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Quantification of locked mode instability triggered by a change in confinement
Authors:
M. Peterka,
J. Seidl,
T. Markovic,
A. Loarte,
N. C. Logan,
J. -K. Park,
P. Cahyna,
J. Havlicek,
M. Imrisek,
L. Kripner,
R. Panek,
M. Sos,
P. Bilkova,
K. Bogar,
P. Bohm,
A. Casolari,
Y. Gribov,
O. Grover,
P. Hacek,
M. Hron,
K. Kovarik,
M. Tomes,
D. Tskhakaya,
J. Varju,
P. Vondracek
, et al. (2 additional authors not shown)
Abstract:
This work presents the first analysis of the disruptive locked mode (LM) triggered by the dynamics of a confinement change. It shows that, under certain conditions, the LM threshold during the transient is significantly lower than expected from steady states. We investigate the sensitivity to a controlled $n = 1$ error field (EF) activated prior to the L-H transition in the COMPASS tokamak, at…
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This work presents the first analysis of the disruptive locked mode (LM) triggered by the dynamics of a confinement change. It shows that, under certain conditions, the LM threshold during the transient is significantly lower than expected from steady states. We investigate the sensitivity to a controlled $n = 1$ error field (EF) activated prior to the L-H transition in the COMPASS tokamak, at $q_{95} \approx 3$, $β_N \approx 1$, and using EF coils on the high-field side of the vessel. A threshold for EF penetration subsequent to the L-H transition is identified, which shows no significant trend with density or applied torque, and is an apparent consequence of the reduced intrinsic rotation of the 2/1 mode during this transient phase. This finding challenges the assumption made in theoretical and empirical works that natural mode rotation can be predicted by global plasma parameters and urges against using any parametric EF penetration scaling derived from steady-state experiments to define the error field correction strategy in the entire discharge. Furthermore, even at EFs below the identified penetration threshold, disruptive locking of sawtooth-seeded 2/1 tearing modes is observed after about 30% of L-H transitions without external torque.
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Submitted 17 April, 2024;
originally announced April 2024.
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The effect of direct electron beam patterning on the water uptake and ionic conductivity of Nafion thin films
Authors:
Ky V. Nguyen,
Jan G. Gluschke,
A. Bernardus Mostert,
Andrew Nelson,
Gregory Burwell,
Roman W. Lyttleton,
Hamish Cavaye,
Rebecca J. L. Welbourn,
Jakob Seidl,
Maxime Lagier,
Marta Sanchez Miranda,
James D. McGettrick,
Trystan Watson,
Paul Meredith,
Adam P. Micolich
Abstract:
We report the effect of electron-beam patterning on the water uptake and ionic conductivity of Nafion films using a combination of x-ray photoelectron spectroscopy, quartz crystal microbalance studies, neutron reflectometry, and AC impedance spectroscopy. The aim was to more fully characterize the nature of the nanoscale patterned Nafion structures recently used as a key element in novel ion-to-el…
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We report the effect of electron-beam patterning on the water uptake and ionic conductivity of Nafion films using a combination of x-ray photoelectron spectroscopy, quartz crystal microbalance studies, neutron reflectometry, and AC impedance spectroscopy. The aim was to more fully characterize the nature of the nanoscale patterned Nafion structures recently used as a key element in novel ion-to-electron transducers by Gluschke et al. To enable these studies, we develop the electron beam patterning process for large areas, achieving patterning speeds approaching 1 cm$^{2}$/hr, and patterned areas as large as 7 cm$^{2}$ for the neutron reflectometry studies. We ultimately show that electron-beam patterning affects both the water uptake and the ionic conductivity, depending on film thickness. We see Type-II adsorption isotherm behaviour for all films. For thick films (~230 nm), we see a strong reduction in water uptake with electron-beam patterning. In contrast, for thin films (~30 nm), electron-beam patterning enhances water uptake. Notably, we find that for either thickness the reduction in ionic conductivity arising from electron-beam patterning is kept to less than an order of magnitude. We propose mechanisms for the observed behaviour based on the known complex morphology of Nafion films to motivate future studies of electron-beam processed Nafion.
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Submitted 21 June, 2023;
originally announced June 2023.
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Integrated bioelectronic proton-gated logic elements utilizing nanoscale patterned Nafion
Authors:
J. G. Gluschke,
J. Seidl,
R. W. Lyttleton,
K. Nguyen,
M. Lagier,
F. Meyer,
P. Krogstrup,
J. Nygard,
S. Lehmann,
A. B. Mostert,
P. Meredith,
A. P. Micolich
Abstract:
A central endeavour in bioelectronics is the development of logic elements to transduce and process ionic to electronic signals. Motivated by this challenge, we report fully monolithic, nanoscale logic elements featuring n- and p-type nanowires as electronic channels that are proton-gated by electron-beam patterned Nafion. We demonstrate inverter circuits with state-of-the-art ion-to-electron tran…
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A central endeavour in bioelectronics is the development of logic elements to transduce and process ionic to electronic signals. Motivated by this challenge, we report fully monolithic, nanoscale logic elements featuring n- and p-type nanowires as electronic channels that are proton-gated by electron-beam patterned Nafion. We demonstrate inverter circuits with state-of-the-art ion-to-electron transduction performance giving DC gain exceeding 5 and frequency response up to 2 kHz. A key innovation facilitating the logic integration is a new electron-beam process for patterning Nafion with linewidths down to 125 nm. This process delivers feature sizes compatible with low voltage, fast switching elements. This expands the scope for Nafion as a versatile patternable high-proton-conductivity element for bioelectronics and other applications requiring nanoengineered protonic membranes and electrodes.
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Submitted 14 May, 2023;
originally announced May 2023.
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Post-growth sha** and transport anisotropy in 2D InAs nanofins
Authors:
J. Seidl,
J. G. Gluschke,
X. Yuan,
H. H. Tan,
C. Jagadish,
P. Caroff,
A. P. Micolich
Abstract:
We report on the post-growth sha** of free-standing 2D InAs nanofins that are grown by selective-area epitaxy and mechanically transferred to a separate substrate for device fabrication. We use a citric acid based wet etch that enables complex shapes, e.g., van der Pauw cloverleaf structures, with patterning resolution down to 150 nm as well as partial thinning of the nanofin to improve the gate…
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We report on the post-growth sha** of free-standing 2D InAs nanofins that are grown by selective-area epitaxy and mechanically transferred to a separate substrate for device fabrication. We use a citric acid based wet etch that enables complex shapes, e.g., van der Pauw cloverleaf structures, with patterning resolution down to 150 nm as well as partial thinning of the nanofin to improve the gate response. We exploit the high sensitivity of the cloverleaf structures to transport anisotropy to address the fundamental question of whether there is a measurable transport anisotropy arising from wurtzite/zincblende polytypism in 2D InAs nanostructures. We demonstrate a mobility anisotropy of order 2-4 at room temperature arising from polytypic stacking faults in our nanofins. Our work highlights a key materials consideration for devices featuring self-assembled 2D III-V nanostructures using advanced epitaxy methods.
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Submitted 14 May, 2023;
originally announced May 2023.
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Impact of invasive metal probes on Hall measurements in semiconductor nanostructures
Authors:
J. G. Gluschke,
J. Seidl,
H. H. Tan,
C. Jagadish,
P. Caroff,
A. P. Micolich
Abstract:
Recent advances in bottom-up growth are giving rise to a range of new two-dimensional nanostructures. Hall effect measurements play an important role in their electrical characterization. However, size constraints can lead to device geometries that deviate significantly from the ideal of elongated Hall bars with currentless contacts. Many devices using these new materials have a low aspect ratio a…
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Recent advances in bottom-up growth are giving rise to a range of new two-dimensional nanostructures. Hall effect measurements play an important role in their electrical characterization. However, size constraints can lead to device geometries that deviate significantly from the ideal of elongated Hall bars with currentless contacts. Many devices using these new materials have a low aspect ratio and feature metal Hall probes that overlap with the semiconductor channel. This can lead to a significant distortion of the current flow. We present experimental data from InAs 2D nanofin devices with different Hall probe geometries to study the influence of Hall probe length and width. We use finite-element simulations to further understand the implications of these aspects and expand the scope to contact resistance and sample aspect ratios. Our key finding is that invasive probes lead to a significant underestimation in the measured Hall voltage, typically of the order of 40-80%. This in turn leads to a subsequent proportional overestimation of carrier concentration and an underestimation of mobility
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Submitted 19 October, 2020;
originally announced October 2020.
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Systematic errors in tokamak magnetic equilibrium reconstruction: a study of EFIT++ at tokamak COMPASS
Authors:
K. Jirakova,
O. Kovanda,
J. Adamek,
M. Komm,
J. Seidl
Abstract:
Uncertainties and errors in magnetic equilibrium reconstructions are a wide-spread problem in interpreting experimental data measured in the tokamak edge. This study demonstrates errors in EFIT++ reconstructions performed on the COMPASS tokamak by comparing the outer midplane separatrix position to the Velocity Shear Layer (VSL) position. The VSL is detected as the plasma potential peak measured b…
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Uncertainties and errors in magnetic equilibrium reconstructions are a wide-spread problem in interpreting experimental data measured in the tokamak edge. This study demonstrates errors in EFIT++ reconstructions performed on the COMPASS tokamak by comparing the outer midplane separatrix position to the Velocity Shear Layer (VSL) position. The VSL is detected as the plasma potential peak measured by a reciprocating ball-pen probe. A subsequent statistical analysis of nearly 400 discharges shows a strong systematic trend in the reconstructed separatrix position relative to the VSL, where the primary factors are plasma triangularity and the magnetic axis radial position. This dependency is significantly reduced after the measuring coils positions as recorded in EFIT input are optimised to provide a closer match between the "synthetic" coil signal calculated by the Biot-Savart law in a vacuum discharge and the actual coil signal. In conclusion, we suggest that applying this optimisation may lead to more accurate and reliable reconstructions of the COMPASS equilibrium, which would have a positive impact on the accuracy of measurement analysis performed in the edge plasma.
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Submitted 28 January, 2020;
originally announced January 2020.
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Regaining a spatial dimension: Mechanically transferrable two-dimensional InAs nanofins grown by selective area epitaxy
Authors:
J. Seidl,
J. G. Gluschke,
X. Yuan,
S. Naureen,
N. Shahid,
H. H. Tan,
C. Jagadish,
A. P. Micolich,
P. Caroff
Abstract:
We report a method for growing rectangular InAs nanofins with deterministic length, width and height by dielectric-templated selective-area epitaxy. These freestanding nanofins can be transferred to lay flat on a separate substrate for device fabrication. A key goal was to regain a spatial dimension for device design compared to nanowires, whilst retaining the benefits of bottom-up epitaxial growt…
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We report a method for growing rectangular InAs nanofins with deterministic length, width and height by dielectric-templated selective-area epitaxy. These freestanding nanofins can be transferred to lay flat on a separate substrate for device fabrication. A key goal was to regain a spatial dimension for device design compared to nanowires, whilst retaining the benefits of bottom-up epitaxial growth. The transferred nanofins were made into devices featuring multiple contacts for Hall effect and four-terminal resistance studies, as well as a global back-gate and nanoscale local top-gates for density control. Hall studies give a 3D electron density $2.5~-~5 \times 10^{17}$ cm$^{-3}$, corresponding to an approximate surface accumulation layer density $3~-~6 \times 10^{12}$ cm$^{-2}$ that agrees well with previous studies of InAs nanowires. We obtain Hall mobilities as high as $1200$ cm$^{2}$/Vs, field-effect mobilities as high as $4400$ cm$^{2}$/Vs and clear quantum interference structure at temperatures as high as $20$ K. Our devices show excellent prospects for fabrication into more complicated devices featuring multiple ohmic contacts, local gates and possibly other functional elements, e.g., patterned superconductor contacts, that may make them attractive options for future quantum information applications.
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Submitted 28 June, 2019;
originally announced July 2019.
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Achieving short high-quality gate-all-around structures for horizontal nanowire field-effect transistors
Authors:
J. G. Gluschke,
J. Seidl,
A. M. Burke,
R. W. Lyttleton,
D. J. Carrad,
A. R. Ullah,
S. Fahlvik Svensson,
S. Lehmann,
H. Linke,
A. P. Micolich
Abstract:
We introduce a fabrication method for gate-all-around nanowire field-effect transistors. Single nanowires were aligned perpendicular to underlying bottom gates using a resist-trench alignment technique. Top gates were then defined aligned to the bottom gates to form gate-all-around structures. This approach overcomes significant limitations in minimal obtainable gate length and gate-length control…
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We introduce a fabrication method for gate-all-around nanowire field-effect transistors. Single nanowires were aligned perpendicular to underlying bottom gates using a resist-trench alignment technique. Top gates were then defined aligned to the bottom gates to form gate-all-around structures. This approach overcomes significant limitations in minimal obtainable gate length and gate-length control in previous horizontal wrap-gated nanowire transistors that arise because the gate is defined by wet etching. In the method presented here gate-length control is limited by the resolution of the electron-beam-lithography process. We demonstrate the versatility of our approach by fabricating a device with an independent bottom gate, top gate, and gate-all-around structure as well as a device with three independent gate-all-around structures with 300 nm, 200 nm, and 150 nm gate length. Our method enables us to achieve sub-threshold swings as low as 38 mV/dec at 77 K for a 150 nm gate length.
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Submitted 8 October, 2018;
originally announced October 2018.
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Using ultra-thin parylene films as an organic gate insulator in nanowire field-effect transistors
Authors:
J. G. Gluschke,
J. Seidl,
R. W. Lyttleton,
D. J. Carrad,
J. W. Cochrane,
S. Lehmann,
L. Samuelson,
A. P. Micolich
Abstract:
We report the development of nanowire field-effect transistors featuring an ultra-thin parylene film as a polymer gate insulator. The room temperature, gas-phase deposition of parylene is an attractive alternative to oxide insulators prepared at high temperatures using atomic layer deposition. We discuss our custom-built parylene deposition system, which is designed for reliable and controlled dep…
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We report the development of nanowire field-effect transistors featuring an ultra-thin parylene film as a polymer gate insulator. The room temperature, gas-phase deposition of parylene is an attractive alternative to oxide insulators prepared at high temperatures using atomic layer deposition. We discuss our custom-built parylene deposition system, which is designed for reliable and controlled deposition of <100 nm thick parylene films on III-V nanowires standing vertically on a growth substrate or horizontally on a device substrate. The former case gives conformally-coated nanowires, which we used to produce functional $Ω$-gate and gate-all-around structures. These give sub-threshold swings as low as 140 mV/dec and on/off ratios exceeding $10^3$ at room temperature. For the gate-all-around structure, we developed a novel fabrication strategy that overcomes some of the limitations with previous lateral wrap-gate nanowire transistors. Finally, we show that parylene can be deposited over chemically-treated nanowire surfaces; a feature generally not possible with oxides produced by atomic layer deposition due to the surface `self-cleaning' effect. Our results highlight the potential for parylene as an alternative ultra-thin insulator in nanoscale electronic devices more broadly, with potential applications extending into nanobioelectronics due to parylene's well-established biocompatible properties.
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Submitted 27 September, 2018;
originally announced September 2018.
