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Bounds on Distinguishing Separated Wires Using Magnetic Field Measurements
Authors:
Adrian Mariano,
Jacob Lenz,
Dmitro Martynowych,
Christopher Miller,
Sean Oliver
Abstract:
Magnetic current imaging (MCI) is useful for non-destructive characterization of microelectronics, including both security analysis and failure analysis, because magnetic fields penetrate the materials that comprise these components to enable through-package imaging of chip activity. Of particular interest are new capabilities offered by emerging magnetic field imagers, such as the Quantum Diamond…
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Magnetic current imaging (MCI) is useful for non-destructive characterization of microelectronics, including both security analysis and failure analysis, because magnetic fields penetrate the materials that comprise these components to enable through-package imaging of chip activity. Of particular interest are new capabilities offered by emerging magnetic field imagers, such as the Quantum Diamond Microscope, which provide simultaneous wide field-of-view, high spatial resolution vector magnetic field imaging capabilities under ambient conditions. While MCI offers several advantages for non-destructive measurement of microelectronics functional activity, there are many limitations of the technique due to rapid falloff of magnetic fields and loss of high frequency spatial information at large sensor standoff distances. To understand spatial resolution as a function of standoff distance, we consider the problem of using magnetic fields to distinguish (1) between a single wire carrying current $I$ and a pair of wires carrying current $I/2$ in the same direction and (2) between no currents and a pair of wires carrying current $I/2$ in opposite directions. In both cases, we compare performance for a single point measurement, representative of typical magnetometers, to performance for an array of measurements found in emerging magnetic imaging devices. Additionally, we examine the advantage provided by measurement of the full vector magnetic field compared to measurement of a single component. We establish and compare for the first time the theoretical lower bounds on separability based on the wire separation and sensor standoff distance of the magnetic field measurements obtained from traditional and new microelectronics reliability tools.
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Submitted 21 May, 2024;
originally announced May 2024.
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Hardware Trojan Detection Potential and Limits with the Quantum Diamond Microscope
Authors:
Jacob N. Lenz,
Scott K. Perryman,
Dmitro J. Martynowych,
David A. Hopper,
Sean M. Oliver
Abstract:
The Quantum Diamond Microscope (QDM) is an instrument with a demonstrated capability to image electrical current in integrated circuits (ICs), which shows promise for detection of hardware Trojans. The anomalous current activity caused by hardware Trojans manifests through a magnetic field side channel that can be imaged with the QDM, potentially allowing for detection and localization of the effe…
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The Quantum Diamond Microscope (QDM) is an instrument with a demonstrated capability to image electrical current in integrated circuits (ICs), which shows promise for detection of hardware Trojans. The anomalous current activity caused by hardware Trojans manifests through a magnetic field side channel that can be imaged with the QDM, potentially allowing for detection and localization of the effects of tampering. This paper seeks to identify the capabilities of the QDM for hardware Trojan detection through the analysis of previous QDM work as well as QDM physical limits and potential Trojan behaviors. QDM metrics of interest are identified, such as spatial resolution, sensitivity, time-to-result, and field-of-view. Rare event detection on an FPGA is demonstrated with the QDM. The concept of operations is identified for QDM utilization at different steps of IC development, noting necessary considerations and limiting factors for use at different development stages. Finally, the effects of hardware Trojans on IC current activity are estimated and compared to QDM sensitivities to project QDM detection potential for ICs of varying process sizes.
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Submitted 12 February, 2024;
originally announced February 2024.
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Vector Magnetic Current Imaging of an 8 nm Process Node Chip and 3D Current Distributions Using the Quantum Diamond Microscope
Authors:
Sean M. Oliver,
Dmitro J. Martynowych,
Matthew J. Turner,
David A. Hopper,
Ronald L. Walsworth,
Edlyn V. Levine
Abstract:
The adoption of 3D packaging technology necessitates the development of new approaches to failure electronic device analysis. To that end, our team is develo** a tool called the quantum diamond microscope (QDM) that leverages an ensemble of nitrogen vacancy (NV) centers in diamond, achieving vector magnetic imaging with a wide field-of-view and high spatial resolution under ambient conditions. H…
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The adoption of 3D packaging technology necessitates the development of new approaches to failure electronic device analysis. To that end, our team is develo** a tool called the quantum diamond microscope (QDM) that leverages an ensemble of nitrogen vacancy (NV) centers in diamond, achieving vector magnetic imaging with a wide field-of-view and high spatial resolution under ambient conditions. Here, we present the QDM measurement of 2D current distributions in an 8-nm flip chip IC and 3D current distributions in a multi-layer PCB. Magnetic field emanations from the C4 bumps in the flip chip dominate the QDM measurements, but these prove to be useful for image registration and can be subtracted to resolve adjacent current traces in the die at the micron scale. Vias in 3D ICs display only Bx and By magnetic fields due to their vertical orientation and are difficult to detect with magnetometers that only measure the Bz component (orthogonal to the IC surface). Using the multi-layer PCB, we show that the QDM's ability to simultaneously measure Bx, By, and Bz is advantageous for resolving magnetic fields from vias as current passes between layers. We also show how spacing between conducting layers is determined by magnetic field images and how it agrees with the design specifications of the PCB. In our initial efforts to provide further z-depth information for current sources in complex 3D circuits, we show how magnetic field images of individual layers can be subtracted from the magnetic field image of the total structure. This allows for isolation of signal layers and can be used to map embedded current paths via solution of the 2D magnetic inverse. In addition, the paper also discusses the use of neural networks to identify 2D current distributions and its potential for analyzing 3D structures.
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Submitted 16 February, 2022;
originally announced February 2022.
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Multi-frame Interferometric Imaging with a Femtosecond Stroboscopic Pulse Train for Observing Irreversible Phenomena
Authors:
Dmitro Martynowych,
David Veysset,
Alexei A. Maznev,
Yuchen Sun,
Steven E. Kooi,
Keith. A. Nelson
Abstract:
We describe a high-speed single-shot multi-frame interferometric imaging technique enabling multiple interferometric images with femtosecond exposure time over a 50 ns event window to be recorded following a single laser-induced excitation event. The stroboscopic illumination of a framing camera is made possible through the use of a doubling cavity which produces a femtosecond pulse train that is…
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We describe a high-speed single-shot multi-frame interferometric imaging technique enabling multiple interferometric images with femtosecond exposure time over a 50 ns event window to be recorded following a single laser-induced excitation event. The stroboscopic illumination of a framing camera is made possible through the use of a doubling cavity which produces a femtosecond pulse train that is synchronized to the gated exposure windows of the individual frames of the camera. The imaging system utilizes a Michelson interferometer to extract phase and ultimately displacement information. We demonstrate the method by monitoring laser-induced deformation and the propagation of high-amplitude acoustic waves in a silicon nitride membrane. The method is applicable to a wide range of fast irreversible phenomena such as crack branching, shock-induced material damage, cavitation and dielectric breakdown.
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Submitted 11 March, 2020; v1 submitted 27 November, 2019;
originally announced November 2019.
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Pressure-Thresholded Response in Cylindrically Shocked Cyclotrimethylene Trinitramine (RDX)
Authors:
Leora E. Dresselhaus-Cooper,
Dmitro Martynowych,
Fan Zhang,
Charlene Tsay,
Jan Ilavsky,
SuYin Grass Wang,
Yu-Sheng Chen,
Keith A. Nelson
Abstract:
We demonstrate a strongly thresholded response in cyclotrimethylene trinitramine (RDX) when it is cylindrically shocked using a novel waveguide geometry. Using ultrafast single-shot multi-frame imaging, we demonstrate that <100-μm diameter single crystals of RDX embedded in a polymer host deform along preferential planes for >100 ns after the shock first arrives in the crystal. We use in-situ imag…
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We demonstrate a strongly thresholded response in cyclotrimethylene trinitramine (RDX) when it is cylindrically shocked using a novel waveguide geometry. Using ultrafast single-shot multi-frame imaging, we demonstrate that <100-μm diameter single crystals of RDX embedded in a polymer host deform along preferential planes for >100 ns after the shock first arrives in the crystal. We use in-situ imaging and time-resolved photoemission to demonstrate that short-lived chemistry occurs with complex deformation pathways. Using scanning electron microscopy and ultrasmall-angle X-ray scattering, we demonstrate that the shock-induced dynamics leave behind porous crystals, with pore shapes and sizes that change significantly with shock energy. A threshold pressure of ~ 12 GPa at the center of convergence separated the single-mode planar crystal deformations from the chemistry-coupled multi-plane dynamics at higher pressures. Our observations indicate preferential directions for deformation for our cylindrically shocked system, despite the applied stress along many different crystallographic planes.
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Submitted 3 February, 2020; v1 submitted 10 August, 2019;
originally announced August 2019.
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Development of Single-Shot Multi-Frame Imaging of Cylindrical Shock Waves in a Multi-Layered Assembly
Authors:
Leora Dresselhaus-Cooper,
Joshua E. Gorfain,
Chris T. Key,
Benjamin K. Ofori-Okai,
Suzanne J. Ali,
Dmitro J. Martynowych,
Arianna Gleason,
Steven Kooi,
Keith A. Nelson
Abstract:
We demonstrate single-shot multi-frame imaging of quasi-2D cylindrically converging shock waves as they propagate through a multi-layer target sample assembly. We visualize the shock with sequences of up to 16 images, using a Fabry-Perot cavity to generate a pulse train that can be used in various imaging configurations. We employ multi-frame shadowgraph and dark-field imaging to measure the ampli…
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We demonstrate single-shot multi-frame imaging of quasi-2D cylindrically converging shock waves as they propagate through a multi-layer target sample assembly. We visualize the shock with sequences of up to 16 images, using a Fabry-Perot cavity to generate a pulse train that can be used in various imaging configurations. We employ multi-frame shadowgraph and dark-field imaging to measure the amplitude and phase of the light transmitted through the shocked target. Single-shot multi-frame imaging tracks geometric distortion and additional features in our images that were not previously resolvable in this experimental geometry. Analysis of our images, in combination with simulations, shows that the additional image features are formed by a coupled wave structure resulting from interface effects in our targets. This technique presents a new capability for tabletop imaging of shock waves that can be easily extended to experiments at large-scale facilities.
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Submitted 14 November, 2017; v1 submitted 27 July, 2017;
originally announced July 2017.
