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Phonon and Thermal Properties of Quasi-Two-Dimensional FePS3 and MnPS3 Antiferromagnetic Semiconductor Materials
Authors:
Fariborz Kargar,
Ece Aytan,
Subhajit Ghosh,
Jonathan Lee,
Michael Gomez,
Yuhang Liu,
Andres Sanchez Magana,
Zahra Barani Beiranvand,
Bishwajit Debnath,
Richard Wilson,
Roger K. Lake,
Alexander A. Balandin
Abstract:
We report results of investigation of the phonon and thermal properties of the exfoliated films of layered single crystals of antiferromagnetic FePS3 and MnPS3 semiconductors. The Raman spectroscopy was conducted using three different excitation lasers with the wavelengths of 325 nm (UV), 488 nm (blue), and 633 nm (red). The resonant UV-Raman spectroscopy reveals new spectral features, which are n…
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We report results of investigation of the phonon and thermal properties of the exfoliated films of layered single crystals of antiferromagnetic FePS3 and MnPS3 semiconductors. The Raman spectroscopy was conducted using three different excitation lasers with the wavelengths of 325 nm (UV), 488 nm (blue), and 633 nm (red). The resonant UV-Raman spectroscopy reveals new spectral features, which are not detectable via visible Raman light scattering. The thermal conductivity of FePS3 and MnPS3 thin films was measured by two different techniques: the steady-state Raman optothermal and transient time-resolved magneto-optical Kerr effect. The Raman optothermal measurements provided the orientation-average thermal conductivity of FePS3 to be 1.35 W/mK at room temperature. The transient measurements revealed that the through-plane and in-plane thermal conductivity of FePS3 is 0.85 W/mK and 2.7 W/mK, respectively. The films of MnPS3 have higher thermal conductivity of 1.1 W/mK through-plane and 6.3 W/mK in-plane. The data obtained by both techniques reveal strong thermal anisotropy of the films and the dominant contribution of phonons to heat conduction. Our results are important for the proposed applications of the antiferromagnetic semiconductor thin films in spintronic devices.
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Submitted 14 August, 2019;
originally announced August 2019.
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Thermal and Electrical Properties of Hybrid Composites with Graphene and Boron Nitride Fillers
Authors:
Jacob S. Lewis,
Zahra Barani,
Andres Sanchez Magana,
Fariborz Kargar,
Alexander A. Balandin
Abstract:
We report on the thermal and electrical properties of hybrid epoxy composites with graphene and boron nitride fillers. The thicknesses, lateral dimensions, and aspect ratios of each filler material were intentionally selected for geometric similarity to one another, in contrast to prior studies that utilized dissimilar filler geometries to achieve a "synergistic" effect. We demonstrate that the el…
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We report on the thermal and electrical properties of hybrid epoxy composites with graphene and boron nitride fillers. The thicknesses, lateral dimensions, and aspect ratios of each filler material were intentionally selected for geometric similarity to one another, in contrast to prior studies that utilized dissimilar filler geometries to achieve a "synergistic" effect. We demonstrate that the electrically-conductive graphene and electrically-insulating boron nitride fillers allow one to effectively engineer the thermal and electrical conductivities of their resulting composites. By varying the constituent fraction of boron nitride to graphene in a composite with ~44% total filler loading, one can tune the thermal conductivity enhancement from a factor of x15 to x35 and increase the electrical conductivity by many orders of magnitude. The obtained results are important for the development of next-generation thermal interface materials with controllable electrical properties necessary for applications requiring either electrical grounding or insulation.
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Submitted 3 March, 2019;
originally announced March 2019.
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Graphene Composites with Dual Functionality: Electromagnetic Shielding and Thermal Management
Authors:
Fariborz Kargar,
Zahra Barani,
Michael G. Balinskiy,
Andres Sanchez Magana,
Jacob S. Lewis,
Alexander A. Balandin
Abstract:
We report on the synthesis and characterization of the epoxy-based composites with the few-layer graphene fillers, which are capable of the duel functional applications. It was found that composites with the certain types of few-layer graphene fillers reveal an efficient total electromagnetic interference shielding, SE~45 dB, in the important X-band frequency range, f=8.2 GHz - 12.4 GHz, while sim…
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We report on the synthesis and characterization of the epoxy-based composites with the few-layer graphene fillers, which are capable of the duel functional applications. It was found that composites with the certain types of few-layer graphene fillers reveal an efficient total electromagnetic interference shielding, SE~45 dB, in the important X-band frequency range, f=8.2 GHz - 12.4 GHz, while simultaneously providing the high thermal conductivity, K = 8 W/mK, which is a factor of x35 larger than that of the base matrix material. The efficiency of the dual functional application depends on the filler characteristics: thickness, lateral dimensions, aspect ratio and concentration. Graphene loading fractions above the percolation threshold allow for strong enhancement of both the electromagnetic interference shielding and heat conduction properties. Interestingly, graphene composites can block the electromagnetic energy even below the percolation threshold, remaining electrically insulating, which is an important feature for some types of thermal interface materials. The dual functionality of the graphene composites can substantially improve the electromagnetic shielding and thermal management of the airborne systems while simultaneously reducing their weight and cost.
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Submitted 9 August, 2018;
originally announced August 2018.
