Over 6 $μ$m thick MOCVD-grown Low-Background Carrier Density (10$^{15}$ cm$^{-3}$) High-Mobility (010) $β$-Ga$_2$O$_3$ Drift Layers
Authors:
Arkka Bhattacharyya,
Carl Peterson,
Kittamet Chanchaiworawit,
Saurav Roy,
Yizheng Liu,
Steve Rebollo,
Sriram Krishnamoorthy
Abstract:
This work reports high carrier mobilities and growth rates, simultaneously in low unintentionally-doped UID (10$^{15}$ cm$^{-3}$) MOCVD-grown thick $β$-Ga$_2$O$_3$ epitaxial drift layers, with thicknesses reaching up to 6.3 $μ$m, using triethylgallium (TEGa) as a precursor. Record high room temperature Hall mobilities of 187-190 cm$^2$/Vs were measured for background carrier density values of 2.4…
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This work reports high carrier mobilities and growth rates, simultaneously in low unintentionally-doped UID (10$^{15}$ cm$^{-3}$) MOCVD-grown thick $β$-Ga$_2$O$_3$ epitaxial drift layers, with thicknesses reaching up to 6.3 $μ$m, using triethylgallium (TEGa) as a precursor. Record high room temperature Hall mobilities of 187-190 cm$^2$/Vs were measured for background carrier density values of 2.4 - 3.5$\times$10$^{15}$ cm$^{-3}$ grown at a rate of 2.2 $μ$m/hr. A controlled background carrier density scaling from 3.3$\times$10$^{16}$ cm$^{-3}$ to 2.4$\times$10$^{15}$ cm$^{-3}$ is demonstrated, without the use of intentional dopant gases such as silane, by controlling the growth rate and O$_2$/TEGa ratio. Films show smooth surface morphologies of 0.8-3.8 nm RMS roughness for film thicknesses of 1.24 - 6.3$μ$m. Vertical Ni Schottky barrier diodes (SBDs) fabricated on UID MOCVD material were compared with those fabricated on hydride vapor phase epitaxy (HVPE) material, revealing superior material and device characteristics. MOCVD SBDs on a 6.3 $μ$m thick epitaxial layer show a uniform charge vs. depth profile of $\sim$2.4$\times$10$^{15}$ cm$^{-3}$, an estimated $μ$$_{drift}$ of 132 cm$^2$/Vs, a breakdown voltage (V$_{BR}$) close to 1.2 kV and a surface parallel plane field of 2.05MV/cm without any electric field management - setting record-high parameters for any MOCVD-grown $β$-Ga$_2$O$_3$ vertical diode to date.
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Submitted 23 November, 2023;
originally announced November 2023.
Enhancing the Electron Mobility in Si-doped (010) $β$-Ga$_2$O$_3$ films with Low-Temperature Buffer Layers
Authors:
Arkka Bhattacharyya,
Carl Peterson,
Takeki Itoh,
Saurav Roy,
Jacqueline Cooke,
Steve Rebollo,
Praneeth Ranga,
Berardi Sensale-Rodriguez,
Sriram Krishnamoorthy
Abstract:
We demonstrate a new substrate cleaning and buffer growth scheme in $β$-Ga$_2$O$_3$ epitaxial thin films using metalorganic vapor phase epitaxy (MOVPE). For the channel structure, a low-temperature (LT, 600 $^\circ$C) undoped Ga$_2$O$_3$ buffer is grown followed by transition layers to a high-temperature (HT, 810 $^\circ$C) Si-doped Ga$_2$O$_3$ channel layers without growth interruption. The (010)…
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We demonstrate a new substrate cleaning and buffer growth scheme in $β$-Ga$_2$O$_3$ epitaxial thin films using metalorganic vapor phase epitaxy (MOVPE). For the channel structure, a low-temperature (LT, 600 $^\circ$C) undoped Ga$_2$O$_3$ buffer is grown followed by transition layers to a high-temperature (HT, 810 $^\circ$C) Si-doped Ga$_2$O$_3$ channel layers without growth interruption. The (010) Ga$_2$O$_3$ Fe-doped substrate cleaning uses solvent cleaning followed by an additional HF (49% in water) treatment for 30 mins before the epilayer growth. This step is shown to compensate the parasitic Si channel at the epilayer-substrate interface that originates from the substrate polishing process or contamination from the ambient. SIMS analysis shows the Si peak atomic density at the substrate interface is several times lower than the Fe atomic density in the substrate - indicating full compensation. The elimination of the parasitic electron channel at the epi-substrate interface was also verified by electrical (capacitance-voltage profiling) measurements. In the LT-grown buffer layers, it is seen that the Fe forward decay tail from the substrate is very sharp with a decay rate of $\sim$ 9 nm$/$dec. These channels show record high electron mobility in the range of 196 - 85 cm$^2$/Vs in unintentionally doped and Si-doped films in the do** range of 2$\times$10$^{16}$ to 1$\times$10$^{20}$ cm$^{-3}$. Si delta-doped channels were also grown utilizing this substrate cleaning and the hybrid LT-buffers. Record high electron Hall mobility of 110 cm$^2$/Vs was measured for sheet charge density of 9.2$\times$10$^{12}$ cm$^{-2}$. This substrate cleaning combined with the LT-buffer scheme shows the potential of designing Si-doped $β$-Ga$_2$O$_3$ channels with exceptional transport properties for high performance gallium oxide-based electron devices.
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Submitted 2 February, 2023; v1 submitted 5 December, 2022;
originally announced December 2022.
