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Robust atmospherically stable hybrid SrVO3/Graphene//SrTiO3 template for fast and facile large-area transfer of complex oxides onto Si
Authors:
Asraful Haque,
Suman Kumar Mandal,
Antony Jeyaseelan,
Sandeep Vura,
Pavan Nukala,
Srinivasan Raghavan
Abstract:
Heterogenous integration of complex epitaxial oxides onto Si and other target substrates is recently gaining traction. One of the popular methods involves growing a water-soluble and highly reactive sacrificial buffer layer, such as Sr3Al2O6 (SAO) at the interface, and a functional oxide on top of this. To improve the versatility of layer transfer techniques, it is desired to utilize stable (less…
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Heterogenous integration of complex epitaxial oxides onto Si and other target substrates is recently gaining traction. One of the popular methods involves growing a water-soluble and highly reactive sacrificial buffer layer, such as Sr3Al2O6 (SAO) at the interface, and a functional oxide on top of this. To improve the versatility of layer transfer techniques, it is desired to utilize stable (less reactive) sacrificial layers, without compromising on the transfer rates. In this study, we utilized a combination of chemical vapor deposited (CVD) graphene as a 2D material at the interface and pulsed laser deposited (PLD) water-soluble SrVO3 (SVO) as a sacrificial buffer layer. We show that the graphene layer enhances the dissolution rate of SVO over ten times without compromising its atmospheric stability. We demonstrate the versatility of our hybrid template by growing ferroelectric BaTiO3 (BTO) via PLD and Pb(Zr, Ti)O3 (PZT) via Chemical Solution Deposition (CSD) technique and transferring them onto the target substrates and establishing their ferroelectric properties. Our hybrid templates allow for the realization of the potential of complex oxides in a plethora of device applications for MEMS, electro-optics, and flexible electronics.
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Submitted 6 July, 2023;
originally announced July 2023.
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Giant electromechanical response from defective non-ferroelectric epitaxial BaTiO3 integrated on Si 100
Authors:
Sandeep Vura,
Shubham Kumar Parate,
Subhajit Pal,
Upanya Khandelwal,
Rajeev Kumar Rai,
Sri Harsha Molleti,
Vishnu Kumar,
Rama Satya Sandilya Ventrapragada,
Girish Patil,
Mudit Jain,
Ambresh Mallya,
Majid Ahmadi,
Bart Kooi,
Sushobhan Avasthi,
Rajeev Ranjan,
Srinivasan Raghavan,
Saurabh Chandorkar,
Pavan Nukala
Abstract:
Lead free, silicon compatible materials showing large electromechanical responses comparable to, or better than conventional relaxor ferroelectrics, are desirable for various nanoelectromechanical devices and applications. Defect-engineered electrostriction has recently been gaining popularity to obtain enhanced electromechanical responses at sub 100 Hz frequencies. Here, we report record values o…
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Lead free, silicon compatible materials showing large electromechanical responses comparable to, or better than conventional relaxor ferroelectrics, are desirable for various nanoelectromechanical devices and applications. Defect-engineered electrostriction has recently been gaining popularity to obtain enhanced electromechanical responses at sub 100 Hz frequencies. Here, we report record values of electrostrictive strain coefficients (M31) at frequencies as large as 5 kHz (1.04 x 10-14 m2 per V2 at 1 kHz, and 3.87 x 10-15 m2 per V2 at 5 kHz) using A-site and oxygen-deficient barium titanate thin-films, epitaxially integrated onto Si. The effect is robust and retained even after cycling the devices >5000 times. Our perovskite films are non-ferroelectric, exhibit a different symmetry compared to stoichiometric BaTiO3 and are characterized by twin boundaries and nano polar-like regions. We show that the dielectric relaxation arising from the defect-induced features correlates very well with the observed giant electrostrictive response. These films show large coefficient of thermal expansion (2.36 x 10-5/K), which along with the giant M31 implies a considerable increase in the lattice anharmonicity induced by the defects. Our work provides a crucial step forward towards formulating guidelines to engineer large electromechanical responses even at higher frequencies in lead-free thin films.
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Submitted 6 March, 2023;
originally announced March 2023.
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Deep sub micron normally off AlGaN/GaN MOSFET on silicon with VTH > 5V and On Current > 0.5 A/mm
Authors:
Sandeep Kumar,
Sandeep Vura,
Surani B. Dolmanan,
Sudhiranjan Tripathy,
R. Muralidharan,
Digbijoy N. Nath
Abstract:
We report on the demonstration of a deep sub-micron normally-off AlGaN/GaN HEMT with high on-current and high threshold voltage (VTH). The high-performance device was realized by utilizing a gate recess with length and depth of 200 nm and 124 nm respectively. The recess etched region had a roughness of 0.7 nm. Various recess etch depths and dielectric annealing conditions were used to tune the VTH…
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We report on the demonstration of a deep sub-micron normally-off AlGaN/GaN HEMT with high on-current and high threshold voltage (VTH). The high-performance device was realized by utilizing a gate recess with length and depth of 200 nm and 124 nm respectively. The recess etched region had a roughness of 0.7 nm. Various recess etch depths and dielectric annealing conditions were used to tune the VTH. The optimized device exhibited on-current and VTH of 500 mA/mm and 5 V respectively. The measured breakdown characteristics of the devices and their limitations were investigated using 2D-TCAD device simulation. The penetration of the residual electric field in most of the recess region could be the reason for the premature breakdown of deeply scaled recess-gate e-mode HEMTs.
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Submitted 16 August, 2019;
originally announced August 2019.
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Investigation of Ta2O5 as an alternative high \k{appa} dielectric for InAlN/GaN MOS HEMT on Si
Authors:
Sandeep Kumar,
Himanshu Kumar,
Sandeep Vura,
Anamika Singh Pratiyush,
Vanjari Sai Charan,
Surani B. Dolmanan,
Sudhiranjan Tripathy,
Rangarajan Muralidharan,
Digbijoy N. Nath
Abstract:
We report on the demonstration and investigation of Ta2O5 as high-\k{appa} dielectric for InAlN/GaN-MOS HEMT-on-Si. Ta2O5 of thickness 24 nm and dielectric constant ~ 30 was sputter deposited on InAlN/GaN HEMT and was investigated for different post deposition anneal conditions (PDA). The gate leakage was 16nA/mm at -15 V which was ~ 5 orders of magnitude lower compared to reference HEMT. The 2-di…
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We report on the demonstration and investigation of Ta2O5 as high-\k{appa} dielectric for InAlN/GaN-MOS HEMT-on-Si. Ta2O5 of thickness 24 nm and dielectric constant ~ 30 was sputter deposited on InAlN/GaN HEMT and was investigated for different post deposition anneal conditions (PDA). The gate leakage was 16nA/mm at -15 V which was ~ 5 orders of magnitude lower compared to reference HEMT. The 2-dimensional electron gas (2DEG) density was found to vary with annealing temperature suggesting the presence of net charge at the Ta2O5/InAlN interface. Dispersion in the capacitance-voltage (C-V) characteristics was used to estimate the frequency-dependent interface charge while energy band diagrams under flat band conditions were investigated to estimate fixed charge. The optimum anneal condition was found to be 500° C which has resulted into a flat band voltage spread (VFB) of 0.4 V and interface fix charge (Qf) of 3.98x10^13 cm-2. XPS (X-ray photoelectron spectroscopy) spectra of as deposited and annealed Ta2O5 film were analyzed for Ta and O compositions in the film. The sample annealed at 500° C has shown Ta:O ratio of 0.41.XRD (X-ray diffraction) analysis was done to check the evolution of poly-crystallization of the Ta2O5 film at higher annealing temperatures.
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Submitted 8 June, 2018;
originally announced June 2018.
