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Marsellus: A Heterogeneous RISC-V AI-IoT End-Node SoC with 2-to-8b DNN Acceleration and 30%-Boost Adaptive Body Biasing
Authors:
Francesco Conti,
Gianna Paulin,
Angelo Garofalo,
Davide Rossi,
Alfio Di Mauro,
Georg Rutishauser,
Gianmarco Ottavi,
Manuel Eggimann,
Hayate Okuhara,
Luca Benini
Abstract:
Emerging Artificial Intelligence-enabled Internet-of-Things (AI-IoT) System-on-a-Chip (SoC) for augmented reality, personalized healthcare, and nano-robotics need to run many diverse tasks within a power envelope of a few tens of mW over a wide range of operating conditions: compute-intensive but strongly quantized Deep Neural Network (DNN) inference, as well as signal processing and control requi…
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Emerging Artificial Intelligence-enabled Internet-of-Things (AI-IoT) System-on-a-Chip (SoC) for augmented reality, personalized healthcare, and nano-robotics need to run many diverse tasks within a power envelope of a few tens of mW over a wide range of operating conditions: compute-intensive but strongly quantized Deep Neural Network (DNN) inference, as well as signal processing and control requiring high-precision floating-point. We present Marsellus, an all-digital heterogeneous SoC for AI-IoT end-nodes fabricated in GlobalFoundries 22nm FDX that combines 1) a general-purpose cluster of 16 RISC-V Digital Signal Processing (DSP) cores attuned for the execution of a diverse range of workloads exploiting 4-bit and 2-bit arithmetic extensions (XpulpNN), combined with fused MAC&LOAD operations and floating-point support; 2) a 2-8bit Reconfigurable Binary Engine (RBE) to accelerate 3x3 and 1x1 (pointwise) convolutions in DNNs; 3) a set of On-Chip Monitoring (OCM) blocks connected to an Adaptive Body Biasing (ABB) generator and a hardware control loop, enabling on-the-fly adaptation of transistor threshold voltages. Marsellus achieves up to 180 Gop/s or 3.32 Top/s/W on 2-bit precision arithmetic in software, and up to 637 Gop/s or 12.4 Top/s/W on hardware-accelerated DNN layers.
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Submitted 28 November, 2023; v1 submitted 15 May, 2023;
originally announced May 2023.
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A Fully-Integrated 5mW, 0.8Gbps Energy-Efficient Chip-to-Chip Data Link for Ultra-Low-Power IoT End-Nodes in 65-nm CMOS
Authors:
Hayate Okuhara,
Ahmed Elnaqib,
Martino Dazzi,
Pierpaolo Palestri,
Simone Benatti,
Luca Benini,
Davide Rossi
Abstract:
The increasing complexity of Internet-of-Things (IoT) applications and near-sensor processing algorithms is pushing the computational power of low-power, battery-operated end-node systems. This trend also reveals growing demands for high-speed and energy-efficient inter-chip communications to manage the increasing amount of data coming from off-chip sensors and memories. While traditional micro-co…
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The increasing complexity of Internet-of-Things (IoT) applications and near-sensor processing algorithms is pushing the computational power of low-power, battery-operated end-node systems. This trend also reveals growing demands for high-speed and energy-efficient inter-chip communications to manage the increasing amount of data coming from off-chip sensors and memories. While traditional micro-controller interfaces such as SPIs cannot cope with tight energy and large bandwidth requirements, low-voltage swing transceivers can tackle this challenge thanks to their capability to achieve several Gbps of the communication speed at milliwatt power levels. However, recent research on high-speed serial links focused on high-performance systems, with a power consumption significantly larger than the one of low-power IoT end-nodes, or on stand-alone designs not integrated at a system level. This paper presents a low-swing transceiver for the energy-efficient and low power chip-to-chip communication fully integrated within an IoT end-node System-on-Chip, fabricated in CMOS 65nm technology. The transceiver can be easily controlled via a software interface; thus, we can consider realistic scenarios for the data communication, which cannot be assessed in stand-alone prototypes. Chip measurements show that the transceiver achieves 8.46x higher energy efficiency at 15.9x higher performance than a traditional microcontroller interface such as a single-SPI.
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Submitted 4 September, 2021;
originally announced September 2021.
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An Energy-Efficient Low-Voltage Swing Transceiver for mW-Range IoT End-Nodes
Authors:
Hayate Okuhara,
Ahmed Elnaqib,
Davide Rossi,
Alfio Di Mauro,
Philipp Mayer,
Pierpaolo Palestri,
Luca Benini
Abstract:
As the Internet-of-Things (IoT) applications become more and more pervasive, IoT end nodes are requiring more and more computational power within a few mW of power envelope, coupled with high-speed and energy-efficient inter-chip communication to deal with the growing input/output and memory bandwidth for emerging near-sensor analytics applications. While traditional interfaces such as SPI cannot…
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As the Internet-of-Things (IoT) applications become more and more pervasive, IoT end nodes are requiring more and more computational power within a few mW of power envelope, coupled with high-speed and energy-efficient inter-chip communication to deal with the growing input/output and memory bandwidth for emerging near-sensor analytics applications. While traditional interfaces such as SPI cannot cope with these tight requirements, low-voltage swing transceivers can tackle this challenge thanks to their capability to achieve several Gbps of bandwidth at extremely low power. However, recent research on high-speed serial links addressed this challenge only partially, proposing only partial or stand-alone designs, and not addressing their integration in real systems and the related implications. In this paper, we present for the first time a complete design and system-level architecture of a low-voltage swing transceiver integrated within a low-power (mW range) IoT end-node processors, and we compare it with existing microcontroller interfaces. The transceiver, implemented in a commercial 65-nm CMOS technology achieves 10.2x higher energy efficiency at 15.7x higher performance than traditional microcontroller peripherals (single lane).
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Submitted 9 October, 2020;
originally announced October 2020.
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A 0.5GHz 0.35mW LDO-Powered Constant-Slope Phase Interpolator with 0.22$\%$ INL
Authors:
Ahmed Elnaqib,
Hayate Okuhara,
Taekwang Jang,
Davide Rossi,
Luca Benini
Abstract:
Clock generators are an essential and critical building block of any communication link, whether it be wired or wireless, and they are increasingly critical given the push for lower I/O power and higher bandwidth in Systems-on-Chip (SoCs) for the Internet-of-Things (IoT). One recurrent issue with clock generators is multiple-phase generation, especially for low-power applications; several methods…
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Clock generators are an essential and critical building block of any communication link, whether it be wired or wireless, and they are increasingly critical given the push for lower I/O power and higher bandwidth in Systems-on-Chip (SoCs) for the Internet-of-Things (IoT). One recurrent issue with clock generators is multiple-phase generation, especially for low-power applications; several methods of phase generation have been proposed, one of which is phase interpolation. We propose a phase interpolator (PI) that employs the concept of constant-slope operation. Consequently, a low-power highly-linear operation is coupled with the wide dynamic range (i.e. phase wrap**) capabilities of a PI. Furthermore, the PI is powered by a low-dropout regulator (LDO) supporting fast transient operation. Implemented in 65-nm CMOS technology, it consumes 350$μ$W at a 1.2-V supply and a 0.5-GHz clock; it achieves energy efficiency 4$\times$-15$\times$ lower than state-of-the-art (SoA) digital-to-time converters (DTCs) and an integral non-linearity (INL) of 2.5$\times$-3.1$\times$ better than SoA PIs, striking a good balance between linearity and energy efficiency.
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Submitted 15 July, 2020;
originally announced July 2020.
