-
Experimental set-up for thermal measurements at the nanoscale using an SThM probe with niobium nitride thermometer
Authors:
R. Swami,
G. Julie,
S. Le-Denmat,
G. Pernot,
D. Singhal,
J. Paterson,
J. Maire,
J. F. Motte,
N. Paillet,
H. Guillou,
S. Gomes,
O. Bourgeois
Abstract:
Scanning Thermal Microscopy (SThM) has become an important measurement tool for characterizing the thermal properties of materials at the nanometer scale. This technique requires a SThM probe that combines an Atomic Force Microscopy (AFM) probe and a very sensitive resistive thermometry; the thermometer being located at the apex of the probe tip allows the map** of temperature or thermal propert…
▽ More
Scanning Thermal Microscopy (SThM) has become an important measurement tool for characterizing the thermal properties of materials at the nanometer scale. This technique requires a SThM probe that combines an Atomic Force Microscopy (AFM) probe and a very sensitive resistive thermometry; the thermometer being located at the apex of the probe tip allows the map** of temperature or thermal properties of nanostructured materials with very high spatial resolution. The high interest of the SThM technique in the field of thermal nanoscience currently suffers from a low temperature sensitivity despite its high spatial resolution. To address this challenge, we developed a high vacuum-based AFM system hosting a highly sensitive niobium nitride (NbN) SThM probe to demonstrate its unique performance. As a proof of concept, we utilized this custom-built system to carry out thermal measurements using the 3$ω$ method. By measuring the $V_{3ω}$ voltage on the NbN resistive thermometer in vacuum conditions we were able to determine the SThM probe's thermal conductance and thermal time constant. The performance of the probe is demonstrated by doing thermal measurements in-contact with a sapphire sample.
△ Less
Submitted 30 April, 2024; v1 submitted 8 March, 2024;
originally announced March 2024.
-
Molecular dynamics simulation of thermal transport across solid/liquid interface created by meniscus
Authors:
Liudmyla Klochko,
Viktor Mandrolko,
Guillaume Castanet,
Gilles Pernot,
Fabrice Lemoine,
Konstantinos Termentzidis,
David Lacroix,
Mykola Isaiev
Abstract:
Understandings heat transfer across a solid/liquid interface is important to develop new pathways to improve thermal management in various energy applications. One of the important questions that arises in this context is the impact of three-phase contact line between solid, liquid and gas on the perturbations of the heat fluxes at the nanoscale. Therefore, this paper is devoted to the investigati…
▽ More
Understandings heat transfer across a solid/liquid interface is important to develop new pathways to improve thermal management in various energy applications. One of the important questions that arises in this context is the impact of three-phase contact line between solid, liquid and gas on the perturbations of the heat fluxes at the nanoscale. Therefore, this paper is devoted to the investigations of features of thermal transport across nanosized meniscus constrained between two solid walls. Different wetting states of the meniscus were considered with molecular dynamics approach by the variation of the interactional potential between atoms of the substrate and the liquid. The effect of the size of the meniscus on the exchange of energy between two solid walls was also investigated. It was shown that the presence of a three phase contact line leads to a decrease of the interfacial boundary resistance between solid and liquid. Further, investigations with the finite element method were used to link atomistic simulations with the continuum mechanics. We demonstrate that the wetting angle and the interfacial boundary resistance are the required key-parameters to perform multiscale simulations of such engineering problems with an accurate microscale parametrization.
△ Less
Submitted 22 October, 2021;
originally announced October 2021.
-
Frequency domain measurements of thermal properties using 3omega-Scanning Thermal Microscope in a vacuum environment
Authors:
Gilles Pernot,
Anas Metjari,
Hadrien Chaynes,
Mathieu Weber,
Mykola Isaiev,
David Lacroix
Abstract:
Material thermal properties characterization at nanoscales remains a challenge even if progresses were done in develo** specific characterization techniques like the Scanning Thermal Microscopy (SThM). In the present work, we propose a detailed procedure based on the combined use of a SThM probe characterization and its Finite Element Modeling (FEM) to recover in-operando 3omega measurements ach…
▽ More
Material thermal properties characterization at nanoscales remains a challenge even if progresses were done in develo** specific characterization techniques like the Scanning Thermal Microscopy (SThM). In the present work, we propose a detailed procedure based on the combined use of a SThM probe characterization and its Finite Element Modeling (FEM) to recover in-operando 3omega measurements achieved under high vacuum. This approach is based on a two-step methodology: (i) a fine description of the probe s electrical and frequency behaviors in out of contact mode to determine intrinsic parameters of the SThM tip, (b) a minimization of the free parameter of our model, i.e. the contact thermal resistance, by comparing 3omega measurements to our simulations of the probe operating in contact mode. Such an approach allows us to accurately measure thermal interface resistances of the probe as a function of the strength applied between the tip and the surface for three different materials (silicon, silica and gold). In addition, FEM modeling provides insights about the 3omega-SThM technique sensitivity, as a function of probe / sample interface resistance to measure material thermal conductivity, paving the way to quantitative SThM measurements.
△ Less
Submitted 9 July, 2020;
originally announced July 2020.
-
Enhanced thermal conductivity in percolating nanocomposites: a molecular dynamics investigation
Authors:
Konstantinos Termentzidis,
Valentina M. Giordano,
Maria Katsikini,
Eleni C. Paloura,
Gilles Pernot,
David Lacroix,
Ioannis Karakostas,
Joseph Kioseoglou
Abstract:
In this work we present a molecular dynamics investigation of thermal transport in a silica-gallium nitride nanocomposite. A surprising enhancement of the thermal conductivity for crystalline volume fractions larger than 5% is found, which cannot be predicted by an effective medium approach, not even including percolation effects, the model systematically leading to an underestimation of the effec…
▽ More
In this work we present a molecular dynamics investigation of thermal transport in a silica-gallium nitride nanocomposite. A surprising enhancement of the thermal conductivity for crystalline volume fractions larger than 5% is found, which cannot be predicted by an effective medium approach, not even including percolation effects, the model systematically leading to an underestimation of the effective thermal conductivity. The behavior can instead be reproduced if an effective volume fraction twice larger than the real one is assumed, which translates in a percolation effect surprisingly stronger than the usual one. Such scenario can be understood in terms of a phonon tunneling between inclusions, enhanced by the iso-orientation of all particles. Indeed, if a misorientation is introduced, the thermal conductivity strongly decreases. We also show that a percolating nanocomposite clearly stand in a different position than other nanocomopsites, where thermal transport is domimnated by the interface scattering, and where parameters such as the interface density play a major role, differently from our case.
△ Less
Submitted 19 October, 2018;
originally announced October 2018.
-
Superdiffusive heat conduction in semiconductor alloys -- II. Truncated Lévy formalism for experimental analysis
Authors:
Bjorn Vermeersch,
Amr M. S. Mohammed,
Gilles Pernot,
Yee Rui Koh,
Ali Shakouri
Abstract:
Nearly all experimental observations of quasi-ballistic heat flow are interpreted using Fourier theory with modified thermal conductivity. Detailed Boltzmann transport equation (BTE) analysis, however, reveals that the quasi-ballistic motion of thermal energy in semiconductor alloys is no longer Brownian but instead exhibits Lévy dynamics with fractal dimension $α< 2$. Here, we present a framework…
▽ More
Nearly all experimental observations of quasi-ballistic heat flow are interpreted using Fourier theory with modified thermal conductivity. Detailed Boltzmann transport equation (BTE) analysis, however, reveals that the quasi-ballistic motion of thermal energy in semiconductor alloys is no longer Brownian but instead exhibits Lévy dynamics with fractal dimension $α< 2$. Here, we present a framework that enables full 3D experimental analysis by retaining all essential physics of the quasi-ballistic BTE dynamics phenomenologically. A stochastic process with just two fitting parameters describes the transition from pure Lévy superdiffusion as short length and time scales to regular Fourier diffusion. The model provides accurate fits to time domain thermoreflectance raw experimental data over the full modulation frequency range without requiring any `effective' thermal parameters and without any a priori knowledge of microscopic phonon scattering mechanisms. Identified $α$ values for InGaAs and SiGe match ab initio BTE predictions within a few percent. Our results provide experimental evidence of fractal Lévy heat conduction in semiconductor alloys. The formalism additionally indicates that the transient temperature inside the material differs significantly from Fourier theory and can lead to improved thermal characterization of nanoscale devices and material interfaces.
△ Less
Submitted 25 September, 2014; v1 submitted 27 June, 2014;
originally announced June 2014.
