The Beta-decay Paul Trap Mk IV: Design and commissioning
Authors:
L. Varriano,
G. Savard,
J. A. Clark,
D. P. Burdette,
M. T. Burkey,
A. T. Gallant,
T. Y. Hirsh,
B. Longfellow,
N. D. Scielzo,
R. Segel,
E. J. Boron III,
M. Brodeur,
N. Callahan,
A. Cannon,
K. Kolos,
B. Liu,
S. Lopez-Caceres,
M. Gott,
B. Maaß,
S. T. Marley,
C. Mohs,
G. E. Morgan,
P. Mueller,
M. Oberling,
P. D. O'Malley
, et al. (7 additional authors not shown)
Abstract:
The Beta-decay Paul Trap is an open-geometry, linear trap used to measure the decays of $^8$Li and $^8$B to search for a tensor contribution to the weak interaction. In the latest $^8$Li measurement of Burkey et al. (2022), $β$ scattering was the dominant experimental systematic uncertainty. The Beta-decay Paul Trap Mk IV reduces the prevalence of $β$ scattering by a factor of 4 through a redesign…
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The Beta-decay Paul Trap is an open-geometry, linear trap used to measure the decays of $^8$Li and $^8$B to search for a tensor contribution to the weak interaction. In the latest $^8$Li measurement of Burkey et al. (2022), $β$ scattering was the dominant experimental systematic uncertainty. The Beta-decay Paul Trap Mk IV reduces the prevalence of $β$ scattering by a factor of 4 through a redesigned electrode geometry and the use of glassy carbon and graphite as electrode materials. The trap has been constructed and successfully commissioned with $^8$Li in a new data campaign that collected 2.6 million triple coincidence events, an increase in statistics by 30% with 4 times less $β$ scattering compared to the previous $^8$Li data set.
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Submitted 30 October, 2023;
originally announced November 2023.
Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade
Authors:
A. La Rosa,
M. Boscardin,
G. -F. Dalla Betta,
G. Darbo,
C. Gemme,
H. Pernegger,
C. Piemonte,
M. Povoli,
S. Ronchin,
A. Zoboli,
N. Zorzi,
E. Bolle,
M. Borri,
C. Da Via,
S. Dong,
S. Fazio,
P. Grenier,
S. Grinstein,
H. Gjersdal,
P. Hansson,
F. Huegging,
P. Jackson,
M. Kocian,
F. Rivero,
O. Rohne
, et al. (7 additional authors not shown)
Abstract:
3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a 180GeV pion beam at CERN SPS. The substrate thickness of the sensors is about 200um, and different column depths are available, with overlaps between junction c…
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3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a 180GeV pion beam at CERN SPS. The substrate thickness of the sensors is about 200um, and different column depths are available, with overlaps between junction columns (etched from the front side) and ohmic columns (etched from the back side) in the range from 110um to 150um. The devices under test were bump bonded to the ATLAS Pixel readout chip (FEI3) at SELEX SI (Rome, Italy). We report leakage current and noise measurements, results of functional tests with Am241 gamma-ray sources, charge collection tests with Sr90 beta-source and an overview of preliminary results from the CERN beam test.
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Submitted 20 October, 2009;
originally announced October 2009.
