Sign-Alternating Thermoelectric Quantum Oscillations and Insulating Landau Levels in Monolayer WTe2
Authors:
Yue Tang,
Tiancheng Song,
Haosen Guan,
Yanyu Jia,
Guo Yu,
Zhaoyi Joy Zheng,
Ayelet J. Uzan,
Michael Onyszczak,
Ratnadwip Singha,
Xin Gui,
Kenji Watanabe,
Takashi Taniguchi,
Robert J. Cava,
Leslie M. Schoop,
N. P. Ong,
Sanfeng Wu
Abstract:
The detection of Landau-level-like energy structures near the chemical potential of an insulator is essential to the search for a class of correlated electronic matter hosting charge-neutral fermions and Fermi surfaces, a long-proposed concept that remains elusive experimentally. Here we introduce and demonstrate that the magneto-thermoelectric response of a quantum insulator can reveal critical i…
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The detection of Landau-level-like energy structures near the chemical potential of an insulator is essential to the search for a class of correlated electronic matter hosting charge-neutral fermions and Fermi surfaces, a long-proposed concept that remains elusive experimentally. Here we introduce and demonstrate that the magneto-thermoelectric response of a quantum insulator can reveal critical information not available via other approaches. We report large quantum oscillations (QOs) in the Seebeck response of the hole-doped insulating state of monolayer tungsten ditelluride (WTe2) in magnetic fields. The QOs remarkably undergo sign-changes as the field is swept, mimicking those in metals with Landau quantization. The sign-change in the thermoelectric response directly implies the presence of a field-induced Landau-level-like structure at the chemical potential of the insulator. Our results reinforce WTe2 as a platform for investigating insulating Landau levels and mobile neutral fermions in two-dimensional insulators.
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Submitted 15 May, 2024;
originally announced May 2024.
Superconductivity from On-Chip Metallization on 2D Topological Chalcogenides
Authors:
Yanyu Jia,
Guo Yu,
Tiancheng Song,
Fang Yuan,
Ayelet J Uzan,
Yue Tang,
Pengjie Wang,
Ratnadwip Singha,
Michael Onyszczak,
Zhaoyi Joy Zheng,
Kenji Watanabe,
Takashi Taniguchi,
Leslie M Schoop,
Sanfeng Wu
Abstract:
Two-dimensional (2D) transition metal dichalcogenides (TMDs) is a versatile class of quantum materials of interest to various fields including, e.g., nanoelectronics, optical devices, and topological and correlated quantum matter. Tailoring the electronic properties of TMDs is essential to their applications in many directions. Here, we report that a highly controllable and uniform on-chip 2D meta…
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Two-dimensional (2D) transition metal dichalcogenides (TMDs) is a versatile class of quantum materials of interest to various fields including, e.g., nanoelectronics, optical devices, and topological and correlated quantum matter. Tailoring the electronic properties of TMDs is essential to their applications in many directions. Here, we report that a highly controllable and uniform on-chip 2D metallization process converts a class of atomically thin TMDs into robust superconductors, a property belonging to none of the starting materials. As examples, we demonstrate the introduction of superconductivity into a class of 2D air-sensitive topological TMDs, including monolayers of Td-WTe2, 1T'-MoTe2 and 2H-MoTe2, as well as their natural and twisted bilayers, metalized with an ultrathin layer of Palladium. This class of TMDs are known to exhibit intriguing topological phases ranging from topological insulator, Weyl semimetal to fractional Chern insulator. The unique, high-quality two-dimensional metallization process is based on our recent findings of the long-distance, non-Fickian in-plane mass transport and chemistry in 2D that occur at relatively low temperatures and in devices fully encapsulated with inert insulating layers. Highly compatible with existing nanofabrication techniques for van der Waals (vdW) stacks, our results offer a route to designing and engineering superconductivity and topological phases in a class of correlated 2D materials.
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Submitted 30 April, 2024; v1 submitted 28 March, 2024;
originally announced March 2024.
