Showing 1–7 of 7 results for author: Mulargia, R

First test beam measurement of the 4D resolution of an RSD 450 microns pitch pixel matrix connected to a FAST2 ASIC

Authors: L. Menzio, F. Siviero, R. Arcidiacono, N. Cartiglia, M. Costa, T. Croci, M. Ferrero, C. Hanna, L. Lanteri, S. Mazza, R. Mulargiaa, H-F W. Sadrozinski, A. Seiden, V. Sola, R. Whitea, M. Wilder

Abstract: This paper reports on the spatial and temporal resolutions of an RSD 450 microns pitch pixels array measured at the DESY test beam facility. RSDs, Resistive Silicon Detectors, also known as AC-LGAD, achieve excellent position and temporal resolution by exploiting charge sharing among neighboring electrodes. The RSD matrix used in this study is part of the second FBK RSD production, RSD2, and it is… ▽ More This paper reports on the spatial and temporal resolutions of an RSD 450 microns pitch pixels array measured at the DESY test beam facility. RSDs, Resistive Silicon Detectors, also known as AC-LGAD, achieve excellent position and temporal resolution by exploiting charge sharing among neighboring electrodes. The RSD matrix used in this study is part of the second FBK RSD production, RSD2, and it is composed of 450 microns pitch pixel with cross-shaped electrodes. A 7-pixel matrix was read out by the FAST2 ASIC, a 16-channel amplifier fully custom ASIC developed by INFN Torino using the 110 nm CMOS technology. The total area covered by the matrix is about 1.5 mm$^2$. The position resolution reached in this test is 15 microns, about 4\% of the pitch. The temporal resolution achieved in this work is 60 ps, dominated by the FAST2 resolution. The work also demonstrates that RSD sensors with cross-shaped electrodes achieve 100% fill factor and homogenous resolutions over the whole matrix surface, making them a suitable choice for 4D tracking applications. △ Less

Submitted 17 February, 2024; v1 submitted 2 February, 2024; originally announced February 2024.

Comments: 33 pages, 21 figures

Resistive Read-out in Thin Silicon Sensors with Internal Gain

Authors: N. Cartiglia, F. Moscatelli, R. Arcidiacono, P. Asenov, M. Costa, T. Croci, M. Ferrero, A. Fondacci, L. Lanteri, L. Menzio, A. Morozzi, R. Mulargia, D. Passeri, F. Siviero, V. Sola, M. Tornago

Abstract: Two design innovations, low-gain avalanche (Low-Gain Avalance Diode, LGAD) and resistive read-out (Resistive Silicon Detector, RSD), have brought strong performance improvements to silicon sensors. Large signals, due to the added gain mechanism, lead to improved temporal precision, while charge sharing, introduced by resistive read-out, allows for achieving excellent spatial resolution even with l… ▽ More Two design innovations, low-gain avalanche (Low-Gain Avalance Diode, LGAD) and resistive read-out (Resistive Silicon Detector, RSD), have brought strong performance improvements to silicon sensors. Large signals, due to the added gain mechanism, lead to improved temporal precision, while charge sharing, introduced by resistive read-out, allows for achieving excellent spatial resolution even with large pixels. LGAD- and RSD- based silicon sensors are now adopted, or considered, in several future experiments and are the basis for almost every next 4D-trackers. New results obtained with sensors belonging to the second FBK production of RSD (RSD2) demonstrate how a combined resolution of 30 ps and 30 \microns can be obtained with pixels as large as $1 \times 1 $ mm$^2$. △ Less

Submitted 7 January, 2023; originally announced January 2023.

Comments: 8 pages, 7 figures

High-Precision 4D Tracking with Large Pixels using Thin Resistive Silicon Detectors

Authors: R. Arcidiacono, G. Borghi, M. Boscardin, N. Cartiglia, M. Centis Vignali, M. Costa, G-F. Dalla Betta, M. Ferrero, F. Ficorella, G. Gioachin, L. Lanteri, M. Mandurrino, L. Menzio, R. Mulargia, L. Pancheri, G. Paternoster, A. Rojas, H-F W. Sadrozinski, A. Seiden, F. Siviero, V. Sola, M. Tornago

Abstract: The basic principle of operation of silicon sensors with resistive read-out is built-in charge sharing. Resistive Silicon Detectors (RSD, also known as AC-LGAD), exploiting the signals seen on the electrodes surrounding the impact point, achieve excellent space and time resolutions even with very large pixels. In this paper, a TCT system using a 1064 nm picosecond laser is used to characterize sen… ▽ More The basic principle of operation of silicon sensors with resistive read-out is built-in charge sharing. Resistive Silicon Detectors (RSD, also known as AC-LGAD), exploiting the signals seen on the electrodes surrounding the impact point, achieve excellent space and time resolutions even with very large pixels. In this paper, a TCT system using a 1064 nm picosecond laser is used to characterize sensors from the second RSD production at the Fondazione Bruno Kessler. The paper first introduces the parametrization of the errors in the determination of the position and time coordinates in RSD, then outlines the reconstruction method, and finally presents the results. Three different pixel sizes are used in the analysis: 200 x 340, 450 x 450, and 1300 x 1300 microns^2. At gain = 30, the 450 x 450 microns^2 pixel achieves a time jitter of 20 ps and a spatial resolution of 15 microns concurrently, while the 1300 x 1300 microns^2 pixel achieves 30 ps and 30 micron, respectively. The implementation of cross-shaped electrodes improves considerably the response uniformity over the pixel surface. △ Less

Submitted 24 November, 2022; originally announced November 2022.

Comments: 28 pages, 23 figures submitted to NIMA

Test beam characterization of sensor prototypes for the CMS Barrel MIP Timing Detector

Authors: R. Abbott, A. Abreu, F. Addesa, M. Alhusseini, T. Anderson, Y. Andreev, A. Apresyan, R. Arcidiacono, M. Arenton, E. Auffray, D. Bastos, L. A. T. Bauerdick, R. Bellan, M. Bellato, A. Benaglia, M. Benettoni, R. Bertoni, M. Besancon, S. Bharthuar, A. Bornheim, E. Brücken, J. N. Butler, C. Campagnari, M. Campana, R. Carlin , et al. (174 additional authors not shown)

Abstract: The MIP Timing Detector will provide additional timing capabilities for detection of minimum ionizing particles (MIPs) at CMS during the High Luminosity LHC era, improving event reconstruction and pileup rejection. The central portion of the detector, the Barrel Timing Layer (BTL), will be instrumented with LYSO:Ce crystals and Silicon Photomultipliers (SiPMs) providing a time resolution of about… ▽ More The MIP Timing Detector will provide additional timing capabilities for detection of minimum ionizing particles (MIPs) at CMS during the High Luminosity LHC era, improving event reconstruction and pileup rejection. The central portion of the detector, the Barrel Timing Layer (BTL), will be instrumented with LYSO:Ce crystals and Silicon Photomultipliers (SiPMs) providing a time resolution of about 30 ps at the beginning of operation, and degrading to 50-60 ps at the end of the detector lifetime as a result of radiation damage. In this work, we present the results obtained using a 120 GeV proton beam at the Fermilab Test Beam Facility to measure the time resolution of unirradiated sensors. A proof-of-concept of the sensor layout proposed for the barrel region of the MTD, consisting of elongated crystal bars with dimensions of about 3 x 3 x 57 mm$^3$ and with double-ended SiPM readout, is demonstrated. This design provides a robust time measurement independent of the impact point of the MIP along the crystal bar. We tested LYSO:Ce bars of different thickness (2, 3, 4 mm) with a geometry close to the reference design and coupled to SiPMs manufactured by Hamamatsu and Fondazione Bruno Kessler. The various aspects influencing the timing performance such as the crystal thickness, properties of the SiPMs (e.g. photon detection efficiency), and impact angle of the MIP are studied. A time resolution of about 28 ps is measured for MIPs crossing a 3 mm thick crystal bar, corresponding to an MPV energy deposition of 2.6 MeV, and of 22 ps for the 4.2 MeV MPV energy deposition expected in the BTL, matching the detector performance target for unirradiated devices. △ Less

Submitted 16 July, 2021; v1 submitted 15 April, 2021; originally announced April 2021.

Journal ref: Journal of Instrumentation, Volume 16, July 2021

Intrinsic time resolution of 3D-trench silicon pixels for charged particle detection

Authors: Lucio Anderlini, Mauro Aresti, Andrea Bizzeti, Maurizio Boscardin, Alessandro Cardini, Gian-Franco Dalla Betta, Marco Ferrero, Giulio Forcolin, Michela Garau, Adriano Lai, Andrea Lampis, Angelo Loi, Chiara Lucarelli, Roberto Mendicino, Roberto Mulargia, Margherita Obertino, Enrico Robutti, Sabina Ronchin, Marta Ruspa, Stefania Vecchi

Abstract: In the last years, high-resolution time tagging has emerged as the tool to tackle the problem of high-track density in the detectors of the next generation of experiments at particle colliders. Time resolutions below 50ps and event average repetition rates of tens of MHz on sensor pixels having a pitch of 50$μ$m are typical minimum requirements. This poses an important scientific and technological… ▽ More In the last years, high-resolution time tagging has emerged as the tool to tackle the problem of high-track density in the detectors of the next generation of experiments at particle colliders. Time resolutions below 50ps and event average repetition rates of tens of MHz on sensor pixels having a pitch of 50$μ$m are typical minimum requirements. This poses an important scientific and technological challenge on the development of particle sensors and processing electronics. The TIMESPOT initiative (which stands for TIME and SPace real-time Operating Tracker) aims at the development of a full prototype detection system suitable for the particle trackers of the next-to-come particle physics experiments. This paper describes the results obtained on the first batch of TIMESPOT silicon sensors, based on a novel 3D MEMS (micro electro-mechanical systems) design. Following this approach, the performance of other ongoing silicon sensor developments has been matched and overcome, while using a technology which is known to be robust against radiation degradation. A time resolution of the order of 20ps has been measured at room temperature suggesting also possible improvements after further optimisations of the front-end electronics processing stage. △ Less

Submitted 29 July, 2020; v1 submitted 22 April, 2020; originally announced April 2020.

Comments: This version was accepted to be published on JINST on 21/07/2020

Test of Ultra Fast Silicon Detectors for Picosecond Time Measurements with a New Multipurpose Read-Out Board

Authors: Nicola Minafra, Hussein Al Ghoul, Roberta Arcidiacono, Nicolo Cartiglia, Laurent Forthomme, Roberto Mulargia, Maria Obertino, Christophe Royon

Abstract: Ultra Fast Silicon Detectors (UFSD) are sensors optimized for timing measurements employing a thin multiplication layer to increase the output signal. A multipurpose read-out board hosting a low-cost, low-power fast amplifier was designed at the University of Kansas and tested at the European Organization for Nuclear Research (CERN) using a 180 GeV pion beam. The amplifier has been designed to rea… ▽ More Ultra Fast Silicon Detectors (UFSD) are sensors optimized for timing measurements employing a thin multiplication layer to increase the output signal. A multipurpose read-out board hosting a low-cost, low-power fast amplifier was designed at the University of Kansas and tested at the European Organization for Nuclear Research (CERN) using a 180 GeV pion beam. The amplifier has been designed to read out a wide range of detectors and it was optimized in this test for the UFSD output signal. In this paper we report the results of the experimental tests using 50 $\rm{μm}$ thick UFSD with a sensitive area of 1.4 $\rm{mm^2}$. A timing precision below 30 ps was achieved. △ Less

Submitted 26 April, 2017; v1 submitted 18 April, 2017; originally announced April 2017.

Beam test results of a 16 ps timing system based on ultra-fast silicon detectors

Authors: N. Cartiglia, A. Staiano, V. Sola, R. Arcidiacono, R. Cirio, F. Cenna, M. Ferrero, V. Monaco, R. Mulargia, M. Obertino, F. Ravera, R. Sacchi, A. Bellora, S. Durando, M. Mandurrino, N. Minafra, V. Fadeyev, P. Freeman, Z. Galloway, E. Gkougkousis, H. Grabas, B. Gruey, C. A. Labitan, R. Losakul, Z. Luce , et al. (18 additional authors not shown)

Abstract: In this paper we report on the timing resolution of the first production of 50 micro-meter thick Ultra-Fast Silicon Detectors (UFSD) as obtained in a beam test with pions of 180 GeV/c momentum. UFSD are based on the Low-Gain Avalanche Detectors (LGAD) design, employing n-on-p silicon sensors with internal charge multiplication due to the presence of a thin, low-resistivity diffusion layer below th… ▽ More In this paper we report on the timing resolution of the first production of 50 micro-meter thick Ultra-Fast Silicon Detectors (UFSD) as obtained in a beam test with pions of 180 GeV/c momentum. UFSD are based on the Low-Gain Avalanche Detectors (LGAD) design, employing n-on-p silicon sensors with internal charge multiplication due to the presence of a thin, low-resistivity diffusion layer below the junction. The UFSD used in this test belongs to the first production of thin (50 μm) sensors, with an pad area of 1.4 mm2. The gain was measured to vary between 5 and 70 depending on the bias voltage. The experimental setup included three UFSD and a fast trigger consisting of a quartz bar readout by a SiPM. The timing resolution, determined comparing the time of arrival of the particle in one or more UFSD and the trigger counter, for single UFSD was measured to be 35 ps for a bias voltage of 200 V, and 26 ps for a bias voltage of 240 V, and for the combination of 3 UFSD to be 20 ps for a bias voltage of 200 V, and 15 ps for a bias voltage of 240 V. △ Less

Submitted 3 January, 2017; v1 submitted 30 August, 2016; originally announced August 2016.

Comments: 7 pages, 8 figures, 1 table, Subm. to NIM A

Journal ref: NIM A850, 1 April 2017, pages 83-88