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Characterization of NbTiN films with thicknesses below 20 nm for low power kinetic inductance amplifiers
Authors:
A. Giachero,
M. R. Vissers,
J. D. Wheeler,
M. Malnou,
J. E. Austermann,
J. Hubmayr,
A. Nucciotti,
J. N. Ullom,
J. Gao
Abstract:
A quantum-limited amplification chain is a fundamental advantage for any application that may benefit from the detection of very faint signals. Reading out arrays of superconducting detectors (TESs or MKIDs), resonant cavities, or qubits, calls for large bandwidth amplifiers in addition to having the lowest possible noise. At millikelvin temperatures, Kinetic Inductance Traveling-Wave Parametric A…
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A quantum-limited amplification chain is a fundamental advantage for any application that may benefit from the detection of very faint signals. Reading out arrays of superconducting detectors (TESs or MKIDs), resonant cavities, or qubits, calls for large bandwidth amplifiers in addition to having the lowest possible noise. At millikelvin temperatures, Kinetic Inductance Traveling-Wave Parametric Amplifiers (KI-TWPAs) working in 3-wave-mixing (3WM) and fabricated from a 20 nm thick NbTiN film have shown promising noise performances, as they can operate close to the quantum limit. However, they still require fairly high pump power. Devices that would require lower pump power would be easier to implement in readout chains, could reach the quantum limit and they would be compatible with qubit readout. A possible solution for obtaining this optimal configuration is to use a thinner superconducting film. In this work we explore the properties of NbTiN films with a thickness less than 20 nm and we report the obtained experimental characterizations in terms of critical temperature, normal resistivity, and kinetic inductance. A new design for a 3WM KI-TWPA amplifier, based on these developed superconducting films, is introduced and discussed.
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Submitted 18 February, 2024;
originally announced February 2024.
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Tile-and-trim micro-resonator array fabrication optimized for high multiplexing factors
Authors:
Christopher M. McKenney,
Jason E. Austermann,
Jim Beall,
Bradley Dober,
Shannon M. Duff,
Jiansong Gao,
Gence C. Hilton,
Johannes Hubmayr,
Dale Li,
Joel N. Ullom,
Jeff Van Lanen,
Michael R. Vissers
Abstract:
We present a superconducting micro-resonator array fabrication method that is scalable, reconfigurable, and has been optimized for high multiplexing factors. The method uses uniformly sized tiles patterned on stepper photolithography reticles as the building blocks of an array. We demonstrate this technique on a 101-element microwave kinetic inductance detector (MKID) array made from a titanium-ni…
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We present a superconducting micro-resonator array fabrication method that is scalable, reconfigurable, and has been optimized for high multiplexing factors. The method uses uniformly sized tiles patterned on stepper photolithography reticles as the building blocks of an array. We demonstrate this technique on a 101-element microwave kinetic inductance detector (MKID) array made from a titanium-nitride superconducting film. Characterization reveals 1.5\% maximum fractional frequency spacing deviations caused primarily by material parameters that vary smoothly across the wafer. However, local deviations exhibit a Gaussian distribution in fractional frequency spacing with a standard deviation of $2.7 \times 10^{-3}$. We exploit this finding to increase the yield of the BLAST-TNG $250 \; μ\text{m}$ production wafer by placing resonators in the array close in both physical and frequency space. This array consists of 1836 polarization-sensitive MKIDs wired in three multiplexing groups. We present the array design and show that the achieved yield is consistent with our model of frequency collisions and is comparable to what has been achieved in other low temperature detector technologies.
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Submitted 12 March, 2018;
originally announced March 2018.
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Superconducting micro-resonator arrays with ideal frequency spacing and extremely low frequency collision rate
Authors:
X. Liu,
W. Guo,
Y. Wang,
M. Dai,
L. F. Wei,
B. Dober,
C. McKenney,
G. C. Hilton,
J. Hubmayr,
J. E. Austermann,
J. N. Ullom,
J. Gao,
M. R. Vissers
Abstract:
We present a wafer trimming technique for producing superconducting micro-resonator arrays with highly uniform frequency spacing. With the light-emitting diode (LED) mapper technique demonstrated previously, we first map the measured resonance frequencies to the physical resonators. Then, we fine-tune each resonator's frequency by lithographically trimming a small length, calculated from the devia…
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We present a wafer trimming technique for producing superconducting micro-resonator arrays with highly uniform frequency spacing. With the light-emitting diode (LED) mapper technique demonstrated previously, we first map the measured resonance frequencies to the physical resonators. Then, we fine-tune each resonator's frequency by lithographically trimming a small length, calculated from the deviation of the measured frequency from its design value, from the interdigitated capacitor. We demonstrate this technique on a 127-resonator array made of titanium-nitride (TiN) and show that the uniformity of frequency spacing is greatly improved. The array yield in terms of frequency collisions improves from 84% to 97%, while the quality factors and noise properties are unaffected. The wafer trimming technique provides an easy-to-implement tool to improve the yield and multiplexing density of large resonator arrays, which is important for various applications in photon detection and quantum computing.
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Submitted 21 November, 2017;
originally announced November 2017.
