Showing 1–3 of 3 results for author: Saha, C N

Sub-100 nm β-Ga2O3 MOSFET with 55 GHz fMAX and >100 V breakdown

Authors: Chinmoy Nath Saha, Abhishek Vaidya, A F M Anhar Uddin Bhuiyan, Lingyu Meng, Hong** Zhao, Uttam Singisetti

Abstract: This letter reports a highly scaled 90 nm gate length beta-Ga2O3 T-gate MOSFET with no current collapse and record power gain cut off frequency (fMAX). The epitaxial stack of 60 nm thin channel MOSFET was grown by Molecular Beam Epitaxy (MBE) and highly doped (n++) contact regrowth was carried out by Metal Organic Chemical Vapour Deposition (MOCVD) in the source/drain region. Maximum on current (I… ▽ More This letter reports a highly scaled 90 nm gate length beta-Ga2O3 T-gate MOSFET with no current collapse and record power gain cut off frequency (fMAX). The epitaxial stack of 60 nm thin channel MOSFET was grown by Molecular Beam Epitaxy (MBE) and highly doped (n++) contact regrowth was carried out by Metal Organic Chemical Vapour Deposition (MOCVD) in the source/drain region. Maximum on current (IDS, MAX) of 160 mA/mm and transconductance (gm) around 36 mS/mm was measured at VDS= 10 V for LSD= 1.5 micrometer channel length. Transconductance is limited by higher channel sheet resistance (Rsheet). We observed no current collapse for both drain and gate lag measurement even at higher VDG,Q quiescent bias points. This is the first report of Ga2O3 FET showing no current collapse without any external passivation. Breakdown voltage around 125 V was reported for LGD= 1.2 micrometer. We extracted 27 GHz current gain cut off frequency (fT) and 55 GHz fMAX for 20 V drain bias. fMAX value mentioned here is the highest for Ga2O3 and the first demonstration of 55 GHz operation. fT. VBR product of 3.375 THz.V has been calculated which is comparable with state-of-art GaN HEMT. This letter suggests that Ga2O3 can be a suitable candidate for X-band application. △ Less

Submitted 14 November, 2023; v1 submitted 8 May, 2023; originally announced May 2023.

Electrical Characteristics of in situ Mg-doped beta-Ga2O3 Current-Blocking Layer for Vertical Devices

Authors: Sudipto Saha, Lingyu Meng, A F M Anhar Uddin Bhuiyan, Ankit Sharma, Chinmoy Nath Saha, Hong** Zhao, Uttam Singisetti

Abstract: The lack of p-type do** has impeded the development of vertical gallium oxide (Ga2O3) devices. Current blocking layers (CBL) using implanted deep acceptors has been used to demonstrate vertical devices. This paper presents the first demonstration of in situ Mg-doped beta-Ga2O3 CBLs grown using metalorganic chemical vapor deposition. Device structures were designed with in-situ Mg doped layers wi… ▽ More The lack of p-type do** has impeded the development of vertical gallium oxide (Ga2O3) devices. Current blocking layers (CBL) using implanted deep acceptors has been used to demonstrate vertical devices. This paper presents the first demonstration of in situ Mg-doped beta-Ga2O3 CBLs grown using metalorganic chemical vapor deposition. Device structures were designed with in-situ Mg doped layers with varied targeted Mg do** concentrations, which were calibrated by quantitative secondary ion mass spectroscopy (SIMS). The effectiveness of the CBL is characterized using temperature dependent current-voltage measurements using n-Mg-doped-n structures, providing crucial insight into the underlying mechanisms. To further validate the experimental results, a TCAD simulation is performed and the electrically active effective do** is found to be dependent on the Mg-do** density, offering a new perspective on the optimization of CBL performance. Breakdown measurements show a 3.4 MV/cm field strength. This study represents a significant step forward in the development of Ga2O3-based devices and paves the way for future advancements in this exciting field. △ Less

Submitted 12 April, 2023; originally announced April 2023.

Beta-Ga2O3 MOSFETs with near 50 GHz fMAX and 5.4 MV/cm average breakdown field

Authors: Chinmoy Nath Saha, Abhishek Vaidya, A F M Anhar Uddin Bhuiyan, Lingyu Meng, Hong** Zhao, Uttam Singisetti

Abstract: This letter reports high-performance $\mathrmβ Ga2O3 thin channel MOSFETs with T-gate and degenerately doped source/drain contacts regrown by MOCVD. Gate length scaling (LG= 160-200 nm) leads to a peak drain current (ID,MAX) of 285 mA/mm and peak trans-conductance (gm) of 52 mS/mm at 10 V drain bias with 23.5 Ohm mm on resistance (Ron). A low metal/n+ contact resistance of 0.078 Ohm mm was extract… ▽ More This letter reports high-performance $\mathrmβ Ga2O3 thin channel MOSFETs with T-gate and degenerately doped source/drain contacts regrown by MOCVD. Gate length scaling (LG= 160-200 nm) leads to a peak drain current (ID,MAX) of 285 mA/mm and peak trans-conductance (gm) of 52 mS/mm at 10 V drain bias with 23.5 Ohm mm on resistance (Ron). A low metal/n+ contact resistance of 0.078 Ohm mm was extracted from TLM measurement. Ron is dominated by interface resistance between channel and regrown layer. A gate-to-drain breakdown voltage of 192 V is measured for LGD = 355 nm resulting in average breakdown field (E_AVG) of 5.4 MV/cm. This E_AVG is the highest reported among all sub-micron gate length lateral FETs. RF measurements on 200 nm Silicon Nitride (Si3N4) passivated device shows a current gain cut off frequency (f_T) of 11 GHz and record power gain cut off frequency (f_MAX) of 48 GHz. The f_T.V_Br product is 2.11 THz.V for 192 V breakdown voltage. The switching figure of merit exceeds that of silicon and is comparable to mature wide-band gap devices. △ Less

Submitted 2 November, 2022; originally announced November 2022.