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Showing 1–4 of 4 results for author: Rebane, K

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  1. arXiv:2403.08952  [pdf, other

    physics.ins-det

    Characterisation of analogue Monolithic Active Pixel Sensor test structures implemented in a 65 nm CMOS imaging process

    Authors: Gianluca Aglieri Rinella, Giacomo Alocco, Matias Antonelli, Roberto Baccomi, Stefania Maria Beole, Mihail Bogdan Blidaru, Bent Benedikt Buttwill, Eric Buschmann, Paolo Camerini, Francesca Carnesecchi, Marielle Chartier, Yongjun Choi, Manuel Colocci, Giacomo Contin, Dominik Dannheim, Daniele De Gruttola, Manuel Del Rio Viera, Andrea Dubla, Antonello di Mauro, Maurice Calvin Donner, Gregor Hieronymus Eberwein, Jan Egger, Laura Fabbietti, Finn Feindt, Kunal Gautam , et al. (69 additional authors not shown)

    Abstract: Analogue test structures were fabricated using the Tower Partners Semiconductor Co. CMOS 65 nm ISC process. The purpose was to characterise and qualify this process and to optimise the sensor for the next generation of Monolithic Active Pixels Sensors for high-energy physics. The technology was explored in several variants which differed by: do** levels, pixel geometries and pixel pitches (10-25… ▽ More

    Submitted 13 March, 2024; originally announced March 2024.

  2. Digital Pixel Test Structures implemented in a 65 nm CMOS process

    Authors: Gianluca Aglieri Rinella, Anton Andronic, Matias Antonelli, Mauro Aresti, Roberto Baccomi, Pascal Becht, Stefania Beole, Justus Braach, Matthew Daniel Buckland, Eric Buschmann, Paolo Camerini, Francesca Carnesecchi, Leonardo Cecconi, Edoardo Charbon, Giacomo Contin, Dominik Dannheim, Joao de Melo, Wen**g Deng, Antonello di Mauro, Jan Hasenbichler, Hartmut Hillemanns, Geun Hee Hong, Artem Isakov, Antoine Junique, Alex Kluge , et al. (27 additional authors not shown)

    Abstract: The ALICE ITS3 (Inner Tracking System 3) upgrade project and the CERN EP R&D on monolithic pixel sensors are investigating the feasibility of the Tower Partners Semiconductor Co. 65 nm process for use in the next generation of vertex detectors. The ITS3 aims to employ wafer-scale Monolithic Active Pixel Sensors thinned down to 20 to 40 um and bent to form truly cylindrical half barrels. Among the… ▽ More

    Submitted 10 July, 2023; v1 submitted 16 December, 2022; originally announced December 2022.

    Comments: v4: Corrected Table 1. v3: Implemented reviewers' comments. v2: Updated threshold calibration method. Implemented colorblind friendly color palette in all figures. Updated references

  3. The MAPS foil

    Authors: S. Beolé, F. Carnesecchi, G. Contin, R. de Oliveira, A. di Mauro, S. Ferry, H. Hillemanns, A. Junique, A. Kluge, L. Lautner, M. Mager, B. Mehl, K. Rebane, F. Reidt, I. Sanna, M. Šuljić, A. Yüncü

    Abstract: We present a method of embedding a Monolithic Active Pixel Sensor (MAPS) into a flexible printed circuit board (FPC) and its interconnection by means of through-hole copper plating. The resulting assembly, baptised "MAPS foil", is a flexible, light, protected, and fully integrated detector module. By using widely available printed circuit board manufacturing techniques, the production of these dev… ▽ More

    Submitted 19 October, 2022; v1 submitted 25 May, 2022; originally announced May 2022.

  4. Analytic Evaluation of Four-Particle Integrals with Complex Parameters

    Authors: V. S. Zotev, T. K. Rebane

    Abstract: The method for analytic evaluation of four-particle integrals, proposed by Fromm and Hill, is generalized to include complex exponential parameters. An original procedure of numerical branch tracking for multiple valued functions is developed. It allows high precision variational solution of the Coulomb four-body problem in a basis of exponential-trigonometric functions of interparticle separati… ▽ More

    Submitted 4 March, 2002; originally announced March 2002.

    Comments: 13 pages, 4 figures

    Journal ref: Physical Review A 65, 062501 (2002)