-
LURAD: Design Study of a Comprehensive Radiation Monitor Package for the Gateway and the Lunar Surface
Authors:
C. Potiriadis,
K. Karafasoulis,
C. Papadimitropoulos,
E. Papadomanolaki,
A. Papangelis,
I. Kazas,
J. Vourvoulakis,
G. Theodoratos,
A. Kok,
L. T. Tran,
M. Povoli,
J. Vohradsky,
G. Dimitropoulos,
A. Rosenfeld,
C. P. Lambropoulos
Abstract:
Moon is an auspicious environment for the study of Galactic cosmic rays (GCR) and Solar particle events (SEP) due to the absence of magnetic field and atmosphere. The same characteristics raise the radiation risk for human presence in orbit around it or at the lunar surface. The secondary (albedo) radiation resulting from the interaction of the primary radiation with the lunar soil adds an extra r…
▽ More
Moon is an auspicious environment for the study of Galactic cosmic rays (GCR) and Solar particle events (SEP) due to the absence of magnetic field and atmosphere. The same characteristics raise the radiation risk for human presence in orbit around it or at the lunar surface. The secondary (albedo) radiation resulting from the interaction of the primary radiation with the lunar soil adds an extra risk factor, because neutrons are produced, but also it can be exploited to study the soil composition. In this paper, the design of a comprehensive radiation monitor package tailored to the lunar environment is presented. The detector, named LURAD, will perform spectroscopic measurements of protons, electrons, heavy ions, as well as gamma-rays, and neutrons. A microdosimetry monitor subsystem is foreseen which can provide measurements of LET(Si) spectra in a wide dynamic range of LET(Si) and flux for SPE and GCR, detection of neutrons and biological dose for radiation protection of astronauts. The LURAD design leverages on the following key enabling technologies: (a) Fully depleted Si monolithic active pixel sensors; (b) Scintillators read by silicon photomultipliers (SiPM); (c) Silicon on Insulator (SOI) microdosimetry sensors; These technologies promise miniaturization and mass reduction with state-of-the-art performance. The instrument's design is presented, and the Monte Carlo study of the feasibility of particle identification and kinetic energy determination is discussed
△ Less
Submitted 6 May, 2024;
originally announced May 2024.
-
Radiation Hard 3D Silicon Pixel Sensors for use in the ATLAS Detector at the HL-LHC
Authors:
Andreas Løkken Heggelund,
Simon Huiberts,
Ole Dorholt,
Alexander Lincoln Read,
Ole Røhne,
Heidi Sandaker,
Magne Lauritzen,
Bjarne Stugu,
Angela Kok,
Ozhan Koybasi,
Marco Povoli,
Marco Bomben,
Jörn Lange,
Andre Rummler
Abstract:
The High Luminosity LHC (HL-LHC) upgrade requires the planned Inner Tracker (ITk) of the ATLAS detector to tolerate extremely high radiation doses. Specifically, the innermost parts of the pixel system will have to withstand radiation fluences above $1\times10^{16}$ $n_{eq}cm^{-2}$. Novel 3D silicon pixel sensors offer a superior radiation tolerance compared to conventional planar pixel sensors, a…
▽ More
The High Luminosity LHC (HL-LHC) upgrade requires the planned Inner Tracker (ITk) of the ATLAS detector to tolerate extremely high radiation doses. Specifically, the innermost parts of the pixel system will have to withstand radiation fluences above $1\times10^{16}$ $n_{eq}cm^{-2}$. Novel 3D silicon pixel sensors offer a superior radiation tolerance compared to conventional planar pixel sensors, and are thus excellent candidates for the innermost parts of the ITk. This paper presents studies of 3D pixel sensors with pixel size $50 \times 50$ $μm^2$ mounted on the RD53A prototype readout chip. Following a description of the design and fabrication steps, Test Beam results are presented for unirradiated as well as heavily irradiated sensors. For particles passing at perpendicular incidence, it is shown that average efficiencies above 96% are reached for sensors exposed to fluences of $1\times10^{16}$ $n_{eq}cm^{-2}$ when biased to 80 $V$.
△ Less
Submitted 21 February, 2022;
originally announced February 2022.
-
Production and Integration of the ATLAS Insertable B-Layer
Authors:
B. Abbott,
J. Albert,
F. Alberti,
M. Alex,
G. Alimonti,
S. Alkire,
P. Allport,
S. Altenheiner,
L. Ancu,
E. Anderssen,
A. Andreani,
A. Andreazza,
B. Axen,
J. Arguin,
M. Backhaus,
G. Balbi,
J. Ballansat,
M. Barbero,
G. Barbier,
A. Bassalat,
R. Bates,
P. Baudin,
M. Battaglia,
T. Beau,
R. Beccherle
, et al. (352 additional authors not shown)
Abstract:
During the shutdown of the CERN Large Hadron Collider in 2013-2014, an additional pixel layer was installed between the existing Pixel detector of the ATLAS experiment and a new, smaller radius beam pipe. The motivation for this new pixel layer, the Insertable B-Layer (IBL), was to maintain or improve the robustness and performance of the ATLAS tracking system, given the higher instantaneous and i…
▽ More
During the shutdown of the CERN Large Hadron Collider in 2013-2014, an additional pixel layer was installed between the existing Pixel detector of the ATLAS experiment and a new, smaller radius beam pipe. The motivation for this new pixel layer, the Insertable B-Layer (IBL), was to maintain or improve the robustness and performance of the ATLAS tracking system, given the higher instantaneous and integrated luminosities realised following the shutdown. Because of the extreme radiation and collision rate environment, several new radiation-tolerant sensor and electronic technologies were utilised for this layer. This paper reports on the IBL construction and integration prior to its operation in the ATLAS detector.
△ Less
Submitted 6 June, 2018; v1 submitted 2 March, 2018;
originally announced March 2018.
-
Thin silicon strip detectors for beam monitoring in Micro-beam Radiation Therapy
Authors:
Marco Povoli,
Enver Alagoz,
Alberto Bravin,
Iwan Cornelius,
Elke Bräuer-Krisch,
Pauline Fournier,
Thor-Erik Hansen,
Angela Kok,
Michael Lerch,
Edouard Monakhov,
John Morse,
Marco Petasecca,
Herwig Requardt,
Anatoly Rosenfeld,
Dieter Röhrich,
Heidi Sandaker,
Murielle Salomé,
Bjarne Stugu
Abstract:
Microbeam Radiation Therapy (MRT) is an emerging cancer treatment that is currently being developed at the European Synchrotron Radiation Facility (ESRF) in Grenoble, France. This technique uses a highly collimated and fractionated X-ray beam array with extremely high dose rate and very small divergence, to benefit from the dose-volume effect, thus sparing healthy tissue. In case of any beam anoma…
▽ More
Microbeam Radiation Therapy (MRT) is an emerging cancer treatment that is currently being developed at the European Synchrotron Radiation Facility (ESRF) in Grenoble, France. This technique uses a highly collimated and fractionated X-ray beam array with extremely high dose rate and very small divergence, to benefit from the dose-volume effect, thus sparing healthy tissue. In case of any beam anomalies and system malfunctions, special safety measures must be installed, such as an emergency safety shutter that requires continuous monitoring of the beam intensity profile. Within the 3DMiMic project, a novel silicon strip detector that can tackle the special features of MRT, such as the extremely high spatial resolution and dose rate, has been developed to be part of the safety shutter system. The first prototypes have been successfully fabricated, and experiments aimed to demonstrate their suitability for this unique application have been performed. Design, fabrication and the experimental results as well as any identified inadequacies for future optimisation are reported and discussed in this paper.
△ Less
Submitted 29 September, 2015;
originally announced September 2015.
-
Testbeam and Laboratory Characterization of CMS 3D Pixel Sensors
Authors:
M. Bubna,
E. Alagoz,
A. Krzywda,
O. Koybasi,
K. Arndt,
D. Bortoletto,
I. Shipsey,
G. Bolla,
A. Kok,
T. -E. Hansen,
T. A. Hansen,
G. U. Jensen,
J. M. Brom,
M. Boscardin,
J. Chramowicz,
J. Cumalat,
G. F. Dalla Betta,
M. Dinardo,
A. Godshalk,
M. Jones,
M. D. Krohn,
A. Kumar,
C. M. Lei,
L. Moroni,
L. Perera
, et al. (10 additional authors not shown)
Abstract:
The pixel detector is the innermost tracking device in CMS, reconstructing interaction vertices and charged particle trajectories. The sensors located in the innermost layers of the pixel detector must be upgraded for the ten-fold increase in luminosity expected with the High- Luminosity LHC (HL-LHC) phase. As a possible replacement for planar sensors, 3D silicon technology is under consideration…
▽ More
The pixel detector is the innermost tracking device in CMS, reconstructing interaction vertices and charged particle trajectories. The sensors located in the innermost layers of the pixel detector must be upgraded for the ten-fold increase in luminosity expected with the High- Luminosity LHC (HL-LHC) phase. As a possible replacement for planar sensors, 3D silicon technology is under consideration due to its good performance after high radiation fluence. In this paper, we report on pre- and post- irradiation measurements for CMS 3D pixel sensors with different electrode configurations. The effects of irradiation on electrical properties, charge collection efficiency, and position resolution of 3D sensors are discussed. Measurements of various test structures for monitoring the fabrication process and studying the bulk and surface properties, such as MOS capacitors, planar and gate-controlled diodes are also presented.
△ Less
Submitted 30 April, 2014; v1 submitted 25 February, 2014;
originally announced February 2014.
-
Characterization of proton irradiated 3D-DDTC pixel sensor prototypes fabricated at FBK
Authors:
A. La Rosa,
M. Boscardin,
M. Cobal,
G. -F. Dalla Betta,
C. Da Via,
G. Darbo,
C. Gallrapp,
C. Gemme,
F. Huegging,
J. Janssen,
A. Micelli,
H. Pernegger,
M. Povoli,
N. Wermes,
N. Zorzi
Abstract:
In this paper we discuss results relevant to 3D Double-Side Double Type Column (3D-DDTC) pixel sensors fabricated at FBK (Trento, Italy) and oriented to the ATLAS upgrade. Some assemblies of these sensors featuring different columnar electrode configurations (2, 3, or 4 columns per pixel) and coupled to the ATLAS FEI3 read-out chip were irradiated up to large proton fluences and tested in laborato…
▽ More
In this paper we discuss results relevant to 3D Double-Side Double Type Column (3D-DDTC) pixel sensors fabricated at FBK (Trento, Italy) and oriented to the ATLAS upgrade. Some assemblies of these sensors featuring different columnar electrode configurations (2, 3, or 4 columns per pixel) and coupled to the ATLAS FEI3 read-out chip were irradiated up to large proton fluences and tested in laboratory with radioactive sources. In spite of the non optimized columnar electrode overlap, sensors exhibit reasonably good charge collection properties up to an irradiation fluence of 2 x 10**15 neq/cm2, while requiring bias voltages in the order of 100 V. Sensor operation is further investigated by means of TCAD simulations which can effectively explain the basic mechanisms responsible for charge loss after irradiation.
△ Less
Submitted 19 March, 2012; v1 submitted 13 December, 2011;
originally announced December 2011.
-
Functional characterization of irradiated 3D-DDTC pixel sensor prototypes fabricated at FBK
Authors:
A. La Rosa,
M. Boscardin,
M. Cobal,
C. Da Viá,
G. F. Dalla Betta,
G. Darbo,
C. Gallrapp,
C. Gemme,
F. Huegging,
J. Janssen,
A. Micelli,
H. Pernegger,
M. Povoli,
N. Wermes,
N. Zorzi
Abstract:
In this paper we discuss results relevant to 3D Double-Side Double Type Column (3D-DDTC) pixel sensors fabricated at FBK (Trento, Italy) and oriented to the ATLAS upgrade.
In this paper we discuss results relevant to 3D Double-Side Double Type Column (3D-DDTC) pixel sensors fabricated at FBK (Trento, Italy) and oriented to the ATLAS upgrade.
△ Less
Submitted 9 December, 2011; v1 submitted 25 August, 2011;
originally announced August 2011.
-
Test Beam Results of 3D Silicon Pixel Sensors for the ATLAS upgrade
Authors:
ATLAS 3D Collaboration,
P. Grenier,
G. Alimonti,
M. Barbero,
R. Bates,
E. Bolle,
M. Borri,
M. Boscardin,
C. Buttar,
M. Capua,
M. Cavalli-Sforza,
M. Cobal,
A. Cristofoli,
G-F. Dalla Betta,
G. Darbo,
C. Da Vià,
E. Devetak,
B. DeWilde,
B. Di Girolamo,
D. Dobos,
K. Einsweiler,
D. Esseni,
S. Fazio,
C. Fleta,
J. Freestone
, et al. (68 additional authors not shown)
Abstract:
Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC)) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS Inner Detector solenoid field. Sen…
▽ More
Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC)) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS Inner Detector solenoid field. Sensors were bump bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlap** bias and read-out electrodes were tested and showed comparable performance.
△ Less
Submitted 21 January, 2011;
originally announced January 2011.
-
Characterization of 3D-DDTC detectors on p-type substrates
Authors:
G. -F. Dalla Betta,
M. Boscardin,
L. Bosisio,
G. Darbo,
P. Gabos,
C. Gemme,
M. Koehler,
A. La Rosa,
U. Parzefall,
H. Pernegger,
C. Piemonte,
M. Povoli,
I. Rachevskaia,
S. Ronchin,
L. Wiik,
A. Zoboli,
N. Zorzi
Abstract:
We report on the electrical and functional characterization of 3D Double-side, Double-Type-Column (3D- DDTC) detectors fabricated on p-type substrates. Results relevant to detectors in the diode, strip and pixel configurations are presented, and demonstrate a clear improvement in the charge collection performance compared to the first prototypes of these detectors.
We report on the electrical and functional characterization of 3D Double-side, Double-Type-Column (3D- DDTC) detectors fabricated on p-type substrates. Results relevant to detectors in the diode, strip and pixel configurations are presented, and demonstrate a clear improvement in the charge collection performance compared to the first prototypes of these detectors.
△ Less
Submitted 25 November, 2009;
originally announced November 2009.
-
Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade
Authors:
A. La Rosa,
M. Boscardin,
G. -F. Dalla Betta,
G. Darbo,
C. Gemme,
H. Pernegger,
C. Piemonte,
M. Povoli,
S. Ronchin,
A. Zoboli,
N. Zorzi,
E. Bolle,
M. Borri,
C. Da Via,
S. Dong,
S. Fazio,
P. Grenier,
S. Grinstein,
H. Gjersdal,
P. Hansson,
F. Huegging,
P. Jackson,
M. Kocian,
F. Rivero,
O. Rohne
, et al. (7 additional authors not shown)
Abstract:
3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a 180GeV pion beam at CERN SPS. The substrate thickness of the sensors is about 200um, and different column depths are available, with overlaps between junction c…
▽ More
3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a 180GeV pion beam at CERN SPS. The substrate thickness of the sensors is about 200um, and different column depths are available, with overlaps between junction columns (etched from the front side) and ohmic columns (etched from the back side) in the range from 110um to 150um. The devices under test were bump bonded to the ATLAS Pixel readout chip (FEI3) at SELEX SI (Rome, Italy). We report leakage current and noise measurements, results of functional tests with Am241 gamma-ray sources, charge collection tests with Sr90 beta-source and an overview of preliminary results from the CERN beam test.
△ Less
Submitted 20 October, 2009;
originally announced October 2009.
-
Development of 3D-DDTC pixel detectors for the ATLAS upgrade
Authors:
G. -F. Dalla Betta,
M. Boscardin,
G. Darbo,
C. Gemme,
A. La Rosa,
H. Pernegger,
C. Piemonte,
M. Povoli,
S. Ronchin,
A. Zoboli,
N. Zorzi
Abstract:
We report on the development of n-on-p, 3D Double-Side Double Type Column (3D-DDTC) pixel detectors fabricated at FBK-irst (Trento, Italy) and oriented to the ATLAS upgrade. The considered fabrication technology is simpler than that required for full 3D detectors with active edge, but the detector efficiency and radiation hardness critically depend on the columnar electrode overlap and should be…
▽ More
We report on the development of n-on-p, 3D Double-Side Double Type Column (3D-DDTC) pixel detectors fabricated at FBK-irst (Trento, Italy) and oriented to the ATLAS upgrade. The considered fabrication technology is simpler than that required for full 3D detectors with active edge, but the detector efficiency and radiation hardness critically depend on the columnar electrode overlap and should be carefully evaluated. The first assemblies of these sensors (featuring 2, 3, or 4 columns per pixel) with the ATLAS FEI3 read-out chip have been tested in laboratory. Selected results from the electrical and functional characterization with radioactive sources are here discussed.
△ Less
Submitted 19 October, 2009;
originally announced October 2009.
