Further Developments in Gold-stud Bump Bonding
Authors:
C. Neher,
R. L. Lander,
A. Moskaleva,
J. Pasner,
M. Tripathi,
M. Woods
Abstract:
As silicon detectors in high energy physics experiments require increasingly complex assembly procedures, the availability of a wide variety of interconnect technologies provides more options for overcoming obstacles in generic R&D. Gold ball bonding has been a staple in the interconnect industry due to its ease of use and reliability. However, due to some limitations in the standard technique, al…
▽ More
As silicon detectors in high energy physics experiments require increasingly complex assembly procedures, the availability of a wide variety of interconnect technologies provides more options for overcoming obstacles in generic R&D. Gold ball bonding has been a staple in the interconnect industry due to its ease of use and reliability. However, due to some limitations in the standard technique, alternate methods of gold-stud bonding are being developed. This paper presents recent progress and challenges faced in the development of double gold-stud bonding and 0.5 mil wire gold-stud bonding at the UC Davis Facility for Interconnect Technology. Advantages and limitations of each technique are analyzed to provide insight into potential applications for each method. Optimization of procedures and parameters is also presented.
△ Less
Submitted 5 December, 2011;
originally announced December 2011.
Development of Readout Interconnections for the Si-W Calorimeter of SiD
Authors:
M. Woods,
R. G. Fields,
B. Holbrook,
R. L. Lander,
A. Moskaleva,
C. Neher,
J. Pasner,
M. Tripathi,
J. E. Brau,
R. E. Frey,
D. Strom,
M. Breidenbach,
D. Freytag,
G. Haller,
R. Herbst,
T. Nelson,
S. Schier,
B. Schumm
Abstract:
The SiD collaboration is develo** a Si-W sampling electromagnetic calorimeter, with anticipated application for the International Linear Collider. Assembling the modules for such a detector will involve special bonding technologies for the interconnections, especially for attaching a silicon detector wafer to a flex cable readout bus. We review the interconnect technologies involved, including o…
▽ More
The SiD collaboration is develo** a Si-W sampling electromagnetic calorimeter, with anticipated application for the International Linear Collider. Assembling the modules for such a detector will involve special bonding technologies for the interconnections, especially for attaching a silicon detector wafer to a flex cable readout bus. We review the interconnect technologies involved, including oxidation removal processes, pad surface preparation, solder ball selection and placement, and bond quality assurance. Our results show that solder ball bonding is a promising technique for the Si-W ECAL, and unresolved issues are being addressed.
△ Less
Submitted 21 November, 2011; v1 submitted 31 October, 2011;
originally announced October 2011.
