Thermal insulation and heat guiding using nanopatterned MoS2
Authors:
Peng Xiao,
Alexandros El Sachat,
Emigdio Chávez Angel,
Giorgos Nikoulis,
Joseph Kioseoglou,
Konstantinos Termentzidis,
Clivia M. Sotomayor Torres,
Marianna Sledzinska
Abstract:
In the modern electronics overheating is one of the major reasons for device failure. Overheating causes irreversible damage to circuit components and can also lead to fire, explosions, and injuries. Accordingly, in the advent of 2D material-based electronics, an understanding of their thermal properties in addition to their electric ones is crucial to enable efficient transfer of excess heat away…
▽ More
In the modern electronics overheating is one of the major reasons for device failure. Overheating causes irreversible damage to circuit components and can also lead to fire, explosions, and injuries. Accordingly, in the advent of 2D material-based electronics, an understanding of their thermal properties in addition to their electric ones is crucial to enable efficient transfer of excess heat away from the electronic components. In this work we propose structures based on free-standing, few-layer, nanopatterned MoS2 that insulate and guide heat in the in-plane direction. We arrive at these designs via a thorough study of the in-plane thermal conductivity as a function of thickness, porosity, and temperature in both pristine and nanopatterned MoS2 membranes. Two-laser Raman thermometry was employed to measure the thermal conductivities of a set of free-standing MoS2 flakes with diameters greater than 20 um and thicknesses from 5 to 40 nm, resulting in values from 30 to 85 W/mK, respectively. After nanopatterning a square lattice of 100-nm diameter holes with a focused ion beam we have obtained a greater than 10-fold reduction of the thermal conductivities for the period of 500 nm and values below 1 W/mK for the period of 300 nm. The results were supported by equilibrium molecular dynamic simulations for both pristine and nanopatterned MoS2. The selective patterning of certain areas results in extremely large difference in thermal conductivities within the same material. Exploitation of this effect enabled for the first time thermal insulation and heat guiding in the few-layer MoS2. The patterned regions act as high thermal resistors: we obtained a thermal resistance of 4x10-6 m2K/W with only four patterned lattice periods of 300 nm, highlighting the significant potential of MoS2 for thermal management applications.
△ Less
Submitted 11 April, 2022;
originally announced April 2022.
Multiscale machine-learning interatomic potentials for ferromagnetic and liquid iron
Authors:
Jesper Byggmästar,
Giorgos Nikoulis,
Aslak Fellman,
Fredric Granberg,
Flyura Djurabekova,
Kai Nordlund
Abstract:
We develop and compare four interatomic potentials for iron: a simple machine-learned embedded atom method (EAM) potential, a potential with machine-learned two- and three-body-dependent terms, a potential with machine-learned EAM and three-body terms, and a Gaussian approximation potential with the SOAP descriptor. All potentials are trained to the same diverse database of body-centered cubic and…
▽ More
We develop and compare four interatomic potentials for iron: a simple machine-learned embedded atom method (EAM) potential, a potential with machine-learned two- and three-body-dependent terms, a potential with machine-learned EAM and three-body terms, and a Gaussian approximation potential with the SOAP descriptor. All potentials are trained to the same diverse database of body-centered cubic and liquid structures computed with density functional theory. The four presented potentials represent different levels of complexity and span three orders of magnitude in computational cost. The first three potentials are tabulated and evaluated efficiently using cubic spline interpolations, while the fourth one is implemented without additional optimization. We compare and discuss the advantages of each implementation, transferability and applicability in terms of the balance between required accuracy versus computational cost.
△ Less
Submitted 25 January, 2022;
originally announced January 2022.