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A diving heuristic for mixed-integer problems with unbounded semi-continuous variables
Authors:
Katrin Halbig,
Alexander Hoen,
Ambros Gleixner,
Jakob Witzig,
Dieter Weninger
Abstract:
Semi-continuous decision variables arise naturally in many real-world applications. They are defined to take either value zero or any value within a specified range, and occur mainly to prevent small nonzero values in the solution. One particular challenge that can come with semi-continuous variables in practical models is that their upper bound may be large or even infinite. In this article, we b…
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Semi-continuous decision variables arise naturally in many real-world applications. They are defined to take either value zero or any value within a specified range, and occur mainly to prevent small nonzero values in the solution. One particular challenge that can come with semi-continuous variables in practical models is that their upper bound may be large or even infinite. In this article, we briefly discuss these challenges, and present a new diving heuristic tailored for mixed-integer optimization problems with general semi-continuous variables. The heuristic is designed to work independently of whether the semi-continuous variables are bounded from above, and thus circumvents the specific difficulties that come with unbounded semi-continuous variables. We conduct extensive computational experiments on three different test sets, integrating the heuristic in an open-source MIP solver. The results indicate that this heuristic is a successful tool for finding high-quality solutions in negligible time. At the root node the primal gap is reduced by an average of 5 % up to 21 %, and considering the overall performance improvement, the primal integral is reduced by 2 % to 17 % on average.
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Submitted 28 March, 2024;
originally announced March 2024.
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The SCIP Optimization Suite 9.0
Authors:
Suresh Bolusani,
Mathieu Besançon,
Ksenia Bestuzheva,
Antonia Chmiela,
João Dionísio,
Tim Donkiewicz,
Jasper van Doornmalen,
Leon Eifler,
Mohammed Ghannam,
Ambros Gleixner,
Christoph Graczyk,
Katrin Halbig,
Ivo Hedtke,
Alexander Hoen,
Christopher Hojny,
Rolf van der Hulst,
Dominik Kamp,
Thorsten Koch,
Kevin Kofler,
Jurgen Lentz,
Julian Manns,
Gioni Mexi,
Erik Mühmer,
Marc E. Pfetsch,
Franziska Schlösser
, et al. (6 additional authors not shown)
Abstract:
The SCIP Optimization Suite provides a collection of software packages for mathematical optimization, centered around the constraint integer programming (CIP) framework SCIP. This report discusses the enhancements and extensions included in the SCIP Optimization Suite 9.0. The updates in SCIP 9.0 include improved symmetry handling, additions and improvements of nonlinear handlers and primal heuris…
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The SCIP Optimization Suite provides a collection of software packages for mathematical optimization, centered around the constraint integer programming (CIP) framework SCIP. This report discusses the enhancements and extensions included in the SCIP Optimization Suite 9.0. The updates in SCIP 9.0 include improved symmetry handling, additions and improvements of nonlinear handlers and primal heuristics, a new cut generator and two new cut selection schemes, a new branching rule, a new LP interface, and several bug fixes. The SCIP Optimization Suite 9.0 also features new Rust and C++ interfaces for SCIP, new Python interface for SoPlex, along with enhancements to existing interfaces. The SCIP Optimization Suite 9.0 also includes new and improved features in the LP solver SoPlex, the presolving library PaPILO, the parallel framework UG, the decomposition framework GCG, and the SCIP extension SCIP-SDP. These additions and enhancements have resulted in an overall performance improvement of SCIP in terms of solving time, number of nodes in the branch-and-bound tree, as well as the reliability of the solver.
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Submitted 27 February, 2024;
originally announced February 2024.
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Highly-efficient fiber to Si-waveguide free-form coupler for foundry-scale silicon photonics
Authors:
Luigi Ranno,
Jia Xu Brian Sia,
Cosmin Popescu,
Drew Weninger,
Samuel Serna,
Shaoliang Yu,
Lionel C. Kimerling,
Anuradha Agarwal,
Tian Gu,
Juejun Hu
Abstract:
As silicon photonics transitions from research to commercial deployment, packaging solutions that efficiently couple light into highly-compact and functional sub-micron silicon waveguides are imperative but remain challenging. The 220 nm silicon-on-insulator (SOI) platform, poised to enable large-scale integration, is the most widely adopted by foundries, resulting in established fabrication proce…
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As silicon photonics transitions from research to commercial deployment, packaging solutions that efficiently couple light into highly-compact and functional sub-micron silicon waveguides are imperative but remain challenging. The 220 nm silicon-on-insulator (SOI) platform, poised to enable large-scale integration, is the most widely adopted by foundries, resulting in established fabrication processes and extensive photonic component libraries. The development of a highly-efficient, scalable and broadband coupling scheme for this platform is therefore of paramount importance. Leveraging two-photon polymerization (TPP) and a deterministic free-form micro-optics design methodology based on the Fermat's principle, this work demonstrates an ultra-efficient and broadband 3-D coupler interface between standard SMF-28 single-mode fibers and silicon waveguides on the 220 nm SOI platform. The coupler achieves a low coupling loss of 0.8 dB for fundamental TE mode, along with 1-dB bandwidth exceeding 180 nm. The broadband operation enables diverse bandwidth-driven applications ranging from communications to spectroscopy. Furthermore, the 3-D free-form coupler also enables large tolerance to fiber misalignments and manufacturing variability, thereby relaxing packaging requirements towards cost reduction capitalizing on standard electronic packaging process flows.
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Submitted 20 December, 2023;
originally announced December 2023.
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Enabling Research through the SCIP Optimization Suite 8.0
Authors:
Ksenia Bestuzheva,
Mathieu Besançon,
Wei-Kun Chen,
Antonia Chmiela,
Tim Donkiewicz,
Jasper van Doornmalen,
Leon Eifler,
Oliver Gaul,
Gerald Gamrath,
Ambros Gleixner,
Leona Gottwald,
Christoph Graczyk,
Katrin Halbig,
Alexander Hoen,
Christopher Hojny,
Rolf van der Hulst,
Thorsten Koch,
Marco Lübbecke,
Stephen J. Maher,
Frederic Matter,
Erik Mühmer,
Benjamin Müller,
Marc E. Pfetsch,
Daniel Rehfeldt,
Steffan Schlein
, et al. (10 additional authors not shown)
Abstract:
The SCIP Optimization Suite provides a collection of software packages for mathematical optimization centered around the constraint integer programming framework SCIP. The focus of this paper is on the role of the SCIP Optimization Suite in supporting research. SCIP's main design principles are discussed, followed by a presentation of the latest performance improvements and developments in version…
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The SCIP Optimization Suite provides a collection of software packages for mathematical optimization centered around the constraint integer programming framework SCIP. The focus of this paper is on the role of the SCIP Optimization Suite in supporting research. SCIP's main design principles are discussed, followed by a presentation of the latest performance improvements and developments in version 8.0, which serve both as examples of SCIP's application as a research tool and as a platform for further developments. Further, the paper gives an overview of interfaces to other programming and modeling languages, new features that expand the possibilities for user interaction with the framework, and the latest developments in several extensions built upon SCIP.
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Submitted 13 March, 2023;
originally announced March 2023.
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High Density Vertical Optical Interconnects for Passive Assembly
Authors:
Drew Weninger,
Samuel Serna,
Achint Jain,
Lionel Kimerling,
Anuradha Agarwal
Abstract:
The co-packaging of optics and electronics provides a potential path forward to achieving beyond 50 Tbps top of rack switch packages. In a co-packaged design, the scaling of bandwidth, cost, and energy is governed by the number of optical transceivers (TxRx) per package as opposed to transistor shrink. Due to the large footprint of optical components relative to their electronic counterparts, the…
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The co-packaging of optics and electronics provides a potential path forward to achieving beyond 50 Tbps top of rack switch packages. In a co-packaged design, the scaling of bandwidth, cost, and energy is governed by the number of optical transceivers (TxRx) per package as opposed to transistor shrink. Due to the large footprint of optical components relative to their electronic counterparts, the vertical stacking of optical TxRx chips in a co-packaged optics design will become a necessity. As a result, development of efficient, dense, and wide alignment tolerance chip-to-chip optical couplers will be an enabling technology for continued TxRx scaling. In this paper, we propose a novel scheme to vertically couple into standard 220 nm silicon on insulator waveguides from 220 nm silicon nitride on glass waveguides using overlap**, inverse double tapers. Simulation results using Lumerical's 3D Finite Difference Time Domain solver solver are presented, demonstrating insertion losses below -0.13 dB for an inter-chip spacing of 1 $μ$m, 1 dB vertical and lateral alignment tolerances of approximately $\pm$ 2.7 $μ$m, a greater than 300 nm 1 dB bandwidth, and 1 dB twist and tilt tolerance of approximately 2.3 degrees and 0.4 degrees, respectively. These results demonstrate the potential of our coupler for use in co-packaged designs requiring high performance, high density, CMOS compatible out of plane optical connections.
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Submitted 18 June, 2022;
originally announced June 2022.
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The SCIP Optimization Suite 8.0
Authors:
Ksenia Bestuzheva,
Mathieu Besançon,
Wei-Kun Chen,
Antonia Chmiela,
Tim Donkiewicz,
Jasper van Doornmalen,
Leon Eifler,
Oliver Gaul,
Gerald Gamrath,
Ambros Gleixner,
Leona Gottwald,
Christoph Graczyk,
Katrin Halbig,
Alexander Hoen,
Christopher Hojny,
Rolf van der Hulst,
Thorsten Koch,
Marco Lübbecke,
Stephen J. Maher,
Frederic Matter,
Erik Mühmer,
Benjamin Müller,
Marc E. Pfetsch,
Daniel Rehfeldt,
Steffan Schlein
, et al. (10 additional authors not shown)
Abstract:
The SCIP Optimization Suite provides a collection of software packages for mathematical optimization centered around the constraint integer programming framework SCIP. This paper discusses enhancements and extensions contained in version 8.0 of the SCIP Optimization Suite. Major updates in SCIP include improvements in symmetry handling and decomposition algorithms, new cutting planes, a new plugin…
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The SCIP Optimization Suite provides a collection of software packages for mathematical optimization centered around the constraint integer programming framework SCIP. This paper discusses enhancements and extensions contained in version 8.0 of the SCIP Optimization Suite. Major updates in SCIP include improvements in symmetry handling and decomposition algorithms, new cutting planes, a new plugin type for cut selection, and a complete rework of the way nonlinear constraints are handled. Additionally, SCIP 8.0 now supports interfaces for Julia as well as Matlab. Further, UG now includes a unified framework to parallelize all solvers, a utility to analyze computational experiments has been added to GCG, dual solutions can be postsolved by PaPILO, new heuristics and presolving methods were added to SCIP-SDP, and additional problem classes and major performance improvements are available in SCIP-Jack.
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Submitted 16 December, 2021;
originally announced December 2021.
