates showed that air plasma corona treatment was most effective in inducing PMMA hydrophilicity. Subsequent fluidic tests showed that air plasma modified and bonded PMMA multilayer devices could withstand fluid pressure at an operational flow rate of 9 mircoliters/min. The pneumatic actuation of the embedded PDMS membrane was observed through optical microscopy and an electrical resistance based technique. PDMS membrane actuation occurred at pneumatic pressures of as low as 10kPa and complete valving occurred at 14kPa for 100 micrometers x 100 micrometers channel cross-sections.
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Submitted 7 May, 2008;
originally announced May 2008.
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Studies of Polymer Deformation and Recovery in Hot Embossing
Authors:
X. C. Shan,
Y. C. Liu,
H. J. Lu,
Z. F. Wang,
Y. C. Lam
Abstract:
In large area micro hot embossing, the process temperature plays a critical role to both the local fidelity of microstructure formation and global uniformity. The significance of low temperature hot embossing is to improve global flatness of embossed devices. This paper reports on experimental studies of polymer deformation and relaxation in micro embossing when the process temperatures are belo…
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In large area micro hot embossing, the process temperature plays a critical role to both the local fidelity of microstructure formation and global uniformity. The significance of low temperature hot embossing is to improve global flatness of embossed devices. This paper reports on experimental studies of polymer deformation and relaxation in micro embossing when the process temperatures are below or near its glass transition temperature (Tg). In this investigation, an indentation system and a micro embosser were used to investigate the relationship of microstructure formation versus process temperature and load pressure. The depth of indentation was controlled and the load force at a certain indentation depth was measured. Experiments were carried out using 1 mm thick PMMA films with the process temperature ranging from Tg-55 degrees C to Tg +20 degrees C. The embossed structures included a single micro cavity and groups of micro cavity arrays. It was found that at temperature of Tg-55 degrees C, elastic deformation dominated the formation of microstructures and significant relaxation happened after embossing. From Tg-20 degrees C to Tg, plastic deformation dominated polymer deformation, and permanent cavities could be formed on PMMA substrates without obvious relaxation. However, the formation of protrusive structures as micro pillars was not complete since there was little polymer flow. With an increase in process temperature, microstructure could be formed under lower loading pressure. Considering the fidelity of a single microstructure and global flatness of embossed substrates, micro hot embossing at a low process temperature, but with good fidelity, should be preferred.
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Submitted 21 February, 2008;
originally announced February 2008.
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Formation of Embedded Microstructures by Thermal Activated Solvent Bonding
Authors:
S. H. Ng,
R. T. Tjeung,
Z. F. Wang,
A. C. W. Lu,
I. Rodriguez,
N. De Rooij
Abstract:
We present a thermal activated solvent bonding technique for the formation of embedded microstrucutres in polymer. It is based on the temperature dependent solubility of polymer in a liquid that is not a solvent at room temperature. With thermal activation, the liquid is transformed into a solvent of the polymer, creating a bonding capability through segmental or chain interdiffusion at the bond…
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We present a thermal activated solvent bonding technique for the formation of embedded microstrucutres in polymer. It is based on the temperature dependent solubility of polymer in a liquid that is not a solvent at room temperature. With thermal activation, the liquid is transformed into a solvent of the polymer, creating a bonding capability through segmental or chain interdiffusion at the bonding interface. The technique has advantages over the more commonly used thermal bonding due to its much lower operation temperature (30 degrees C lower than the material's Tg), lower load, as well as shorter time. Lap shear test indicated bonding shear strength of up to 2.9 MPa. Leak test based on the bubble emission technique showed that the bonded microfluidic device can withstand at least 6 bars (87 psi) of internal pressure (gauge) in the microchannel. This technique can be applied to other systems of polymer and solvent.
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Submitted 21 February, 2008;
originally announced February 2008.
