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Showing 1–3 of 3 results for author: Varghese, D

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  1. Maximally entangled Rydberg-atom pairs via Landau-Zener sweeps

    Authors: Dhiya Varghese, Sebastian Wüster, Weibin Li, Rejish Nath

    Abstract: We analyze the formation of maximally entangled Rydberg atom pairs subjected to Landau-Zener sweeps of the atom-light detuning. Though the populations reach a steady value at longer times, the phases evolve continuously, leading to periodic oscillations in the entanglement entropy. The local unitary equivalence between the obtained maximally entangled states and the Bell states is verified by comp… ▽ More

    Submitted 15 February, 2023; v1 submitted 10 February, 2023; originally announced February 2023.

    Comments: 7 pages, 7 figures and 1 table

  2. Characteristic Sets of Matroids

    Authors: Dustin Cartwright, Dony Varghese

    Abstract: We investigate possible linear, algebraic, and Frobenius flock characteristic sets of matroids. In particular, we classify possible combinations of linear and algebraic characteristic sets when the algebraic characteristic set is finite or cofinite. We also show that the natural density of an algebraic characteristic set in the set of primes may be arbitrarily close to any real number in the inter… ▽ More

    Submitted 29 October, 2023; v1 submitted 30 November, 2022; originally announced December 2022.

    Comments: 21 pages, typos corrected, references added

    MSC Class: 05B35

    Journal ref: European Journal of Combinatorics, Volume 118, May 2024, 103939

  3. arXiv:1906.10644  [pdf

    physics.app-ph physics.chem-ph

    Effects of Filler Configuration and Moisture on Dissipation Factor and Critical Electric Field of Epoxy Composites for HV-ICs Encapsulation

    Authors: Woo** Ahn, Davide Cornigli, Dhanoop Varghese, Luu Nguyen, Srikanth Krishnan, Susanna Reggiani, Muhammad Ashraful Alam

    Abstract: Molding compounds (MCs) have been used extensively as an encapsulation material for integrated circuits, however, MCs are susceptible to moisture and charge spreading over time. The increase in dissipation factor due to the increase of parasitic electrical conductivity (σ) and the decrease in dielectric strength (E_MC^Crit) restrict their applications. Thus, a fundamental understanding of moisture… ▽ More

    Submitted 8 March, 2019; originally announced June 2019.

    Comments: 22 pages, 6 figures, Elsevier journal format