-
Energy Autonomous Wearable Sensors for Smart Healthcare: A Review
Authors:
Abhishek Singh Dahiya,
Jerome Thireau,
Jamila Boudaden,
Swatchith Lal,
Umair Gulzar,
Yan Zhang,
Thierry Gil,
Nadine Azemard,
Peter Ramm,
Tim Kiessling,
Cian O'Murchu,
Fredrik Sebelius,
Jonas Tilly,
Colm Glynn,
Shane Geary,
Colm O'Dwyer,
Kafil Razeeb,
Alain Lacampagne,
Benoit Charlot,
Aida Todri-Sanial
Abstract:
Energy Autonomous Wearable Sensors (EAWS) have attracted a large interest due to their potential to provide reliable measurements and continuous bioelectric signals, which help to reduce health risk factors early on, ongoing assessment for disease prevention, and maintaining optimum, lifelong health quality. This review paper presents recent developments and state-of-the-art research related to th…
▽ More
Energy Autonomous Wearable Sensors (EAWS) have attracted a large interest due to their potential to provide reliable measurements and continuous bioelectric signals, which help to reduce health risk factors early on, ongoing assessment for disease prevention, and maintaining optimum, lifelong health quality. This review paper presents recent developments and state-of-the-art research related to three critical elements that enable an EAWS. The first element is wearable sensors, which monitor human body physiological signals and activities. Emphasis is given on explaining different types of transduction mechanisms presented, and emerging materials and fabrication techniques. The second element is the flexible and wearable energy storage device to drive low-power electronics and the software needed for automatic detection of unstable physiological parameters. The third is the flexible and stretchable energy harvesting module to recharge batteries for continuous operation of wearable sensors. We conclude by discussing some of the technical challenges in realizing energy-autonomous wearable sensing technologies and possible solutions for overcoming them.
△ Less
Submitted 5 December, 2019;
originally announced December 2019.
-
Through Silicon Vias as Enablers for 3D Systems
Authors:
E. Jung,
Andreas Ostmann,
Peter Ramm,
Jürgen Wolf,
Michael Toepper,
Maik Wiemer
Abstract:
This special session on 3D TSV's will highlight some of the fabrication processes and used technologies to create vias from the frontside of an active circuit to its backside and potential implementation solutions to form complex systems leveraging these novel possibilities. General techniques for via formation are discussed as well as advanced integration solutions leveraging the power of 3D TS…
▽ More
This special session on 3D TSV's will highlight some of the fabrication processes and used technologies to create vias from the frontside of an active circuit to its backside and potential implementation solutions to form complex systems leveraging these novel possibilities. General techniques for via formation are discussed as well as advanced integration solutions leveraging the power of 3D TSV's.
△ Less
Submitted 7 May, 2008;
originally announced May 2008.
-
Technologies for 3D Heterogeneous Integration
Authors:
Jürgen Wolf,
P. Ramm,
Armin Klumpp,
H. Reichl
Abstract:
3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also offers the possibility to build up systems with high complexity just by combining devices of different technologies. For ultra thin silicon is the base of this…
▽ More
3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also offers the possibility to build up systems with high complexity just by combining devices of different technologies. For ultra thin silicon is the base of this integration technology, the fundamental processing steps will be described, as well as appropriate handling concepts. Three main concepts for 3D integration have been developed at IZM. The approach with the greatest flexibility called Inter Chip Via - Solid Liquid Interdiffusion (ICV-SLID) is introduced. This is a chip-to-wafer stacking technology which combines the advantages of the Inter Chip Via (ICV) process and the solid-liquid-interdiffusion technique (SLID) of copper and tin. The fully modular ICV-SLID concept allows the formation of multiple device stacks. A test chip was designed and the total process sequence of the ICV-SLID technology for the realization of a three-layer chip-to-wafer stack was demonstrated. The proposed wafer-level 3D integration concept has the potential for low cost fabrication of multi-layer high-performance 3D-SoCs and is well suited as a replacement for embedded technologies based on monolithic integration. To address yield issues a wafer-level chip-scale handling is presented as well, to select known-good dies and work on them with wafer-level process sequences before joining them to integrated stacks.
△ Less
Submitted 7 May, 2008;
originally announced May 2008.
