-
A survey of Digital Manufacturing Hardware and Software Trojans
Authors:
Prithwish Basu Roy,
Mudit Bhargava,
Chia-Yun Chang,
Ellen Hui,
Nikhil Gupta,
Ramesh Karri,
Hammond Pearce
Abstract:
Digital Manufacturing (DM) refers to the on-going adoption of smarter, more agile manufacturing processes and cyber-physical systems. This includes modern techniques and technologies such as Additive Manufacturing (AM)/3D printing, as well as the Industrial Internet of Things (IIoT) and the broader trend toward Industry 4.0. However, this adoption is not without risks: with a growing complexity an…
▽ More
Digital Manufacturing (DM) refers to the on-going adoption of smarter, more agile manufacturing processes and cyber-physical systems. This includes modern techniques and technologies such as Additive Manufacturing (AM)/3D printing, as well as the Industrial Internet of Things (IIoT) and the broader trend toward Industry 4.0. However, this adoption is not without risks: with a growing complexity and connectivity, so too grows the cyber-physical attack surface. Here, malicious actors might seek to steal sensitive information or sabotage products or production lines, causing financial and reputational loss. Of particular concern are where such malicious attacks may enter the complex supply chains of DM systems as Trojans -- malicious modifications that may trigger their payloads at later times or stages of the product lifecycle.
In this work, we thus present a comprehensive overview of the threats posed by Trojans in Digital Manufacturing. We cover both hardware and software Trojans which may exist in products or their production and supply lines. From this, we produce a novel taxonomy for classifying and analyzing these threats, and elaborate on how different side channels (e.g. visual, thermal, acoustic, power, and magnetic) may be used to either enhance the impact of a given Trojan or utilized as part of a defensive strategy. Other defenses are also presented -- including hardware, web-, and software-related. To conclude, we discuss seven different case studies and elaborate how they fit into our taxonomy. Overall, this paper presents a detailed survey of the Trojan landscape for Digital Manufacturing: threats, defenses, and the importance of implementing secure practices.
△ Less
Submitted 24 January, 2023;
originally announced January 2023.
-
A Fokker-Planck Solver to Model MTJ Stochasticity
Authors:
Fernando García-Redondo,
Pranay Prabhat,
Mudit Bhargava
Abstract:
Magnetic Tunnel Junctions (MTJs) constitute the novel memory element in STT-MRAM, which is ram** to production at major foundries as an eFlash replacement. MTJ switching exhibits a stochastic behavior due to thermal fluctuations, which is modeled by s-LLGS and Fokker-Planck (FP) equations. This work implements and benchmarks Finite Volume Method (FVM) and analytical solvers for the FP equation.…
▽ More
Magnetic Tunnel Junctions (MTJs) constitute the novel memory element in STT-MRAM, which is ram** to production at major foundries as an eFlash replacement. MTJ switching exhibits a stochastic behavior due to thermal fluctuations, which is modeled by s-LLGS and Fokker-Planck (FP) equations. This work implements and benchmarks Finite Volume Method (FVM) and analytical solvers for the FP equation. To deploy an MTJ model for circuit design, it must be calibrated against silicon data. To address this challenge, this work presents a regression scheme to fit MTJ parameters to a given set of measured current, switching time and error rate data points, yielding a silicon-calibrated model suitable for MRAM macro transient simulation.
△ Less
Submitted 23 June, 2021;
originally announced June 2021.
-
A Compact Model for Scalable MTJ Simulation
Authors:
Fernando García-Redondo,
Pranay Prabhat,
Mudit Bhargava,
Cyrille Dray
Abstract:
This paper presents a physics-based modeling framework for the analysis and transient simulation of circuits containing Spin-Transfer Torque (STT) Magnetic Tunnel Junction (MTJ) devices. The framework provides the tools to analyze the stochastic behavior of MTJs and to generate Verilog-A compact models for their simulation in large VLSI designs, addressing the need for an industry-ready model acco…
▽ More
This paper presents a physics-based modeling framework for the analysis and transient simulation of circuits containing Spin-Transfer Torque (STT) Magnetic Tunnel Junction (MTJ) devices. The framework provides the tools to analyze the stochastic behavior of MTJs and to generate Verilog-A compact models for their simulation in large VLSI designs, addressing the need for an industry-ready model accounting for real-world reliability and scalability requirements. Device dynamics are described by the Landau-Lifshitz-Gilbert-Slonczewsky (s-LLGS ) stochastic magnetization considering Voltage-Controlled Magnetic Anisotropy (VCMA) and the non-negligible statistical effects caused by thermal noise. Model behavior is validated against the OOMMF magnetic simulator and its performance is characterized on a 1-Mb 28 nm Magnetoresistive-RAM (MRAM) memory product.
△ Less
Submitted 9 June, 2021;
originally announced June 2021.
-
Stack up your chips: Betting on 3D integration to augment Moore's Law scaling
Authors:
Saurabh Sinha,
Xiaoqing Xu,
Mudit Bhargava,
Shidhartha Das,
Brian Cline,
Greg Yeric
Abstract:
3D integration, i.e., stacking of integrated circuit layers using parallel or sequential processing is gaining rapid industry adoption with the slowdown of Moore's law scaling. 3D stacking promises potential gains in performance, power and cost but the actual magnitude of gains varies depending on end-application, technology choices and design. In this talk, we will discuss some key challenges ass…
▽ More
3D integration, i.e., stacking of integrated circuit layers using parallel or sequential processing is gaining rapid industry adoption with the slowdown of Moore's law scaling. 3D stacking promises potential gains in performance, power and cost but the actual magnitude of gains varies depending on end-application, technology choices and design. In this talk, we will discuss some key challenges associated with 3D design and how design-for-3D will require us to break traditional silos of micro-architecture, circuit/physical design and manufacturing technology to work across abstractions to enable the gains promised by 3D technologies.
△ Less
Submitted 21 May, 2020;
originally announced May 2020.
-
Improving Automatic Emotion Recognition from speech using Rhythm and Temporal feature
Authors:
Mayank Bhargava,
Tim Polzehl
Abstract:
This paper is devoted to improve automatic emotion recognition from speech by incorporating rhythm and temporal features. Research on automatic emotion recognition so far has mostly been based on applying features like MFCCs, pitch and energy or intensity. The idea focuses on borrowing rhythm features from linguistic and phonetic analysis and applying them to the speech signal on the basis of acou…
▽ More
This paper is devoted to improve automatic emotion recognition from speech by incorporating rhythm and temporal features. Research on automatic emotion recognition so far has mostly been based on applying features like MFCCs, pitch and energy or intensity. The idea focuses on borrowing rhythm features from linguistic and phonetic analysis and applying them to the speech signal on the basis of acoustic knowledge only. In addition to this we exploit a set of temporal and loudness features. A segmentation unit is employed in starting to separate the voiced/unvoiced and silence parts and features are explored on different segments. Thereafter different classifiers are used for classification. After selecting the top features using an IGR filter we are able to achieve a recognition rate of 80.60 % on the Berlin Emotion Database for the speaker dependent framework.
△ Less
Submitted 7 March, 2013;
originally announced March 2013.
