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Aluminum Josephson junction microstructure and electrical properties modification with thermal annealing
Authors:
N. D. Korshakov,
D. O. Moskalev,
A. A. Soloviova,
D. A. Moskaleva,
E. S. Lotkov,
A. R. Ibragimov,
M. V. Androschuk,
I. A. Ryzhikov,
Y. V. Panfilov,
I. A. Rodionov
Abstract:
Superconducting qubits based on Al/AlOx/Al Josephson junction are one of the most promising candidates for the physical implementation of universal quantum computers. Due to scalability and compatibility with the state-of-the-art nanoelectronic processes one can fabricate hundreds of qubits on a single silicon chip. However, decoherence in these systems caused by two-level-systems in amorphous die…
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Superconducting qubits based on Al/AlOx/Al Josephson junction are one of the most promising candidates for the physical implementation of universal quantum computers. Due to scalability and compatibility with the state-of-the-art nanoelectronic processes one can fabricate hundreds of qubits on a single silicon chip. However, decoherence in these systems caused by two-level-systems in amorphous dielectrics, including a tunneling barrier AlOx, is one of the major problems. We report on a Josephson junction thermal annealing process development to crystallize an amorphous barrier oxide (AlOx). The dependences of the thermal annealing parameters on the room temperature resistance are obtained. The developed method allows not only to increase the Josephson junction resistance by 175%, but also to decrease by 60% with precisions of 10% in Rn. Finally, theoretical assumptions about the structure modification in tunnel barrier are proposed. The suggested thermal annealing approach can be used to form a stable and reproducible tunneling barriers and scalable frequency trimming for a widely used fixed-frequency transmon qubits.
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Submitted 4 March, 2024;
originally announced March 2024.
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Wafer-scale uniformity improvement of Dolan-bridge Josephson junction by shadow evaporation bias correction
Authors:
Daria A. Moskaleva,
Nikita D. Korshakov,
Dmitry O. Moskalev,
Anastasiya A. Solovyova,
Alexey R. Matanin,
Elizaveta I. Malevannaya,
Nikita S. Smirnov,
Maksim I. Teleganov,
Yuri V. Panfilov,
Ilya A. Rodionov
Abstract:
One of the practical limitations of solid-state superconducting quantum processors technology is frequency crowding due to low qubits fabrication reproducibility. Josephson junction 100 nm-scale nonlinear inductance of the qubits still suffers from Dolan-bridge shadow evaporation process. Here, we report on a robust wafer-scale Al/AlOx/Al Dolan-bridge Josephson junction (JJ) process using prelimin…
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One of the practical limitations of solid-state superconducting quantum processors technology is frequency crowding due to low qubits fabrication reproducibility. Josephson junction 100 nm-scale nonlinear inductance of the qubits still suffers from Dolan-bridge shadow evaporation process. Here, we report on a robust wafer-scale Al/AlOx/Al Dolan-bridge Josephson junction (JJ) process using preliminary shadow evaporation bias resist mask correction and comprehensive oxidation optimization. We introduce topology correction model for two-layer resist mask biasing at a wafer-scale, which takes into account an evaporation source geometry. It results in Josephson junction area variation coefficient improvement down to 1.1% for the critical dimensions from 130x170 nm2 to 130x670 nm2 over 70x70 mm2 (49 cm2) wafer working area. Next, we investigate JJ oxidation process (oxidation method, pressure and time) and its impact on a room temperature resistance reproducibility. Finally, we combine both shadow evaporation bias correction and oxidation best practices for 4-inch wafers improving room temperature resistance variation coefficient down to 6.0/5.2/4.1% for 0.025 μm2 JJ area and 4.0/3.4/2.3% for 0.090 μm2 JJ area for 49/25/16 cm2 wafer working area correspondingly. The proposed model and oxidation method can be useful for robust wafer-scale superconducting quantum processors fabrication.
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Submitted 15 April, 2024; v1 submitted 4 March, 2024;
originally announced March 2024.
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Solar wind parameters in rising phase of solar cycle 25
Authors:
Yuri I. Yermolaev,
Irina G. Lodkina,
Alexander A. Khokhlachev,
Michael Yu. Yermolaev,
Maria O. Riazantseva,
Liudmila S. Rakhmanova,
Natalia L. Borodkova,
Olga V. Sapunova,
Anastasiia V. Moskaleva
Abstract:
Solar activity and solar wind parameters decreased significantly in solar cycles (SCs) 23-24. In this paper, we analyze solar wind measurements at the rising phase of SC 25 and compare them with similar data from the previous cycles. For this purpose, we simultaneously selected the OMNI database data for 1976-2022, both by phases of the 11-year solar cycle and by large-scale solar wind types (in a…
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Solar activity and solar wind parameters decreased significantly in solar cycles (SCs) 23-24. In this paper, we analyze solar wind measurements at the rising phase of SC 25 and compare them with similar data from the previous cycles. For this purpose, we simultaneously selected the OMNI database data for 1976-2022, both by phases of the 11-year solar cycle and by large-scale solar wind types (in accordance with IKI's catalog, see http://www.iki.rssi.ru/pub/omni ), and calculated the mean values of the parameters for the selected datasets. The obtained results testify in favor of the hypothesis that the continuation of this cycle will be similar to the previous cycle 24, i.e. SC 25 will be weaker than SCs 21 and 22.
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Submitted 28 April, 2023;
originally announced April 2023.
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Dynamics of Large Scale Solar Wind Streams Obtained by the Double Superposed Epoch Analysis: 5. Influence of the Solar Activity Decrease
Authors:
Yuri I. Yermolaev,
Irina G. Lodkina,
Alexander A. Khokhlachev,
Michael Yu. Yermolaev,
Maria O. Riazantseva,
Liudmila S. Rakhmanova,
Natalia L. Borodkova,
Olga V. Sapunova,
Anastasiia V. Moskaleva
Abstract:
In solar cycles 23-24, solar activity noticeably decreased, and, as a result, solar wind parameters decreased. Based on the measurements of the OMNI base for the period 1976-2019, the time profiles of the main solar wind parameters and magnetospheric indices for the main interplanetary drivers of magnetospheric disturbances (solar wind types CIR, Sheath, ejecta and MC) are studied using the double…
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In solar cycles 23-24, solar activity noticeably decreased, and, as a result, solar wind parameters decreased. Based on the measurements of the OMNI base for the period 1976-2019, the time profiles of the main solar wind parameters and magnetospheric indices for the main interplanetary drivers of magnetospheric disturbances (solar wind types CIR, Sheath, ejecta and MC) are studied using the double superposed epoch method. The main task of the research is to compare time profiles for the epoch of high solar activity at 21-22 solar cycles and the epoch of low activity at 23-24 solar cycles. The following results were obtained. (1) The analysis did not show a statistically significant change in driver durations during the epoch of minimum. (2) The time profiles of all parameters for all types of SW in the epoch of low activity have the same shape as in the epoch of high activity, but locate at lower values of the parameters. (3) In CIR events, the longitude angle of the solar wind flow has a characteristic S-shape, but in the epoch of low activity it varies in a larger range than in the previous epoch.
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Submitted 9 August, 2022;
originally announced August 2022.
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Drop of solar wind at the end of the 20th century
Authors:
Yuri I. Yermolaev,
Irina G. Lodkina,
Alexander A. Khokhlachev,
Michael Yu. Yermolaev,
Maria O. Riazantseva,
Liudmila S. Rakhmanova,
Natalia L. Borodkova,
Olga V. Sapunova,
Anastasiia V. Moskaleva
Abstract:
Variations in the solar wind (SW) parameters with scales of several years are an important characteristic of solar activity and the basis for a long-term space weather forecast. We examine the behavior of interplanetary parameters over 21-24 solar cycles (SCs) on the basis of OMNI database (https://spdf.gsfc.nasa.gov/pub/data/omni). Since changes in parameters can be associated both with changes i…
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Variations in the solar wind (SW) parameters with scales of several years are an important characteristic of solar activity and the basis for a long-term space weather forecast. We examine the behavior of interplanetary parameters over 21-24 solar cycles (SCs) on the basis of OMNI database (https://spdf.gsfc.nasa.gov/pub/data/omni). Since changes in parameters can be associated both with changes in the number of different large-scale types of SW, and with variations in the values of these parameters at different phases of the solar cycle and during the transition from one cycle to another, we select the entire study period in accordance with the Catalog of large-scale SW types for 1976-2019 (See the site http://www.iki.rssi.ru/pub/omni, [Yermolaev et al., 2009]), which covers the period from 21 to 24 SCs, and in accordance with the phases of the cycles, and averaging the parameters at selected intervals. In addition to a sharp drop in the number of ICMEs (and associated Sheath types), there is a noticeable drop in the value (by 20-40%) of plasma parameters and magnetic field in different types of solar wind at the end of the 20th century and a continuation of the fall or persistence at a low level in the 23-24 cycles. Such a drop in the solar wind is apparently associated with a decrease in solar activity and manifests itself in a noticeable decrease in space weather factors.
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Submitted 23 May, 2021;
originally announced May 2021.
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Further Developments in Gold-stud Bump Bonding
Authors:
C. Neher,
R. L. Lander,
A. Moskaleva,
J. Pasner,
M. Tripathi,
M. Woods
Abstract:
As silicon detectors in high energy physics experiments require increasingly complex assembly procedures, the availability of a wide variety of interconnect technologies provides more options for overcoming obstacles in generic R&D. Gold ball bonding has been a staple in the interconnect industry due to its ease of use and reliability. However, due to some limitations in the standard technique, al…
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As silicon detectors in high energy physics experiments require increasingly complex assembly procedures, the availability of a wide variety of interconnect technologies provides more options for overcoming obstacles in generic R&D. Gold ball bonding has been a staple in the interconnect industry due to its ease of use and reliability. However, due to some limitations in the standard technique, alternate methods of gold-stud bonding are being developed. This paper presents recent progress and challenges faced in the development of double gold-stud bonding and 0.5 mil wire gold-stud bonding at the UC Davis Facility for Interconnect Technology. Advantages and limitations of each technique are analyzed to provide insight into potential applications for each method. Optimization of procedures and parameters is also presented.
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Submitted 5 December, 2011;
originally announced December 2011.
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Development of Readout Interconnections for the Si-W Calorimeter of SiD
Authors:
M. Woods,
R. G. Fields,
B. Holbrook,
R. L. Lander,
A. Moskaleva,
C. Neher,
J. Pasner,
M. Tripathi,
J. E. Brau,
R. E. Frey,
D. Strom,
M. Breidenbach,
D. Freytag,
G. Haller,
R. Herbst,
T. Nelson,
S. Schier,
B. Schumm
Abstract:
The SiD collaboration is develo** a Si-W sampling electromagnetic calorimeter, with anticipated application for the International Linear Collider. Assembling the modules for such a detector will involve special bonding technologies for the interconnections, especially for attaching a silicon detector wafer to a flex cable readout bus. We review the interconnect technologies involved, including o…
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The SiD collaboration is develo** a Si-W sampling electromagnetic calorimeter, with anticipated application for the International Linear Collider. Assembling the modules for such a detector will involve special bonding technologies for the interconnections, especially for attaching a silicon detector wafer to a flex cable readout bus. We review the interconnect technologies involved, including oxidation removal processes, pad surface preparation, solder ball selection and placement, and bond quality assurance. Our results show that solder ball bonding is a promising technique for the Si-W ECAL, and unresolved issues are being addressed.
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Submitted 21 November, 2011; v1 submitted 31 October, 2011;
originally announced October 2011.
