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Measuring roughness of buried interfaces by sputter depth profiling
Authors:
S. V. Baryshev,
J. A. Klug,
A. V. Zinovev,
C. E. Tripa,
J. W. Elam,
I. V. Veryovkin
Abstract:
In this communication, we report results of a high resolution sputter depth profiling analysis of a stack of 16 alternating MgO and ZnO nanolayers grown by atomic layer deposition (ALD) with thickness of ~5.5 nm per layer. We used an improved dual beam approach featuring a low energy normally incident direct current sputtering ion beam (first beam). Intensities of 24Mg+ and 64Zn+ secondary ions ge…
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In this communication, we report results of a high resolution sputter depth profiling analysis of a stack of 16 alternating MgO and ZnO nanolayers grown by atomic layer deposition (ALD) with thickness of ~5.5 nm per layer. We used an improved dual beam approach featuring a low energy normally incident direct current sputtering ion beam (first beam). Intensities of 24Mg+ and 64Zn+ secondary ions generated by a pulsed analysis ion beam (second beam) were measured as a function of sample depth by time-of-flight secondary ion mass spectrometry (TOF SIMS). Experimental results of this dual beam TOF SIMS depth profiling processed in the framework of the mixing-roughness-information (MRI) model formalism demonstrate that such an approach is capable of providing structural information for layers just a few nm thick. Namely, it was established that the interfacial roughness of the MgO/ZnO multilayer structure equals 1.5 nm. This finding by TOF SIMS was cross-validated by independent measurements with specular X-ray reflectivity (XRR) technique. In addition, the TOF SIMS-MRI analysis suggests that the obtained 1.5 nm roughness should be attributed to the native roughness (jagged type) of the interface rather than to interdiffusion at the interface during the ALD synthesis.
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Submitted 17 May, 2012;
originally announced May 2012.
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High resolution SIMS depth profiling of nanolayers
Authors:
S. V. Baryshev,
A. V. Zinovev,
C. E. Tripa,
M. J. Pellin,
Q. Peng,
J. W. Elam,
I. V. Veryovkin
Abstract:
We report results of high-resolution TOF SIMS (time of flight secondary ion mass spectrometry) depth profiling experiments on a nanolayered structure, a stack of 16 alternating MgO and ZnO ~5.5 nm layers grown on a Si substrate by atomic layer deposition. The measurements were performed using a newly developed approach implementing a low energy direct current normally incident Ar+ ion beam for sam…
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We report results of high-resolution TOF SIMS (time of flight secondary ion mass spectrometry) depth profiling experiments on a nanolayered structure, a stack of 16 alternating MgO and ZnO ~5.5 nm layers grown on a Si substrate by atomic layer deposition. The measurements were performed using a newly developed approach implementing a low energy direct current normally incident Ar+ ion beam for sample material removal by sputtering (250 eV and 500 eV energy), in combination with a pulsed 5 keV Ar+ ion beam at 60° incidence for TOF SIMS analysis. By this optimized arrangement, a noticeably improved version of known dual-beam (DB) approach to TOF SIMS depth profiling is introduced, which can be called gentleDB. We apply the mixing-roughness-information model to detailed analysis of experimental results. It reveals that the gentleDB approach allows ultimate depth resolution by confining the ion beam mixing length to about 2 monolayers. This corresponds to the escape depth of secondary ions, the fundamental depth resolution limitation in SIMS. Other parameters deduced from the measured depth profiles indicate that a single layer thickness equals to 6 nm so that "flat" layer thickness d is of 3 nm and interfacial roughness σ is of 1.5 nm thus yielding d+2\bulletσ=6 nm. In essence, we have demonstrated that the gentleDB TOF SIMS depth profiling with noble gas ion beams is capable of revealing structural features of a stack of nanolayers, resolving its original surface and estimating the roughness of interlayer interfaces, which is difficult to obtain by traditional approaches.
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Submitted 27 April, 2012;
originally announced April 2012.
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White Light Interferometry for Quantitative Surface Characterization in Ion Sputtering Experiments
Authors:
S. V. Baryshev,
A. V. Zinovev,
C. E. Tripa,
R. A. Erck,
I. V. Veryovkin
Abstract:
White light interferometry (WLI) can be used to obtain surface morphology information on dimensional scale of millimeters with lateral resolution as good as ~1 μm and depth resolution down to 1 nm. By performing true three-dimensional imaging of sample surfaces, the WLI technique enables accurate quantitative characterization of the geometry of surface features and compares favorably to scanning e…
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White light interferometry (WLI) can be used to obtain surface morphology information on dimensional scale of millimeters with lateral resolution as good as ~1 μm and depth resolution down to 1 nm. By performing true three-dimensional imaging of sample surfaces, the WLI technique enables accurate quantitative characterization of the geometry of surface features and compares favorably to scanning electron and atomic force microscopies by avoiding some of their drawbacks. In this paper, results of using the WLI imaging technique to characterize the products of ion sputtering experiments are reported. With a few figures, several example applications of the WLI method are illustrated when used for (i) sputtering yield measurements and time-to-depth conversion, (ii) optimizing ion beam current density profiles, the shapes of sputtered craters, and multiple ion beam superposition and (iii) quantitative characterization of surfaces processed with ions. In particular, for sputter depth profiling experiments of 25Mg, 44Ca and 53Cr ion implants in Si (implantation energy of 1 keV per nucleon), the depth calibration of the measured depth profile curves determined by the WLI method appeared to be self-consistent with TRIM simulations for such projectile-matrix systems. In addition, high depth resolution of the WLI method is demonstrated for a case of a Genesis solar wind Si collector surface processed by gas cluster ion beam: a 12.5 nm layer was removed from the processed surface, while the transition length between the processed and untreated areas was 150 μm.
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Submitted 3 April, 2012;
originally announced April 2012.
