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Demonstrating a long-coherence dual-rail erasure qubit using tunable transmons
Authors:
Harry Levine,
Arbel Haim,
Jimmy S. C. Hung,
Nasser Alidoust,
Mahmoud Kalaee,
Laura DeLorenzo,
E. Alex Wollack,
Patricio Arrangoiz-Arriola,
Amirhossein Khalajhedayati,
Rohan Sanil,
Hesam Moradinejad,
Yotam Vaknin,
Aleksander Kubica,
David Hover,
Shahriar Aghaeimeibodi,
Joshua Ari Alcid,
Christopher Baek,
James Barnett,
Kaustubh Bawdekar,
Przemyslaw Bienias,
Hugh Carson,
Cliff Chen,
Li Chen,
Harut Chinkezian,
Eric M. Chisholm
, et al. (88 additional authors not shown)
Abstract:
Quantum error correction with erasure qubits promises significant advantages over standard error correction due to favorable thresholds for erasure errors. To realize this advantage in practice requires a qubit for which nearly all errors are such erasure errors, and the ability to check for erasure errors without dephasing the qubit. We demonstrate that a "dual-rail qubit" consisting of a pair of…
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Quantum error correction with erasure qubits promises significant advantages over standard error correction due to favorable thresholds for erasure errors. To realize this advantage in practice requires a qubit for which nearly all errors are such erasure errors, and the ability to check for erasure errors without dephasing the qubit. We demonstrate that a "dual-rail qubit" consisting of a pair of resonantly coupled transmons can form a highly coherent erasure qubit, where transmon $T_1$ errors are converted into erasure errors and residual dephasing is strongly suppressed, leading to millisecond-scale coherence within the qubit subspace. We show that single-qubit gates are limited primarily by erasure errors, with erasure probability $p_\text{erasure} = 2.19(2)\times 10^{-3}$ per gate while the residual errors are $\sim 40$ times lower. We further demonstrate mid-circuit detection of erasure errors while introducing $< 0.1\%$ dephasing error per check. Finally, we show that the suppression of transmon noise allows this dual-rail qubit to preserve high coherence over a broad tunable operating range, offering an improved capacity to avoid frequency collisions. This work establishes transmon-based dual-rail qubits as an attractive building block for hardware-efficient quantum error correction.
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Submitted 20 March, 2024; v1 submitted 17 July, 2023;
originally announced July 2023.
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Nanocrystalline Al-Mg with extreme strength due to grain boundary do**
Authors:
Simon C. Pun,
Wenbo Wang,
Amirhossein Khalajhedayati,
Jennifer D. Schuler,
Jason R. Trelewicz,
Timothy J. Rupert
Abstract:
Nanocrystalline Al-Mg alloys are used to isolate the effect of grain boundary do** on the strength of nanostructured metals. Mg is added during mechanical milling, followed by low homologous temperature annealing treatments to induce segregation without grain growth. Nanocrystalline Al -7 at.% Mg that is annealed for 1 h at 200 °C is the strongest alloy fabricated, with a hardness of 4.56 GPa or…
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Nanocrystalline Al-Mg alloys are used to isolate the effect of grain boundary do** on the strength of nanostructured metals. Mg is added during mechanical milling, followed by low homologous temperature annealing treatments to induce segregation without grain growth. Nanocrystalline Al -7 at.% Mg that is annealed for 1 h at 200 °C is the strongest alloy fabricated, with a hardness of 4.56 GPa or approximately three times that of pure nanocrystalline Al. Micropillar compression experiments indicate a yield strength of 865 MPa and a specific strength of 329 kN m/kg, making this one of the strongest lightweight metals reported to date.
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Submitted 24 April, 2017; v1 submitted 30 November, 2016;
originally announced December 2016.
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High-temperature stability and grain boundary complexion formation in a nanocrystalline Cu-Zr alloy
Authors:
Amirhossein Khalajhedayati,
Timothy J. Rupert
Abstract:
Nanocrystalline Cu-3 at.% Zr powders with ~20 nm average grain size were created with mechanical alloying and their thermal stability was studied from 550-950 °C. Annealing drove Zr segregation to the grain boundaries, which led to the formation of amorphous intergranular complexions at higher temperatures. Grain growth was retarded significantly, with 1 week of annealing at 950 °C, or 98% of the…
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Nanocrystalline Cu-3 at.% Zr powders with ~20 nm average grain size were created with mechanical alloying and their thermal stability was studied from 550-950 °C. Annealing drove Zr segregation to the grain boundaries, which led to the formation of amorphous intergranular complexions at higher temperatures. Grain growth was retarded significantly, with 1 week of annealing at 950 °C, or 98% of the solidus temperature, only leading to coarsening of the average grain size to 54 nm. The enhanced thermal stability can be connected to both a reduction in grain boundary energy with do** as well as the precipitation of ZrC particles. High mechanical strength is retained even after these aggressive heat treatments, showing that complexion engineering may be a viable path toward the fabrication of bulk nanostructured materials with excellent properties.
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Submitted 28 August, 2015; v1 submitted 10 July, 2015;
originally announced July 2015.
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Grain boundary character distributions in nanocrystalline metals produced by different processing routes
Authors:
David B. Bober,
Amirhossein Khalajhedayati,
Mukul Kumar,
Timothy J. Rupert
Abstract:
Nanocrystalline materials are defined by their fine grain size, but details of the grain boundary character distribution should also be important. Grain boundary character distributions are reported for ball milled, sputter deposited, and electrodeposited Ni and Ni-based alloys, all with average grain sizes of ~20 nm, to study the influence of processing route. The two deposited materials had near…
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Nanocrystalline materials are defined by their fine grain size, but details of the grain boundary character distribution should also be important. Grain boundary character distributions are reported for ball milled, sputter deposited, and electrodeposited Ni and Ni-based alloys, all with average grain sizes of ~20 nm, to study the influence of processing route. The two deposited materials had nearly identical grain boundary character distributions, both marked by a Σ3 length percentage of 23-25%. In contrast, the ball milled material had only 3% Σ3-type grain boundaries and a large fraction of low angle boundaries (16%), with the remainder being predominantly random high angle (73%). These grain boundary character measurements are connected to the physical events that control their respective processing routes. Consequences for material properties are also discussed with a focus on nanocrystalline corrosion. As a whole, the results presented here show that grain boundary character distribution, which has often been overlooked in nanocrystalline metals, can vary significantly and influence material properties in profound ways.
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Submitted 9 November, 2015; v1 submitted 21 May, 2015;
originally announced May 2015.
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Disruption of Thermally-Stable Nanoscale Grain Structures by Strain Localization
Authors:
Amirhossein Khalajhedayati,
Timothy J. Rupert
Abstract:
Nanocrystalline metals with average grain sizes of only a few nanometers have recently been observed to fail through the formation of shear bands. Here, we investigate this phenomenon in nanocrystalline Ni which has had its grain structure stabilized by do** with W, with a specific focus on understanding how strain localization drives evolution of the nanoscale grain structure. Shear banding was…
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Nanocrystalline metals with average grain sizes of only a few nanometers have recently been observed to fail through the formation of shear bands. Here, we investigate this phenomenon in nanocrystalline Ni which has had its grain structure stabilized by do** with W, with a specific focus on understanding how strain localization drives evolution of the nanoscale grain structure. Shear banding was initiated with both microcompression and nanoindentation experiments, followed by site-specific transmission electron microscopy to characterize the microstructure. Grain growth and texture formation were observed inside the shear bands, which had a wide variety of thicknesses. These evolved regions have well-defined edges, which rules out local temperature rise as a possible formation mechanism. No structural evolution was found in areas away from the shear bands, even in locations where significant plastic deformation had occurred, showing that plastic strain alone is not enough to cause evolution. Rather, intense strain localization is needed to induce mechanically-driven grain growth in a thermally-stable nanocrystalline alloy.
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Submitted 3 April, 2015; v1 submitted 3 February, 2015;
originally announced February 2015.
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Emergence of localized plasticity and failure through shear banding during microcompression of a nanocrystalline alloy
Authors:
Amirhossein Khalajhedayati,
Timothy J. Rupert
Abstract:
Microcompression testing is used to probe the uniaxial stress-strain response of a nanocrystalline alloy, with an emphasis on exploring how grain size and grain boundary relaxation state impact the complete flow curve and failure behavior. The yield strength, strain hardening, strain-to-failure, and failure mode of nanocrystalline Ni-W films with mean grain sizes of 5, 15, and 90 nm are studied us…
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Microcompression testing is used to probe the uniaxial stress-strain response of a nanocrystalline alloy, with an emphasis on exploring how grain size and grain boundary relaxation state impact the complete flow curve and failure behavior. The yield strength, strain hardening, strain-to-failure, and failure mode of nanocrystalline Ni-W films with mean grain sizes of 5, 15, and 90 nm are studied using taper-free micropillars that are large enough to avoid extrinsic size effects. Strengthening is observed with grain refinement, but catastrophic failure through strain localization is found as well. Shear banding is found to cause failure, resembling the deformation of metallic glasses. Finally, we study the influence of grain boundary state by employing heat treatments that relax nonequilibrium boundary structure but leave grain size unchanged. A pronounced strengthening effect and increased strain localization is observed after relaxation in the finer grained samples.
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Submitted 22 July, 2014;
originally announced July 2014.
