Showing 1–5 of 5 results for author: Pionteck, T

Modeling Task Map** for Data-intensive Applications in Heterogeneous Systems

Authors: Martin Wilhelm, Hanna Geppert, Anna Drewes, Thilo Pionteck

Abstract: We introduce a new model for the task map** problem to aid in the systematic design of algorithms for heterogeneous systems including, but not limited to, CPUs, GPUs and FPGAs. A special focus is set on the communication between the devices, its influence on parallel execution, as well as on device-specific differences regarding parallelizability and streamability. We show how this model can be… ▽ More We introduce a new model for the task map** problem to aid in the systematic design of algorithms for heterogeneous systems including, but not limited to, CPUs, GPUs and FPGAs. A special focus is set on the communication between the devices, its influence on parallel execution, as well as on device-specific differences regarding parallelizability and streamability. We show how this model can be utilized in different system design phases and present two novel mixed-integer linear programs to demonstrate the usage of the model. △ Less

Submitted 12 August, 2022; originally announced August 2022.

Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators

Authors: Jan Moritz Joseph, Ananda Samajdar, Lingjun Zhu, Rainer Leupers, Sung-Kyu Lim, Thilo Pionteck, Tushar Krishna

Abstract: The everlasting demand for higher computing power for deep neural networks (DNNs) drives the development of parallel computing architectures. 3D integration, in which chips are integrated and connected vertically, can further increase performance because it introduces another level of spatial parallelism. Therefore, we analyze dataflows, performance, area, power and temperature of such 3D-DNN-acce… ▽ More The everlasting demand for higher computing power for deep neural networks (DNNs) drives the development of parallel computing architectures. 3D integration, in which chips are integrated and connected vertically, can further increase performance because it introduces another level of spatial parallelism. Therefore, we analyze dataflows, performance, area, power and temperature of such 3D-DNN-accelerators. Monolithic and TSV-based stacked 3D-ICs are compared against 2D-ICs. We identify workload properties and architectural parameters for efficient 3D-ICs and achieve up to 9.14x speedup of 3D vs. 2D. We discuss area-performance trade-offs. We demonstrate applicability as the 3D-IC draws similar power as 2D-ICs and is not thermal limited. △ Less

Submitted 18 February, 2021; v1 submitted 23 December, 2020; originally announced December 2020.

Ratatoskr: An open-source framework for in-depth power, performance and area analysis in 3D NoCs

Authors: Jan Moritz Joseph, Lennart Bamberg, Imad Hajjar, Anna Drewes, Behnam Razi Perjikolaei, Alberto García-Ortiz, Thilo Pionteck

Abstract: We introduce ratatoskr, an open-source framework for in-depth power, performance and area (PPA) analysis in NoCs for 3D-integrated and heterogeneous System-on-Chips (SoCs). It covers all layers of abstraction by providing a NoC hardware implementation on RT level, a NoC simulator on cycle-accurate level and an application model on transaction level. By this comprehensive approach, ratatoskr can pr… ▽ More We introduce ratatoskr, an open-source framework for in-depth power, performance and area (PPA) analysis in NoCs for 3D-integrated and heterogeneous System-on-Chips (SoCs). It covers all layers of abstraction by providing a NoC hardware implementation on RT level, a NoC simulator on cycle-accurate level and an application model on transaction level. By this comprehensive approach, ratatoskr can provide the following specific PPA analyses: Dynamic power of links can be measured within 2.4% accuracy of bit-level simulations while maintaining cycle-accurate simulation speed. Router power is determined from RT level synthesis combined with cycle-accurate simulations. The performance of the whole NoC can be measured both via cycle-accurate and RT level simulations. The performance of individual routers is obtained from RT level including gate-level verification. The NoC area is calculated from RT level. Despite these manifold features, ratatoskr offers easy two-step user interaction: First, a single point-of-entry that allows to set design parameters and second, PPA reports are generated automatically. For both the input and the output, different levels of abstraction can be chosen for high-level rapid network analysis or low-level improvement of architectural details. The synthesize NoC model reduces up to 32% total router power and 3% router area in comparison to a conventional standard router. As a forward-thinking and unique feature not found in other NoC PPA-measurement tools, ratatoskr supports heterogeneous 3D integration that is one of the most promising integration paradigms for upcoming SoCs. Thereby, ratatoskr lies the groundwork to design their communication architectures. △ Less

Submitted 14 January, 2020; v1 submitted 11 December, 2019; originally announced December 2019.

System-level optimization of Network-on-Chips for heterogeneous 3D System-on-Chips

Authors: Jan Moritz Joseph, Dominik Ermel, Lennart Bamberg, Alberto García-Ortiz, Thilo Pionteck

Abstract: For a system-level design of Networks-on-Chip for 3D heterogeneous System-on-Chip (SoC), the locations of components, routers and vertical links are determined from an application model and technology parameters. In conventional methods, the two inputs are accounted for separately; here, we define an integrated problem that considers both application model and technology parameters. We show that t… ▽ More For a system-level design of Networks-on-Chip for 3D heterogeneous System-on-Chip (SoC), the locations of components, routers and vertical links are determined from an application model and technology parameters. In conventional methods, the two inputs are accounted for separately; here, we define an integrated problem that considers both application model and technology parameters. We show that this problem does not allow for exact solution in reasonable time, as common for many design problems. Therefore, we contribute a heuristic by proposing design steps, which are based on separation of intralayer and interlayer communication. The advantage is that this new problem can be solved with well-known methods. We use 3D Vision SoC case studies to quantify the advantages and the practical usability of the proposed optimization approach. We achieve up to 18.8% reduced white space and up to 12.4% better network performance in comparison to conventional approaches. △ Less

Submitted 3 October, 2019; v1 submitted 30 September, 2019; originally announced September 2019.

NoCs in Heterogeneous 3D SoCs: Co-Design of Routing Strategies and Microarchitectures

Authors: Jan Moritz Joseph, Lennart Bamberg, Dominik Ermel, Behnam Razi Perjikolaei, Anna Drewes, Alberto García-Oritz, Thilo Pionteck

Abstract: Heterogeneous 3D System-on-Chips (3D SoCs) are the most promising design paradigm to combine sensing and computing within a single chip. A special characteristic of communication networks in heterogeneous 3D SoCs is the varying latency and throughput in each layer. As shown in this work, this variance drastically degrades the network performance. We contribute a co-design of routing algorithms and… ▽ More Heterogeneous 3D System-on-Chips (3D SoCs) are the most promising design paradigm to combine sensing and computing within a single chip. A special characteristic of communication networks in heterogeneous 3D SoCs is the varying latency and throughput in each layer. As shown in this work, this variance drastically degrades the network performance. We contribute a co-design of routing algorithms and router microarchitecture that allows to overcome these performance limitations. We analyze the challenges of heterogeneity: Technology-aware models are proposed for communication and thereby identify layers in which packets are transmitted slower. The communication models are precise for latency and throughput under zero load. The technology model has an area error and a timing error of less than 7.4% for various commercial technologies from 90 to 28nm. Second, we demonstrate how to overcome limitations of heterogeneity by proposing two novel routing algorithms called Z+(XY)Z- and ZXYZ that enhance latency by up to 6.5x compared to conventional dimension order routing. Furthermore, we propose a high vertical-throughput router microarchitecture that is adjusted to the routing algorithms and that fully overcomes the limitations of slower layers. We achieve an increased throughput of 2 to 4x compared to a conventional router. Thereby, the dynamic power of routers is reduced by up to 41.1% and we achieve improved flit latency of up to 2.26x at small total router area costs between 2.1% and 10.4% for realistic technologies and application scenarios. △ Less

Submitted 10 September, 2019; originally announced September 2019.