Showing 1–2 of 2 results for author: Hibert, C

Using system context information to complement weakly labeled data

Authors: Matthias Meyer, Michaela Wenner, Clément Hibert, Fabian Walter, Lothar Thiele

Abstract: Real-world datasets collected with sensor networks often contain incomplete and uncertain labels as well as artefacts arising from the system environment. Complete and reliable labeling is often infeasible for large-scale and long-term sensor network deployments due to the labor and time overhead, limited availability of experts and missing ground truth. In addition, if the machine learning method… ▽ More Real-world datasets collected with sensor networks often contain incomplete and uncertain labels as well as artefacts arising from the system environment. Complete and reliable labeling is often infeasible for large-scale and long-term sensor network deployments due to the labor and time overhead, limited availability of experts and missing ground truth. In addition, if the machine learning method used for analysis is sensitive to certain features of a deployment, labeling and learning needs to be repeated for every new deployment. To address these challenges, we propose to make use of system context information formalized in an information graph and embed it in the learning process via contrastive learning. Based on real-world data we show that this approach leads to an increased accuracy in case of weakly labeled data and leads to an increased robustness and transferability of the classifier to new sensor locations. △ Less

Submitted 19 July, 2021; originally announced July 2021.

Comments: Also appears in "Proceedings of the First Workshop on Weakly Supervised Learning (WeaSuL)" arXiv:2107.03690

0-level Vacuum Packaging RT Process for MEMS Resonators

Authors: N. Abelé, D. Grogg, C. Hibert, F. Casset, P. Ancey, A. Ionescu

Abstract: A new Room Temperature (RT) 0-level vacuum package is demonstrated in this work, using amorphous silicon (aSi) as sacrificial layer and SiO2 as structural layer. The process is compatible with most of MEMS resonators and Resonant Suspended-Gate MOSFET [1] fabrication processes. This paper presents a study on the influence of releasing hole dimensions on the releasing time and hole clogging. It d… ▽ More A new Room Temperature (RT) 0-level vacuum package is demonstrated in this work, using amorphous silicon (aSi) as sacrificial layer and SiO2 as structural layer. The process is compatible with most of MEMS resonators and Resonant Suspended-Gate MOSFET [1] fabrication processes. This paper presents a study on the influence of releasing hole dimensions on the releasing time and hole clogging. It discusses mass production compatibility in terms of packaging stress during back-end plastic injection process. The packaging is done at room temperature making it fully compatible with IC-processed wafers and avoiding any subsequent degradation of the active devices. △ Less

Submitted 21 February, 2008; originally announced February 2008.

Comments: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing)

Journal ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)