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Ferroelectric MirrorBit-Integrated Field-Programmable Memory Array for TCAM, Storage, and In-Memory Computing Applications
Authors:
Paritosh Meihar,
Rowtu Srinu,
Sandip Lashkare,
Ajay Kumar Singh,
Halid Mulaosmanovic,
Veeresh Deshpande,
Stefan Dünkel,
Sven Beyer,
Udayan Ganguly
Abstract:
In-memory computing on a reconfigurable architecture is the emerging field which performs an application-based resource allocation for computational efficiency and energy optimization. In this work, we propose a Ferroelectric MirrorBit-integrated field-programmable reconfigurable memory. We show the conventional 1-Bit FeFET, the MirrorBit, and MirrorBit-based Ternary Content-addressable memory (MC…
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In-memory computing on a reconfigurable architecture is the emerging field which performs an application-based resource allocation for computational efficiency and energy optimization. In this work, we propose a Ferroelectric MirrorBit-integrated field-programmable reconfigurable memory. We show the conventional 1-Bit FeFET, the MirrorBit, and MirrorBit-based Ternary Content-addressable memory (MCAM or MirrorBit-based TCAM) within the same field-programmable array. Apart from the conventional uniform Up and Down polarization states, the additional states in the MirrorBit are programmed by applying a non-uniform electric field along the transverse direction, which produces a gradient in the polarization and the conduction band energy. This creates two additional states, thereby, creating a total of 4 states or 2-bit of information. The gradient in the conduction band resembles a Schottky barrier (Schottky diode), whose orientation can be configured by applying an appropriate field. The TCAM operation is demonstrated using the MirrorBit-based diode on the reconfigurable array. The reconfigurable array architecture can switch from AND-type to NOR-type and vice-versa. The AND-type array is appropriate for programming the conventional bit and the MirrorBit. The MirrorBit-based Schottky diode in the NOR-array resembles a crossbar structure, which is appropriate for diode-based CAM operation. Our proposed memory system can enable fast write via 1-bit FeFET, the dense data storage capability by Mirror-bit technology and the fast search capability of the MCAM. Further, the dual configurability enables power, area and speed optimization making the reconfigurable Fe-Mirrorbit memory a compelling solution for In-memory and associative computing.
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Submitted 10 July, 2023;
originally announced July 2023.
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Evolution of ferroelectricity with annealing temperature and thickness in sputter deposited undoped HfO$_2$ on silicon
Authors:
Md Hanif Ali,
Adityanarayan Pandey,
Rowtu Srinu,
Paritosh Meihar,
Shubham Patil,
Sandip Lashkare,
Udayan Ganguly
Abstract:
Ferroelectricity in sputtered undoped-HfO$_2$ is attractive for composition control for low power and non-volatile memory and logic applications. Unlike doped HfO$_2$, evolution of ferroelectricity with annealing and film thickness effect in sputter deposited undoped HfO$_2$ on Si is not yet reported. In present study, we have demonstrated the impact of post metallization annealing temperature and…
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Ferroelectricity in sputtered undoped-HfO$_2$ is attractive for composition control for low power and non-volatile memory and logic applications. Unlike doped HfO$_2$, evolution of ferroelectricity with annealing and film thickness effect in sputter deposited undoped HfO$_2$ on Si is not yet reported. In present study, we have demonstrated the impact of post metallization annealing temperature and film thickness on ferroelectric properties in dopant-free sputtered HfO$_2$ on Si-substrate. A rich correlation of polarization with phase, lattice constant, and crystallite size and interface reaction is observed. First, anneal temperature shows o-phase saturation beyond 600 oC followed by interface reaction beyond 700 oC to show an optimal temperature window on 600-700 oC. Second, thickness study at the optimal temperature window shows an alluring o-phase crystallite scaling with thickness till a critical thickness of 20 nm indicating that the films are completely o-phase. However, the lattice constants (volume) are high in the 15-20 nm thickness range which correlates with the enhanced value of 2Pr. Beyond 20 nm, crystallite scaling with thickness saturates with the correlated appearance of m-phase and reduction in 2Pr. The optimal thickness-temperature window range of 15-20 nm films annealed at 600-700 oC show 2Pr of ~35.5 micro-C/cm$^2$ is comparable to state-of-the-art. The robust wakeup-free endurance of ~$10^$8 cycles showcased in the promising temperature-thickness window has been identified systematically for non-volatile memory applications.
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Submitted 25 April, 2023;
originally announced April 2023.
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FeFET-based MirrorBit cell for High-density NVM storage
Authors:
Paritosh Meihar,
Rowtu Srinu,
Vivek Saraswat,
Sandip Lashkare,
Halid Mulaosmanovic,
Ajay Kumar Singh,
Stefan Dünkel,
Sven Beyer,
Udayan Ganguly
Abstract:
HfO2-based Ferroelectric field-effect transistor (FeFET) has become a center of attraction for non-volatile memory applications because of their low power, fast switching speed, high scalability, and CMOS compatibility. In this work, we show an n-channel FeFET-based Multibit memory, termed MirrorBit, which effectively doubles the chip density via programming the gradient ferroelectric polarization…
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HfO2-based Ferroelectric field-effect transistor (FeFET) has become a center of attraction for non-volatile memory applications because of their low power, fast switching speed, high scalability, and CMOS compatibility. In this work, we show an n-channel FeFET-based Multibit memory, termed MirrorBit, which effectively doubles the chip density via programming the gradient ferroelectric polarizations in the gate using an appropriate biasing scheme. We have experimentally demonstrated MirrorBit on GlobalFoundries HfO2-based FeFET devices fabricated at 28 nm bulk HKMG CMOS technology. Retention of MirrorBit states has been shown up to $10^5$ s at different temperatures. Also, the endurance is found to be more than $10^3$ cycles. A TCAD simulation is also presented to explain the origin and working of MirrorBit states based on the FeFET model calibrated using the GlobalFoundries FeFET device. We have also proposed the array-level implementation and sensing methodology of the MirrorBit memory. Thus, we have converted 1-bit FeFET into 2-bit FeFET using a particular programming scheme in existing FeFET, without needing any notable fabrication process alteration, to double the chip density for high-density non-volatile memory storage.
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Submitted 14 September, 2023; v1 submitted 6 April, 2023;
originally announced April 2023.
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Interlayer-engineered local epitaxial templating induced enhancement in polarization (2P$_r$ > 70$μ$C/cm$^2$) in Hf$_{0.5}$Zr$_{0.5}$O$_2$ thin films
Authors:
Srinu Rowtu,
Paritosh Meihar,
Adityanarayan Pandey,
Md. Hanif Ali,
Sandip Lashkare,
Udayan Ganguly
Abstract:
In this work, we report a high remnant polarization, 2Pr >70$μ$C/cm$^2$ in thermally processed atomic layer deposited Hf0.5Zr0.5O2 (HZO) film on Silicon with NH3 plasma exposed thin TiN interlayer and Tungsten (W) as a top electrode. The effect of interlayer on the ferroelectric properties of HZO is compared with standard Metal-Ferroelectric-Metal and Metal-Ferroelectric-Semiconductor structures.…
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In this work, we report a high remnant polarization, 2Pr >70$μ$C/cm$^2$ in thermally processed atomic layer deposited Hf0.5Zr0.5O2 (HZO) film on Silicon with NH3 plasma exposed thin TiN interlayer and Tungsten (W) as a top electrode. The effect of interlayer on the ferroelectric properties of HZO is compared with standard Metal-Ferroelectric-Metal and Metal-Ferroelectric-Semiconductor structures. X-Ray Diffraction shows that the Orthorhombic (o) phase increases as TiN is thinned. However, the strain in the o-phase is highest at 2 nm TiN and then relaxes significantly for the no-TiN case. HRTEM images reveal that the ultra-thin TiN acts as a seed layer for the local epitaxy in HZO potentially increasing the strain to produce a 2X improvement in the remnant polarization. Finally, the HZO devices are shown to be wake-up-free, and exhibit endurance >10^6 cycles. This study opens a pathway to achieve epitaxial ferroelectric HZO films on Si with improved memory performance.
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Submitted 1 June, 2023; v1 submitted 9 December, 2022;
originally announced December 2022.
