A Fully-Integrated 5mW, 0.8Gbps Energy-Efficient Chip-to-Chip Data Link for Ultra-Low-Power IoT End-Nodes in 65-nm CMOS
Authors:
Hayate Okuhara,
Ahmed Elnaqib,
Martino Dazzi,
Pierpaolo Palestri,
Simone Benatti,
Luca Benini,
Davide Rossi
Abstract:
The increasing complexity of Internet-of-Things (IoT) applications and near-sensor processing algorithms is pushing the computational power of low-power, battery-operated end-node systems. This trend also reveals growing demands for high-speed and energy-efficient inter-chip communications to manage the increasing amount of data coming from off-chip sensors and memories. While traditional micro-co…
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The increasing complexity of Internet-of-Things (IoT) applications and near-sensor processing algorithms is pushing the computational power of low-power, battery-operated end-node systems. This trend also reveals growing demands for high-speed and energy-efficient inter-chip communications to manage the increasing amount of data coming from off-chip sensors and memories. While traditional micro-controller interfaces such as SPIs cannot cope with tight energy and large bandwidth requirements, low-voltage swing transceivers can tackle this challenge thanks to their capability to achieve several Gbps of the communication speed at milliwatt power levels. However, recent research on high-speed serial links focused on high-performance systems, with a power consumption significantly larger than the one of low-power IoT end-nodes, or on stand-alone designs not integrated at a system level. This paper presents a low-swing transceiver for the energy-efficient and low power chip-to-chip communication fully integrated within an IoT end-node System-on-Chip, fabricated in CMOS 65nm technology. The transceiver can be easily controlled via a software interface; thus, we can consider realistic scenarios for the data communication, which cannot be assessed in stand-alone prototypes. Chip measurements show that the transceiver achieves 8.46x higher energy efficiency at 15.9x higher performance than a traditional microcontroller interface such as a single-SPI.
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Submitted 4 September, 2021;
originally announced September 2021.
An Energy-Efficient Low-Voltage Swing Transceiver for mW-Range IoT End-Nodes
Authors:
Hayate Okuhara,
Ahmed Elnaqib,
Davide Rossi,
Alfio Di Mauro,
Philipp Mayer,
Pierpaolo Palestri,
Luca Benini
Abstract:
As the Internet-of-Things (IoT) applications become more and more pervasive, IoT end nodes are requiring more and more computational power within a few mW of power envelope, coupled with high-speed and energy-efficient inter-chip communication to deal with the growing input/output and memory bandwidth for emerging near-sensor analytics applications. While traditional interfaces such as SPI cannot…
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As the Internet-of-Things (IoT) applications become more and more pervasive, IoT end nodes are requiring more and more computational power within a few mW of power envelope, coupled with high-speed and energy-efficient inter-chip communication to deal with the growing input/output and memory bandwidth for emerging near-sensor analytics applications. While traditional interfaces such as SPI cannot cope with these tight requirements, low-voltage swing transceivers can tackle this challenge thanks to their capability to achieve several Gbps of bandwidth at extremely low power. However, recent research on high-speed serial links addressed this challenge only partially, proposing only partial or stand-alone designs, and not addressing their integration in real systems and the related implications. In this paper, we present for the first time a complete design and system-level architecture of a low-voltage swing transceiver integrated within a low-power (mW range) IoT end-node processors, and we compare it with existing microcontroller interfaces. The transceiver, implemented in a commercial 65-nm CMOS technology achieves 10.2x higher energy efficiency at 15.7x higher performance than traditional microcontroller peripherals (single lane).
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Submitted 9 October, 2020;
originally announced October 2020.
