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Machine-learning based methodologies for 3d x-ray measurement, characterization and optimization for buried structures in advanced ic packages
Authors:
Ramanpreet S Pahwa,
Soon Wee Ho,
Ren Qin,
Richard Chang,
Oo Zaw Min,
Wang Jie,
Vempati Srinivasa Rao,
Tin Lay Nwe,
Yan**g Yang,
Jens Timo Neumann,
Ramani Pichumani,
Thomas Gregorich
Abstract:
For over 40 years lithographic silicon scaling has driven circuit integration and performance improvement in the semiconductor industry. As silicon scaling slows down, the industry is increasingly dependent on IC package technologies to contribute to further circuit integration and performance improvements. This is a paradigm shift and requires the IC package industry to reduce the size and increa…
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For over 40 years lithographic silicon scaling has driven circuit integration and performance improvement in the semiconductor industry. As silicon scaling slows down, the industry is increasingly dependent on IC package technologies to contribute to further circuit integration and performance improvements. This is a paradigm shift and requires the IC package industry to reduce the size and increase the density of internal interconnects on a scale which has never been done before. Traditional package characterization and process optimization relies on destructive techniques such as physical cross-sections and delayering to extract data from internal package features. These destructive techniques are not practical with today's advanced packages. In this paper we will demonstrate how data acquired non-destructively with a 3D X-ray microscope can be enhanced and optimized using machine learning, and can then be used to measure, characterize and optimize the design and production of buried interconnects in advanced IC packages. Test vehicles replicating 2.5D and HBM construction were designed and fabricated, and digital data was extracted from these test vehicles using 3D X-ray and machine learning techniques. The extracted digital data was used to characterize and optimize the design and production of the interconnects and demonstrates a superior alternative to destructive physical analysis. We report an mAP of 0.96 for 3D object detection, a dice score of 0.92 for 3D segmentation, and an average of 2.1um error for 3D metrology on the test dataset. This paper is the first part of a multi-part report.
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Submitted 19 May, 2021; v1 submitted 8 March, 2021;
originally announced March 2021.
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DDR-ID: Dual Deep Reconstruction Networks Based Image Decomposition for Anomaly Detection
Authors:
Dongyun Lin,
Yiqun Li,
Shudong Xie,
Tin Lay Nwe,
Sheng Dong
Abstract:
One pivot challenge for image anomaly (AD) detection is to learn discriminative information only from normal class training images. Most image reconstruction based AD methods rely on the discriminative capability of reconstruction error. This is heuristic as image reconstruction is unsupervised without incorporating normal-class-specific information. In this paper, we propose an AD method called d…
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One pivot challenge for image anomaly (AD) detection is to learn discriminative information only from normal class training images. Most image reconstruction based AD methods rely on the discriminative capability of reconstruction error. This is heuristic as image reconstruction is unsupervised without incorporating normal-class-specific information. In this paper, we propose an AD method called dual deep reconstruction networks based image decomposition (DDR-ID). The networks are trained by jointly optimizing for three losses: the one-class loss, the latent space constrain loss and the reconstruction loss. After training, DDR-ID can decompose an unseen image into its normal class and the residual components, respectively. Two anomaly scores are calculated to quantify the anomalous degree of the image in either normal class latent space or reconstruction image space. Thereby, anomaly detection can be performed via thresholding the anomaly score. The experiments demonstrate that DDR-ID outperforms multiple related benchmarking methods in image anomaly detection using MNIST, CIFAR-10 and Endosome datasets and adversarial attack detection using GTSRB dataset.
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Submitted 18 July, 2020;
originally announced July 2020.
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FaultNet: Faulty Rail-Valves Detection using Deep Learning and Computer Vision
Authors:
Ramanpreet Singh Pahwa,
** Chao,
Jestine Paul,
Yiqun Li,
Ma Tin Lay Nwe,
Shudong Xie,
Ashish James,
Arulmurugan Ambikapathi,
Zeng Zeng,
Vijay Ramaseshan Chandrasekhar
Abstract:
Regular inspection of rail valves and engines is an important task to ensure the safety and efficiency of railway networks around the globe. Over the past decade, computer vision and pattern recognition based techniques have gained traction for such inspection and defect detection tasks. An automated end-to-end trained system can potentially provide a low-cost, high throughput, and cheap alternati…
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Regular inspection of rail valves and engines is an important task to ensure the safety and efficiency of railway networks around the globe. Over the past decade, computer vision and pattern recognition based techniques have gained traction for such inspection and defect detection tasks. An automated end-to-end trained system can potentially provide a low-cost, high throughput, and cheap alternative to manual visual inspection of these components. However, such systems require a huge amount of defective images for networks to understand complex defects. In this paper, a multi-phase deep learning based technique is proposed to perform accurate fault detection of rail-valves. Our approach uses a two-step method to perform high precision image segmentation of rail-valves resulting in pixel-wise accurate segmentation. Thereafter, a computer vision technique is used to identify faulty valves. We demonstrate that the proposed approach results in improved detection performance when compared to current state-of-theart techniques used in fault detection.
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Submitted 8 November, 2019;
originally announced December 2019.
